首页 > 器件类别 > 模拟混合信号IC > 放大器电路

ADA4310-1ACPZ-R2

Low Cost, Dual, High Current Output Line Driver with Shutdown

器件类别:模拟混合信号IC    放大器电路   

厂商名称:ADI(亚德诺半导体)

厂商官网:https://www.analog.com

器件标准:

下载文档
ADA4310-1ACPZ-R2 在线购买

供应商:

器件:ADA4310-1ACPZ-R2

价格:-

最低购买:-

库存:点击查看

点击购买

器件参数
参数名称
属性值
Brand Name
Analog Devices Inc
是否无铅
含铅
是否Rohs认证
符合
厂商名称
ADI(亚德诺半导体)
零件包装代码
QFN
包装说明
MO-220VGGC, 16 PIN
针数
16
制造商包装代码
CP-16-23
Reach Compliance Code
unknown
ECCN代码
EAR99
放大器类型
OPERATIONAL AMPLIFIER
架构
CURRENT-FEEDBACK
标称共模抑制比
62 dB
频率补偿
YES
JESD-30 代码
S-XQCC-N16
JESD-609代码
e3
长度
4 mm
低-偏置
NO
低-失调
NO
微功率
NO
湿度敏感等级
3
标称负供电电压 (Vsup)
-6 V
功能数量
2
端子数量
16
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
UNSPECIFIED
封装代码
HVQCCN
封装等效代码
LCC16,.16SQ,25
封装形状
SQUARE
封装形式
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
包装方法
TAPE AND REEL
峰值回流温度(摄氏度)
260
功率
YES
电源
+-2.5/+-6/+5/+12 V
可编程功率
NO
认证状态
Not Qualified
座面最大高度
0.8 mm
标称压摆率
820 V/us
供电电压上限
6 V
标称供电电压 (Vsup)
6 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
NO LEAD
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽带
YES
宽度
4 mm
文档预览
Data Sheet
FEATURES
Low Cost, Dual, High Current Output
Line Driver with Shutdown
ADA4310-1
PIN CONFIGURATIONS
ADA4310-1
+V
S 1
NIC
2
OUT A
3
–IN A
4
+IN A
5
10
9
8
7
6
High speed
−3 dB bandwidth: 190 MHZ, G = +5
Slew Rate: 820 V/μs, R
LOAD
= 50 Ω
Wide output swing
20.4 V p-p differential, R
LOAD
of 100 Ω from 12 V supply
High output current
Low distortion
−95 dBc typical at 1 MHz, V
OUT
= 2 V p-p, G = +5, R
LOAD
= 50 Ω
−69 dBc typical at 10 MHz, V
OUT
= 2 V p-p, G = +5, R
LOAD
= 50 Ω
Power management and shutdown
Control inputs CMOS level compatible
Shutdown quiescent current 0.65 mA/amplifier
Adjustable low quiescent current: 3.9 mA to 7.6 mA per amp
OUT B
–IN B
+IN B
PD1
PD0
06027-001
06027-003
NOTES
1. THE EXPOSED PAD MUST BE CONNECTED
TO GROUND (ELECTRICAL CONNECTION REQUIRED).
2. NIC = NO INTERNAL CONNECTION.
Figure 1. Thermally Enhanced, 10-Lead MINI_SO_EP
14 +V
S
15 NIC
13 OUT B
12 NIC
11 −IN B
10 +IN B
9
APPLICATIONS
Home networking line drivers
Twisted pair line drivers
Power line communications
Video line drivers
ARB line drivers
I/Q channel amplifiers
NIC 1
−IN A 2
+IN A 3
GND 4
16 OUT A
ADA4310-1
PD0
8
PD1
NOTES
1. NIC = NO INTERNAL CONNECTION.
2. THE EXPOSED PAD MUST BE
CONNECTED TO GND.
–V
S
7
NIC
5
NIC
6
Figure 2. Thermally Enhanced, 4 mm × 4 mm 16-Lead LFCSP
GENERAL DESCRIPTION
The
ADA4310-1
is comprised of two high speed, current
feedback operational amplifiers. The high output current, high
bandwidth, and fast slew rate make it an excellent choice for
broadband applications requiring high linearity performance
while driving low impedance loads.
The
ADA4310-1
incorporates a power management function
that provides shutdown capabilities and/or the ability to
optimize the amplifiers quiescent current. The CMOS-
compatible, power-down control pins (PD1 and PD0) enable
the
ADA4310-1
to operate in four different modes: full power,
medium power, low power, and complete power down. In the
power-down mode, quiescent current drops to only
0.65 mA/amplifier, while the amplifier output goes to a high
impedance state.
The
ADA4310-1
is available in a thermally enhanced, 10-lead
MSOP with an exposed paddle for improved thermal conduction
and in a thermally enhanced, 4 mm × 4 mm 16-lead LFCSP.
The
ADA4310-1
is rated to work in the extended industrial
temperature range of −40°C to +85°C.
1/2
ADA4310-1
V
MID1
1/2
ADA4310-1
=
1
V
MID
V
CC –
V
EE
2
Figure 3. Typical PLC Driver Application
Rev. C
Document Feedback
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2006–2017 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
06027-002
ADA4310-1
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings ............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Typical Performance Characteristics ............................................. 7
Data Sheet
Theory of Operation ...................................................................... 10
Applications Information .............................................................. 11
Feedback Resistor Selection ...................................................... 11
Power Control Modes of Operation ........................................ 11
Exposed Thermal Pad Connections ........................................ 11
Power Line Application ............................................................. 11
Board Layout ............................................................................... 12
Power Supply Bypassing ............................................................ 12
Outline Dimensions ....................................................................... 13
Ordering Guide............................................................................... 13
REVISION HISTORY
10/2017—Rev. B to Rev. C
Restoration of Table Summary Statement, Specifications Section ... 3
5/2016—Rev. A to Rev. B
Changed CP-16-4 to CP-16-23 .................................... Throughout
Changes to Figure 1 and Figure 2 ................................................... 1
Changes to Table 2, Table 3, and Maximum Power Dissipation
Section ................................................................................................ 5
Changes to Figure 5, Figure 6, Table 5, and Table 6 ..................... 6
Updates Outline Dimensions ........................................................ 13
Changes to Ordering Guide .......................................................... 13
8/2012—Rev. 0 to Rev. A
Added EPAD Notation to Figure 5 and Figure 6 ..........................6
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guifr ........................................................... 13
8/2006—Revision 0: Initial Version
Rev. C | Page 2 of 14
Data Sheet
SPECIFICATIONS
V
S
= 12 V, ±6 V (@ T
A
= 25°C, G = +5, R
I
= 100 Ω, unless otherwise noted).
Table 1.
Parameter
DYNAMIC PERFORMANCE
−3 dB Bandwidth
Test Conditions/Comments
G = +5, V
OUT
= 0.1 V p-p, PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
G = +5, V
OUT
= 2 V p-p, R
LOAD
= 50 Ω, PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
f
C
= 1 MHz, V
OUT
= 2 V p-p, R
LOAD
= 50 Ω
PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
f
C
= 10 MHz, V
OUT
= 2 V p-p, R
LOAD
= 50 Ω
PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
f
C
= 20 MHz, V
OUT
= 2 V p-p, R
LOAD
= 50 Ω
PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
f = 100 kHz
f = 100 kHz
Min
Typ
190
140
100
820
790
750
ADA4310-1
Max
Unit
MHz
MHz
MHz
V/µs
V/µs
V/µs
Slew Rate
NOISE/DISTORTION PERFORMANCE
Distortion (Worst Harmonic)
−95
−88
−77
−69
−57
−47
−50
−42
−35
2.85
21.8
1
−2
6
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
nV/√Hz
pA/√Hz
mV
µA
µA
MΩ
MΩ
dB
kΩ
V
P
V
P
V
P
V
P
V p-p
±6
+12
V
V
mA/amp
mA/amp
mA/amp
mA/amp
Input Voltage Noise
Input Current Noise
DC PERFORMANCE
Input Offset Voltage
Input Bias Current
Noninverting Input
Inverting Input
Open-Loop Transimpedance
R
LOAD
= 50 Ω
R
LOAD
= 100 Ω
Common-Mode Rejection
INPUT CHARACTERISTICS
Input Resistance
OUTPUT CHARACTERISTICS
Single-Ended +Swing
Single-Ended −Swing
Single-Ended +Swing
Single-Ended −Swing
Differential Swing
POWER SUPPLY
Operating Range (Dual Supply)
Operating Range (Single Supply)
Supply Current
14
35
−62
500
+5.08
−5.12
+5.14
−5.17
20.4
±2.5
+5
f < 100 kHz
R
LOAD
= 50 Ω
R
LOAD
= 50 Ω
R
LOAD
= 100 Ω
R
LOAD
= 100 Ω
R
LOAD
= 100 Ω
PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
PD1 = 1, PD0 = 1
7.6
5.6
3.9
0.65
Rev. C | Page 3 of 14
ADA4310-1
Parameter
POWER DOWN PINS
PD1, PD0 Threshold
PD1, PD0 = 0 Pin Bias Current
PD1, PD0 = 1 Pin Bias Current
Enable/Disable Time
Power Supply Rejection Ratio
Test Conditions/Comments
Referenced to GND
PD1 or PD0 = 0 V
PD1 or PD0 = 3 V
Positive/Negative
Min
Typ
1.5
−0.2
70
Data Sheet
Max
Unit
V
µA
µA
µs
dB
0.04/2
−70/−60
Rev. C | Page 4 of 14
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
10-Lead MINI_SO_EP
16-Lead LFCSP
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Rating
12 V
±6V
(T
JMAX
− T
A
)/θ
JA
−65°C to +125°C
−40°C to +85°C
300°C
150°C
ADA4310-1
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 10-lead MINI_SO_EP
(44°C/W) and for the 16-lead LFCSP (63°C/W) on a JEDEC
standard 4-layer board. θ
JA
values are approximations.
5.0
4.5
MAXIMUM POWER DISSIPATION (W)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
06027-016
MINI_SO_EP-10
LFCSP_VQ-16
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, θ
JA
is
specified for device soldered in circuit board for surface-mount
packages.
Table 3.
Package Type
10-Lead MINI_SO_EP
16-Lead LFCSP
θ
JA
44
63
Unit
°C/W
°C/W
0
–35
–15
5
25
45
65
85
AMBIENT TEMPERATURE (°C)
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Maximum Power Dissipation
The maximum safe power dissipation for the
ADA4310-1
is
limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
Rev. C | Page 5 of 14
查看更多>
参数对比
与ADA4310-1ACPZ-R2相近的元器件有:ADA4310-1ACPZ-R7、ADA4310-1ACPZ-RL。描述及对比如下:
型号 ADA4310-1ACPZ-R2 ADA4310-1ACPZ-R7 ADA4310-1ACPZ-RL
描述 Low Cost, Dual, High Current Output Line Driver with Shutdown Low Cost, Dual, High Current Output Line Driver with Shutdown Low Cost, Dual, High Current Output Line Driver with Shutdown
Brand Name Analog Devices Inc Analog Devices Inc Analog Devices Inc
是否无铅 含铅 含铅 含铅
是否Rohs认证 符合 符合 符合
厂商名称 ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体)
零件包装代码 QFN QFN QFN
包装说明 MO-220VGGC, 16 PIN HVQCCN, LCC16,.16SQ,25 MO-220VGGC, 16 PIN
针数 16 16 16
制造商包装代码 CP-16-23 CP-16-23 CP-16-23
Reach Compliance Code unknown compliant unknown
ECCN代码 EAR99 EAR99 EAR99
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
架构 CURRENT-FEEDBACK CURRENT-FEEDBACK CURRENT-FEEDBACK
标称共模抑制比 62 dB 62 dB 62 dB
频率补偿 YES YES YES
JESD-30 代码 S-XQCC-N16 S-XQCC-N16 S-XQCC-N16
JESD-609代码 e3 e3 e3
长度 4 mm 4 mm 4 mm
低-偏置 NO NO NO
低-失调 NO NO NO
微功率 NO NO NO
湿度敏感等级 3 3 3
标称负供电电压 (Vsup) -6 V -6 V -6 V
功能数量 2 2 2
端子数量 16 16 16
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 HVQCCN HVQCCN HVQCCN
封装等效代码 LCC16,.16SQ,25 LCC16,.16SQ,25 LCC16,.16SQ,25
封装形状 SQUARE SQUARE SQUARE
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
包装方法 TAPE AND REEL TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 260 260
功率 YES YES YES
电源 +-2.5/+-6/+5/+12 V +-2.5/+-6/+5/+12 V +-2.5/+-6/+5/+12 V
可编程功率 NO NO NO
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 0.8 mm 0.8 mm 0.8 mm
标称压摆率 820 V/us 820 V/us 820 V/us
供电电压上限 6 V 6 V 6 V
标称供电电压 (Vsup) 6 V 6 V 6 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 NO LEAD NO LEAD NO LEAD
端子节距 0.65 mm 0.65 mm 0.65 mm
端子位置 QUAD QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽带 YES YES YES
宽度 4 mm 4 mm 4 mm
热门器件
热门资源推荐
器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
需要登录后才可以下载。
登录取消