IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO20, PLASTIC, SOL-20, Analog to Digital Converter
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
下载文档型号 | ADC0804-1LCD-T | ADC0803-1CD-T | ADC0805-1LCN | ADC0803-1LCD-T | ADC0804-1CD-T |
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描述 | IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO20, PLASTIC, SOL-20, Analog to Digital Converter | IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO20, PLASTIC, SOL-20, Analog to Digital Converter | IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDIP20, PLASTIC, DIP-20, Analog to Digital Converter | IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO20, PLASTIC, SOL-20, Analog to Digital Converter | IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO20, PLASTIC, SOL-20, Analog to Digital Converter |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SOIC | SOIC | DIP | SOIC | SOIC |
包装说明 | SOP, | SOP, | DIP, | SOP, | SOP, |
针数 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 5.05 V | 5.05 V | 5.05 V | 5.05 V | 5.05 V |
最小模拟输入电压 | -0.05 V | -0.05 V | -0.05 V | -0.05 V | -0.05 V |
最长转换时间 | 73 µs | 73 µs | 73 µs | 73 µs | 73 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
长度 | 12.5 mm | 12.5 mm | 26.695 mm | 12.5 mm | 12.5 mm |
最大线性误差 (EL) | 0.39% | 0.195% | 0.3906% | 0.195% | 0.39% |
模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | - |
输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY |
输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.1 mm | 2.1 mm | 4.06 mm | 2.1 mm | 2.1 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 5.4 mm | 5.4 mm | 7.62 mm | 5.4 mm | 5.4 mm |
最大压摆率 | 3.5 mA | 3.5 mA | - | 3.5 mA | 3.5 mA |