型号
- 型号
- 关键词
IC 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20, Analog to Digital Converter
厂商名称：National Semiconductor（TI ）
厂商官网：http://www.ti.com
下载文档| 型号 | ADC10461CIN | ADC10462CIJ | ADC10462CMJ | ADC10462CIN | ADC10464CIN | ADC10464CMJ | ADC10461CIJ | ADC10464CIJ | ADC10461CMJ |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20, Analog to Digital Converter | IC 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP24, CERDIP-24, Analog to Digital Converter | IC 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP24, CERDIP-24, Analog to Digital Converter | IC 2-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP24, 0.600 INCH, PLASTIC, DIP-24, Analog to Digital Converter | IC 4-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Analog to Digital Converter | IC 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, CERDIP-28, Analog to Digital Converter | IC 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, CERDIP-20, Analog to Digital Converter | IC 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, CERDIP-28, Analog to Digital Converter | IC 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, CERDIP-20, Analog to Digital Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP20,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP20,.3 | DIP, DIP28,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | 3A001.A.2.C |
| 最大模拟输入电压 | 5.05 V | 6.3 V | 6.3 V | 5.05 V | 5.05 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V |
| 最小模拟输入电压 | -0.3 V | -0.3 V | -0.3 V | -0.3 V | -0.3 V | -0.3 V | -0.3 V | -0.3 V | -0.3 V |
| 最长转换时间 | 1.4 µs | 0.85 µs | 0.85 µs | 1.4 µs | 1.4 µs | 0.85 µs | 0.85 µs | 0.85 µs | 0.85 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T20 | R-GDIP-T24 | R-GDIP-T24 | R-PDIP-T24 | R-PDIP-T28 | R-GDIP-T28 | R-GDIP-T20 | R-GDIP-T28 | R-GDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 24 | 24 | 24 | 28 | 28 | 20 | 28 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP20,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP28,.3 | DIP28,.3 | DIP20,.3 | DIP28,.3 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.8 MHz | 0.8 MHz | 0.8 MHz | 0.8 MHz | 0.8 MHz | 0.8 MHz | 0.8 MHz | 0.8 MHz | 0.8 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 5.08 mm | 4.572 mm | 4.572 mm | 5.334 mm | 5.334 mm | 5.715 mm | 5.08 mm | 5.715 mm | 5.08 mm |
| 最大压摆率 | 45 mA | 45 mA | 45 mA | 45 mA | 45 mA | 45 mA | 45 mA | 45 mA | 45 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 7.62 mm | 15.24 mm | 7.62 mm |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 长度 | 26.075 mm | - | - | 31.915 mm | 35.725 mm | 36.83 mm | 24.51 mm | 36.83 mm | 24.51 mm |
| 模拟输入通道数量 | 1 | 2 | 2 | 2 | 4 | 4 | - | 4 | - |