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ADG1233YRUZ

1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO16, LEAD FREE, MO-153AB, TSSOP-16

器件类别:模拟混合信号IC    信号电路   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Rochester Electronics
零件包装代码
TSSOP
包装说明
TSSOP,
针数
16
Reach Compliance Code
unknown
其他特性
ALSO OPERATES AT 12V SINGLE SUPPLY
模拟集成电路 - 其他类型
SPDT
JESD-30 代码
R-PDSO-G16
JESD-609代码
e3
长度
5 mm
湿度敏感等级
1
负电源电压最大值(Vsup)
-16.5 V
负电源电压最小值(Vsup)
-13.5 V
标称负供电电压 (Vsup)
-15 V
信道数量
1
功能数量
1
端子数量
16
标称断态隔离度
80 dB
通态电阻匹配规范
3.5 Ω
最大通态电阻 (Ron)
190 Ω
最高工作温度
125 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
座面最大高度
1.2 mm
最大供电电压 (Vsup)
16.5 V
最小供电电压 (Vsup)
13.5 V
标称供电电压 (Vsup)
15 V
表面贴装
YES
最长断开时间
45 ns
最长接通时间
140 ns
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
MATTE TIN
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
4.4 mm
文档预览
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Low Capacitance, Triple/Quad SPDT
±15 V/+12 V
i
CMOS™ Switches
ADG1233/ADG1234
FEATURES
1.5 pF off capacitance
0.5 pC charge injection
33 V supply range
120 Ω on resistance
Fully specified at ±15 V/+12 V
3 V logic-compatible inputs
Rail-to-rail operation
Break-before-make switching action
16-lead TSSOP, 20-lead TSSOP, and 4 mm × 4 mm LFCSP
Typical power consumption (<0.03 μW)
FUNCTIONAL BLOCK DIAGRAMS
ADG1233
S1A
D1
S1B
S3B
D3
S3A
S2B
D2
S2A
LOGIC
IN1 IN2 IN3 EN
SWITCHES SHOWN FOR A LOGIC 1 INPUT
Audio and video routing
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Communication systems
Figure 1.
ADG1234
S1A
D1
S1B
S4A
D4
S4B
GENERAL DESCRIPTION
The ADG1233 and ADG1234 are monolithic
iCMOS
analog
switches comprising three independently selectable single-pole,
double throw SPDT switches and four independently selectable
SPDT switches, respectively.
All channels exhibit break-before-make switching action
preventing momentary shorting when switching channels.
An EN input on the ADG1233 and ADG1234 is used to
enable or disable the device. When disabled, all channels are
switched off.
The
iCMOS
(industrial-CMOS) modular manufacturing process
combines a high voltage complementary metal-oxide semi-
conductor (CMOS) and bipolar technologies. It enables the
development of a wide range of high performance analog ICs
capable of 33 V operation in a footprint that no other generation of
high voltage parts has been able to achieve. Unlike analog ICs
using conventional CMOS processes,
iCMOS
components can
tolerate high supply voltages while providing increased perfor-
mance, dramatically lowered power consumption, and reduced
package size.
The ultralow capacitance and charge injection of these multiplexers
make them ideal solutions for data acquisition and sample-and-
hold applications, where low glitch and fast settling are required.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
S2B
D2
S2A
LOGIC
S3B
D3
S3A
IN1 IN2 IN3 IN4 EN
SWITCHES SHOWN FOR A LOGIC 1 INPUT
Figure 2.
Fast switching speed coupled with high signal bandwidth make the
parts suitable for video signal switching.
iCMOS
construction
ensures ultralow power dissipation, making the parts ideally
suited for portable and battery-powered instruments.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
1.5 pF off capacitance (±15 V supply).
0.5 pC charge injection.
3 V logic-compatible digital input, V
IH
= 2.0 V, V
IL
= 0.8 V.
16-lead TSSOP, 20-lead TSSOP, and 4 mm × 4 mm LFCSP.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2006–2009 Analog Devices, Inc. All rights reserved.
05743-038
05743-001
APPLICATIONS
ADG1233/ADG1234
TABLE OF CONTENTS
Features .............................................................................................. 1
 
Applications ....................................................................................... 1
 
General Description ......................................................................... 1
 
Functional Block Diagrams ............................................................. 1
 
Product Highlights ........................................................................... 1
 
Revision History ............................................................................... 2
 
Specifications..................................................................................... 3
 
Dual Supply ................................................................................... 3
 
Single Supply ................................................................................. 5
 
Absolute Maximum Ratings ............................................................7
 
ESD Caution...................................................................................7
 
Pin Configurations and Function Descriptions ............................8
 
Terminology .......................................................................................9
 
Typical Performance Characteristics ........................................... 10
 
Test Circuits ..................................................................................... 13
 
Outline Dimensions ....................................................................... 15
 
Ordering Guide .......................................................................... 16
 
REVISION HISTORY
2/09—Rev.
A to Rev. B
Change to I
DD
Parameter, Table 1 ................................................... 4
Change to I
DD
Parameter, Table 2 ................................................... 6
Updated Outline Dimensions ....................................................... 16
8/06—Rev. 0 to Rev. A
Updated Format…………………………….….…………Universal
Changes to Table 1…………………………………………….…...3
Changes to Table 2………………………………………………....4
Changes to Figure 11……………………..………………………10
Changes to Figure 12……………………………………………..11
1/06—Revision 0: Initial Version
Rev. B | Page 2 of 16
ADG1233/ADG1234
SPECIFICATIONS
DUAL SUPPLY
V
DD
= +15 V ± 10%, V
SS
= −15 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (R
ON
)
On Resistance Match Between
Channels (∆R
ON
)
On Resistance Flatness (R
FLAT (ON)
)
LEAKAGE CURRENTS
Source Off Leakage I
S
(Off )
Drain Off Leakage I
D
(Off )
+25°C
Y Version
1
−40°C to +85°C −40°C to +125°C
V
SS
to V
DD
120
190
3.5
6
20
60
±0.02
±0.1
±0.02
±0.1
±0.02
±0.2
230
260
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
nA typ
nA max
nA typ
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
ns typ
ns max
ns typ
ns min
ns typ
ns max
ns typ
ns max
pC typ
dB typ
dB typ
% typ
MHz typ
pF typ
pF max
pF typ
pF max
pF typ
pF max
Rev. B | Page 3 of 16
Test Conditions/Comments
V
S
= ±10 V, I
S
= −1 mA; see Figure 24
V
DD
= +13.5 V, V
SS
= −13.5 V
V
S
= ±10 V, I
S
= −1 mA
10
72
12
79
V
S
= −5 V, 0 V, +5 V; I
S
= −1 mA
V
DD
= +16.5 V, V
SS
= −16.5 V
V
D
= ±10 V, V
S
= −10 V; see Figure 25
V
S
= 1 V/10 V, V
D
= 10 V/1 V;
see Figure 25
V
S
= V
D
= ±10 V; see Figure 26
±0.6
±1
±0.6
±0.6
±1
±1
2.0
0.8
Channel On Leakage I
D,
I
S
(On)
DIGITAL INPUTS
Input High Voltage, V
INH
Input Low Voltage, V
INL
Input Current
I
INL
or I
INH
Digital Input Capacitance, C
IN
DYNAMIC CHARACTERISTICS
2
t
TRANSITION
t
BBM
t
ON
(EN)
t
OFF
(EN)
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion, THD + N
−3 dB Bandwidth
C
S
(Off )
C
D
(Off )
C
D
, C
S
(On)
±0.005
±0.1
3
110
130
25
120
140
40
45
0.5
−80
−85
0.14
900
1.5
1.7
1.6
1.8
3.5
4
V
IN
= V
INL
or V
INH
150
170
10
170
55
195
60
R
L
= 300 Ω, C
L
= 35 pF
V
S
= 10 V; see Figure 27
R
L
= 300 Ω, C
L
= 35 pF
V
S1
= V
S2
= +10 V; see Figure 28
R
L
= 300 Ω, C
L
= 35 pF
V
S
= 10 V; see Figure 29
R
L
= 300 Ω, C
L
= 35 pF
V
S
= 10 V; see Figure 29
V
S
= 0 V, R
S
= 0 Ω, C
L
= 1 nF;
see Figure 30
R
L
= 50 Ω, C
L
= 5 pF, f = 1 MHz; see
Figure 31
R
L
= 50 Ω, C
L
= 5 pF, f = 1 MHz;
see Figure 33
R
L
= 10 kΩ, 5 V rms, f = 20 Hz to
20
kHz; see Figure 34
R
L
= 50 Ω, C
L
= 5 pF; see Figure 32
f = 1 MHz; V
S
= 0 V
f = 1 MHz; V
S
= 0 V
f = 1 MHz; V
S
= 0 V
f = 1 MHz; V
S
= 0 V
f = 1 MHz; V
S
= 0 V
f = 1 MHz; V
S
= 0 V
ADG1233/ADG1234
Parameter
POWER REQUIREMENTS
I
DD
I
DD
I
SS
I
SS
V
DD
/V
SS
1
2
+25°C
0.002
Y Version
1
−40°C to +85°C −40°C to +125°C
Unit
μA typ
μA max
μA typ
μA max
μA typ
μA max
μA typ
μA max
V min/max
Test Conditions/Comments
V
DD
= +16.5 V, V
SS
= −16.5 V
Digital inputs = 0 V or V
DD
Digital inputs = 5 V
Digital inputs = 0 V or V
DD
Digital inputs = 5 V
GND = 0 V
1.0
260
475
0.002
1.0
0.002
1.0
±5/±16.5
Temperature range for the Y version: −40°C to +125°C.
Guaranteed by design, not subject to production test.
Rev. B | Page 4 of 16
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参数对比
与ADG1233YRUZ相近的元器件有:ADG1233YCPZ-REEL7、ADG1234YRUZ、ADG1234YCPZ-REEL7。描述及对比如下:
型号 ADG1233YRUZ ADG1233YCPZ-REEL7 ADG1234YRUZ ADG1234YCPZ-REEL7
描述 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO16, LEAD FREE, MO-153AB, TSSOP-16 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, QCC16, 4 X 4 MM, LEAD FREE, MO-220VGGC, LFCSP-16 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO20, LEAD FREE, MO-153AC, TSSOP-20 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, QCC20, 4 X 4 MM, LEAD FREE, MO-220VGGD-1, LFCSP-20
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
零件包装代码 TSSOP QFN TSSOP QFN
包装说明 TSSOP, HVQCCN, TSSOP, HVQCCN,
针数 16 16 20 20
Reach Compliance Code unknown unknown unknown unknown
其他特性 ALSO OPERATES AT 12V SINGLE SUPPLY ALSO OPERATES AT 12V SINGLE SUPPLY ALSO OPERATES AT 12V SINGLE SUPPLY ALSO OPERATES AT 12V SINGLE SUPPLY
模拟集成电路 - 其他类型 SPDT SPDT SPDT SPDT
JESD-30 代码 R-PDSO-G16 S-XQCC-N16 R-PDSO-G20 S-XQCC-N20
JESD-609代码 e3 e3 e3 e3
长度 5 mm 4 mm 6.5 mm 4 mm
湿度敏感等级 1 3 1 3
负电源电压最大值(Vsup) -16.5 V -16.5 V -16.5 V -16.5 V
负电源电压最小值(Vsup) -13.5 V -13.5 V -13.5 V -13.5 V
标称负供电电压 (Vsup) -15 V -15 V -15 V -15 V
信道数量 1 1 1 1
功能数量 1 1 1 1
端子数量 16 16 20 20
标称断态隔离度 80 dB 80 dB 80 dB 80 dB
通态电阻匹配规范 3.5 Ω 3.5 Ω 3.5 Ω 3.5 Ω
最大通态电阻 (Ron) 190 Ω 190 Ω 190 Ω 190 Ω
最高工作温度 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED
封装代码 TSSOP HVQCCN TSSOP HVQCCN
封装形状 RECTANGULAR SQUARE RECTANGULAR SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) 260 260 260 260
座面最大高度 1.2 mm 1 mm 1.2 mm 1 mm
最大供电电压 (Vsup) 16.5 V 16.5 V 16.5 V 16.5 V
最小供电电压 (Vsup) 13.5 V 13.5 V 13.5 V 13.5 V
标称供电电压 (Vsup) 15 V 15 V 15 V 15 V
表面贴装 YES YES YES YES
最长断开时间 45 ns 45 ns 45 ns 45 ns
最长接通时间 140 ns 140 ns 140 ns 140 ns
技术 CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING NO LEAD GULL WING NO LEAD
端子节距 0.65 mm 0.65 mm 0.65 mm 0.5 mm
端子位置 DUAL QUAD DUAL QUAD
处于峰值回流温度下的最长时间 40 40 40 40
宽度 4.4 mm 4 mm 4.4 mm 4 mm
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