Conversion Time (Analog Input or Internal Temperature)
4
Conversion Time (External Temperature)
4
Input Resistance (2.5 V, 3.3 V, 5 V, 12 V, V
CCPIN
)
OPEN-DRAIN DIGITAL OUTPUT ADD/RST/INT/NTO
Output Low Voltage, V
OL
High Level Output Leakage Current, I
OH
RST Pulsewidth
OPEN-DRAIN SERIAL DATABUS OUTPUT (SDA)
Output Low Voltage, V
OL
High Level Output Leakage Current, I
OH
SERIAL BUS DIGITAL INPUTS (SCL, SDA)
Input High Voltage, V
IH
Input Low Voltage, V
IL
Hysteresis
DIGITAL INPUT LOGIC LEVELS (ADD, VID0–VID4, NTI)
5
VID0–VID3 Input Resistance
VID4 Input Resistance
Input High Voltage, V
IH6
Input Low Voltage, V
IL6
DIGITAL INPUT LEAKAGE CURRENT
Input High Current, I
IH
Input Low Current, I
IL
Input Capacitance, C
IN
Min
3.0
Typ
3.30
1.4
32
Max
5.5
2.5
500
±3
1
±5
±3
1
180
11
Unit
V
mA
μA
°C
°C
°C
°C
°C
μA
μA
ADM1025/ADM1025A
Test Conditions/Comments
Interface Inactive, ADC Active
Standby Mode
60°C ≤ T
A
≤ 100°C; V
CC
= 3.3 V
High Level
Low Level
±2
±1
±1
11.6
34.8
140
80
250
0.4
1
45
0.4
1
%
LSB
%/V
ms
ms
kΩ
V
μA
ms
V
μA
V
V
mV
kΩ
kΩ
kΩ
V
V
μA
μA
pF
ADM1025 Only
ADM1025 Only
ADM1025A
I
OUT
= −6.0 mA; V
CC
= 3 V
V
OUT
= V
CC
; V
CC
= 3 V
0.1
20
0.1
2.1
I
OUT
= –6.0 mA; V
CC
= 3 V
V
OUT
= V
CC
0.8
500
100
300
100
2.1
0.8
−1
+1
5
V
IN
= V
CC
V
IN
= 0
Rev. P5 | Page 3 of 21| www.onsemi.com
ADM1025/ADM1025A
Parameter
SERIAL BUS TIMING
Clock Frequency, f
SCLK
Glitch Immunity, t
SW
Bus Free Time, t
BUF
Start Setup Time, t
SU:STA
Start Hold Time, t
HD:STA
Stop Condition Setup Time, t
SU:STO
SCL Low Time, t
LOW
SCL High Time, t
HIGH
SCL, SDA Rise Time, t
R
SCL, SDA Fall Time, t
F
Data Setup Time, t
SU:DAT
Data Hold Time, t
HD:DAT
1
2
Preliminary Technical Data
Min
Typ
Max
400
50
1.3
600
600
600
1.3
0.6
300
300
100
300
Unit
kHz
ns
μs
ns
ns
ns
μs
μs
ns
ns
ns
ns
Test Conditions/Comments
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
All voltages are measured with respect to GND, unless otherwise specified.
Typicals are at T
A
= 25°C and represent most likely parametric norm. Shutdown current typ is measured with V
CC
= 3.3 V.
3
TUE (Total Unadjusted Error) includes Offset, Gain, and Linearity errors of the ADC, multiplexer, and on-chip input attenuators, including an external series input
protection resistor value between zero and 1 kΩ.
4
Total monitoring cycle time is nominally 114.4 ms. Monitoring Cycle consists of 6 Voltage + 1 Internal Temperature + 1 External Temperature readings.
5
ADD is a three-state input that may be pulled high, low, or left open-circuit.
6
Timing specifications are tested at logic levels of V
IL
= 0.8 V for a falling edge and V
IH
= 2.2 V for a rising edge.
Rev. P5 | Page 4 of 21| www.onsemi.com
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Positive Supply Voltage (V
CC
)
Voltage on 12 V V
IN
Pin
Voltage on Any Input or Output Pin
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (T
J
max)
Storage Temperature Range
Lead Temperature, Soldering
Vapor Phase 60 sec
Infrared 15 sec
ESD Rating All Pins
Rating
6.5 V
20 V
−0.3 V to +6.5 V
±5 mA
±20 mA
150°C
–65°C to +150°C
215°C
200°C
2000 V
ADM1025/ADM1025A
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
