PF (ADP1)
PRECISION
SEMICONDUCTOR
PRESSURE SENSOR
•
A wide range of rated pressure,
including a minute pressure
There are 10 types of sensors covering a
wide range of rated pressure from a
minute pressure between 4.9 kPa {0.05
kgf/cm
2
}, to a maximum pressure of
980.7 kPa {10 kgf/cm
2
}.
•
Realization of highly accurate, linear
characteristics
This sensor employs a semiconductor
strain gauge method, ensuring accurate
and linear detection characteristics. It
also has excellent repeatability of pres-
sure characteristics.
• Impressive line-up of models
• Taking their place alongside the stan-
dard 5kΩ bridge resistance models are
those with a 3.3kΩ resistance which is
optimally suited to 5V drive circuits.
• Economy model (no glass base) gives
outstanding value for consumer appli-
ances
40 kPa (0.4 kgf/cm
2
) and 49 kPa (0.5
kgf/cm
2
) units are also available.
PF PRESSURE
SENSOR
Example of pressure characteristics
(when the rated pressure is between 98.1 kPa
{1.0 kgf/cm
2
}
Drive current: 1.5 mA rated current; ambient temperature: 25°C
77°F
100
Output voltage, mV
50
<Cross-section of Sensor Chip>
Silicon
Piezo resistance
strain gauge
Anode
junction
Pressure
Glass
base
0
0 {0}
49 {0.5}
98.1 {1}
Pressure (gauge pressure), (kPa {kgf/cm
2
})
TYPICAL
APPLICATIONS
• Medical equipment: Electronic hemody-
namometer
• Home appliance: Vacuum cleaner
• Gas equipment: Microprocessor gas
meter, gas leakage detector
• Industrial equipment: Absorption
device, etc.
Highly reliable wire
bonding technology
Pressure
High reliability
die bonding
technology
Very strong,
heat resistant body
ORDERING INFORMATION
Ex. ADP
Part No.
Terminal profile and direction
1: DIP terminal: Dirtection opposite the
pressure inlet direction
0:
1:
2:
3:
4:
5:
6:
7:
8:
9:
A:
1
Rated pressure
4.9 kPa
14.7 kPa
34.3 kPa
49.0 kPa
98.1 kPa
196.1 kPa
343.2 kPa
490.3 kPa
833.6 kPa
980.7 kPa
40.0 kPa
{approx. 0.05 kgf/cm }
{approx. 0.15 kgf/cm
2
}
{approx. 0.35 kgf/cm
2
}
{approx. 0.5 kgf/cm
2
}
{approx. 1.0 kgf/cm
2
}
{approx. 2.0 kgf/cm
2
}
{approx. 3.5 kgf/cm
2
}
{approx. 5.0 kgf/cm
2
}
{approx. 8.5 kgf/cm
2
}
{approx. 10.0 kgf/cm
2
}
{approx. 0.4 kgf/cm
2
}
2
ADP1:
PF pressure sensor
2: DIP terminal: Pressure inlet direction
Type
1 : Standard type
(With glass base)
2: Economy type
(Without glass
base)
Bridge resistance
Nil : 5.0kΩ
3 : 3.3kΩ
Bridge resistance
Terminal
Pressure
DIP terminal:
Direction opposite
the pressure
inlet direction
ADP1101
ADP1111
ADP1121
ADP1131
ADP1141
ADP1151
ADP1161
ADP1171
ADP1181
ADP1191
——
ADP1132
5.0kΩ
DIP terminal:
Pressure inlet
direction
ADP1201
ADP1211
ADP1221
ADP1231
ADP1241
ADP1251
ADP1261
ADP1271
ADP1281
ADP1291
——
ADP1232
DIP terminal:
Direction opposite
the pressure
inlet direction
——
——
——
——
——
——
——
——
——
——
ADP11A23
——
3.3kΩ
DIP terminal:
Pressure inlet
direction
——
——
——
——
——
——
——
——
——
——
ADP12A23
——
Packing quantity
Inner
Outer
4.9kPa approx. 0.05kgf/cm
2
14.7kPa approx. 0.15kgf/cm
2
34.3kPa approx. 0.35kgf/cm
49.0kPa
Standard
98.1kPa
type
(With glass 196.1kPa
base)
343.2kPa
approx. 0.5kgf/cm
2
approx. 1.0kgf/cm
approx. 3.5kgf/cm
2
2
approx. 2.0kgf/cm
2
2
100
pcs.
1,000
pcs.
490.3kPa approx. 5.0kgf/cm
2
833.6kPa approx. 8.5kgf/cm
Economy type
(Without glass
base)
40.0kPa approx. 0.4kgf/cm
2
980.7kPa approx. 10.0kgf/cm
2
2
49.0kPa approx. 0.5kgf/cm
2
PF (ADP1)
SPECIFICATIONS
Type
Type of pressure
Pressure medium
Unit: kPa
Rated
pressure Unit: kgf/cm
2
(approx.)
Max. applied pressure
Bridge resistance
Ambient temperature
Storage temperature
Temperature compensation range
Drive current (constant current)
Output span voltage
Offset voltage
Linearity
Pressure hysteresis
Offset voltage-temperature
characteristics (0 to 50°C
32 to 122°F)
Sensitivity-temperature
characteristics (0 to 50°C
32 to 122°F)
40±20 mV
±0.7%FS ±0.5%FS
±0.6%FS ±0.4%FS
±15%FS
±10%FS
Standard type (With glass base)
(Without glass base)
Gauge pressure
Air (For other medium, please consult us.)
34.3
49.0
98.1
196.1
343.2
490.3
833.6
980.7
40.0
49.0
0.35
0.5
1.0
2.0
3.5
5.0
8.5
10.0
0.4
0.5
Twice the rated pressure
1.5 times the rated pressure Twice the rated pressure
5000±1000
Ω
3300±600
Ω
5000±1000
Ω
–5 to 50°C –20 to 100°C
–20 to 100°C
–4 to 212°F
(no freezing or condensation)
–7 to 122°F –4 to 212°F
–20 to 70°C –40 to 120°C
–40 to 120°C
–40 to 248°F
(no freezing or condensation)
–4 to 158°F –70 to 248°F
5 to 45°C 0 to 50°C
0 to 50°C
32 to 122°F
41 to 113°F 32 to 122°F
1.5 mA DC
100±40 mV
43.5±22.5 mV 85±45 mV
±20
mV
±15
mV
±25
mV
±0.3%FS
±0.5%FS
±0.6%FS
±0.3%FS
±0.2%FS
±0.4%FS
±0.7%FS
±5.0%FS
±2.5%FS
±10%FS
±8%FS
Economy type
4.9
0.05
14.7
0.15
±1.3%FS ±2.5%FS
Notes) 1. Unless otherwise specified, measurements were taken with a drive current of1.5 mA ±0.01 mA at a temperature of 25°C
77°F
and humidity ranging from 25% to
85%.
2. Please consult us if a pressure medium other than air is to be used.
3. This is the regulation which applies within the compensation temperature range.
4. Please consult us if the intended use involves a negative pressure.
DATA
1. Characteristics data
1-<1> Output characteristics
ADP1141
Drive current: 1.5 mA; temperature: 25°C
77°F
100
80
60
40
20
0
–20
–40
1-<2> Offset voltage – temperature
characteristics
ADP1141
Drive current: 1.5 mA; rating ±5%FS
Offset voltage – temperature characteristics (%FS)
4
3
1-<3> Sensitivity – temperature
characteristics (%FS)
ADP1141
Drive current: 1.5 mA; rating ±2.5%FS
4
Sensitivity – temperature characteristics (%FS)
3
Output voltage (mV)
2
2
1
1
0
0
–1
–1
0
49 {0.5}
kpa {kgf/cm }
2
98.1 {1}
Rated pressure
–2
0
32
25
47
50
122
Temperature (°C
°F)
–2
0
32
25
47
50
122
Temperature (°C
°F)
2. Pressure cycle range (0 to rated pressure)
Tested sample: ADP1131, temperature: 25°C
77°F
2-<1> Offset voltage range
2
2-<2> Output span voltage range
2
1
Output span voltage range (%FS)
Even after testing for 1 million times, the vari-
ations in the offset voltage and output span
voltage are minimal.
Offset voltage range (%FS)
1
0
0
–1
–1
–2
0
1×10
5
5×10
5
1×10
6
–2
0
1×10
5
5×10
5
1×10
6
Pressure cycle (cycle)
Pressure cycle (cycle)
PF (ADP1)
3. Evaluation test
Tested item
Storage at high
temperature
Storage at low
temperature
Environmental
characteristics
Humidity
Temperature cycle
Endurance
characteristics
High temperature/high
humidity operation
Vibration resistance
Mechanical
characteristics
Tested condition
Temperature: Left in a 120°C
248°F
constant temperature bath
Time: 1,000 hrs.
Temperature: Left in a –40°C
–40°F
constant temperature bath
Time: 1,000 hrs.
Temperature/humidity: Left at 40°C
104°F,
90% RH
Time: 1,000 hrs.
Temperature: –40°C to 120°C
–40°F to 248°F
1 cycle: 30 min.
Times of cycle: 100
Temperature/humidity: 40°C
104°F,
90% RH
Operation times: 10
6
, rated voltage applied
Double amplitude: 1.5 mm
.059 inch
Vibration: 10 to 55 Hz
Applied vibration direction: X, Y, Z 3 directions
Times: 2 hrs each
Dropping height: 75 cm
29.528 inch
Times: 2 times
Pulling strength: 9.8 N {1 kgf}, 10 sec.
Bending strength: 4.9 N {0.5 kgf}, left and right 90° 1 time
Temperature: 230°C
446°F
Time: 5 sec.
Temperature: 260°C
500°F
Time: 10 sec.
Result
Passed
Passed
Passed
Passed
Passed
Passed
Dropping resistance
Terminal strength
Passed
Passed
Passed
Passed
Soldering
Resistance
Soldered in
DIP soldering bath
Temperature
Note: For details other than listed above, please consult us.
DIMENTIONS
1. Terminal direction: Direction opposite the pressure inlet
derection ADP11
( )
Atmospheric
pressure
inlet hole
0.5 dia.
.020 dia.
8.6
.339
10.0
.394
General tolerance: ±0.3
±.012
mm
inch
2. Terminal direction: Pressure inlet direction
ADP12
( )
Atmospheric
pressure
inlet hole
0.5 dia.
.020 dia.
8.6
.339
10.0
.394
3.0
+0
dia.
−0.1
.118
+0
dia.
−.004
Pressure
inlet hole
0.8 dia.
.031 dia.
10.16
±0.25
.400
±.010
C0.5
.020
1.2
±0.1
.047
±.004
0.5
±0.1
.020
±.004
0.6
.024
2.54
±0.25
±.010
.100
2.54
±0.25
±.010
.100
Pressure
inlet hole
0.8 dia.
.031 dia.
0 to 15˚
0.25
+0.1
−0.05
.010
+.004
−.002
3.0
+0
dia.
−0.1
.118
+0
dia.
−.004
C0.5
.020
6.0
.236
R0.5
.020
3.3
.130
1.1
.043
4.9
0.6
.024 .193
0.5
±0.1
.020
±.004
1.2
±0.1
.047
±.004
2.54
±0.25
2.54
±0.25
.100
±.010
.100
±.010
6.0
4.0
.236
.157
3.3
.130
R0.5
.020
0.25
+0.1
−0.05
.010
+.004
−.002
0 to 15˚
0.25
.010
10.16
±0.25
.400
±.010
Recommended PC board pattern
(BOTTOM VIEW)
6-0.9 dia.
6-.035 dia.
10.16
.400
2.54
.100
5.08
.200
2.54
.100
Recommended PC board pattern
(BOTTOM VIEW)
6-0.9 dia.
6-.035 dia.
10.16
.400
2.54
.100
6 dia.
.236 dia.
2.54
.100
5.08
.200
Tolerance: ±0.1
.004
Tolerance: ±0.1
.004
3. Terminal connection diagram
+Input
Terminal No.
1
R
1
−Output
Name
Output (−)
Power supply (+)
Output (+)
No connection
Power supply (−)
Output (−)
R
2
+Output
R
3
2
3
4
5
6
R
4
−Input
Note: Leave terminal 4 unconnected.
PF (ADP1)
NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely fixed.
2. Soldering
1) Due to its small size, the thermal
capacity of the pressure sensor DIP type
is low. Therefore, take steps to minimize
the effects of external heat.
Dip soldering bath: Max. 260°C
500°F,
5
sec.
Soldering iron: 260 to 300°C
500 to
572°F
(30W) within 5 sec.
2) Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
3. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
4. Environment
Consult with us before using or storing
the pressure sensor chip in a place
exposed to corrosive gases (such as the
gases given off by organic solvents, sul-
fites, hydrogen sulfides, etc.) which will
adversely affect the performance of the
pressure sensor chip.
5. Quality check under actual loading
conditions
1) To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect
its performance.
2) As for test data, please contact us.
6. Other handling precautions
1) That using the wrong pressure range
or mounting method may result in acci-
dents.
2) Air can be used directly as a pressure
medium. Consult with us before using a
corrosive gas (such as a gas given off by
an organic solvent, sulfite or hydrogen
sulfide) as the pressure medium.
3) The pressure sensor chip is posi-
tioned inside the pressure inlet. Never
poke wires or other foreign matter
through the pressure inlet since they
may damage the chip or block the inlet.
Avoid use when the atmospheric pres-
sure inlet is blocked.
4) Leave pin No. 4 unconnected since
the pressure sensor chip may be dam-
aged if a voltage is applied to this pin.
5) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
6) Since this pressure sensor chip does
not have a water-proof construction, con-
sult with us if it is to be used in a location
where it may be sprayed with water, etc.
7) Avoid using the pressure sensor chip
in an environment where condensation
may form. Furthermore, its output may
fluctuate if any moisture adhering to it
freezes.
8) The pressure sensor chip is construct-
ed in such a way that its output will fluc-
tuate when it is exposed to light.
Especially when pressure is to be
applied by means of a transparent tube,
take steps to prevent the pressure sen-
sor chip from being exposed to light.
9) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic
or other high-frequency vibration.
10) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
•
When storing the pressure sensor
chips, use a conductive material to
short the pins or wrap the entire chip in
aluminum foil. Plastic containers
should not be used to store or transport
the chips since they readily become
charged.
•
When using the pressure sensor chips,
all the charged articles on the bench
surface and the work personnel should
be grounded so that any ambient static
will be safely discharged.
11) Due to the pressures involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
APPLICATION CIRCUIT
DIAGRAM (EXAMPLE)
The pressure sensor is designed to con-
vert a voltage by means of constant cur-
rent drive and then, if necessary, it
amplifies the voltage for use. The circuit
shown below is a typical example of a
circuit in which the pressure sensor is
used.
Constant current
circuit unit
Pressure
sensor
MOUNTING METHOD
The general method for transmitting air
pressures differs depending on whether
the pressure is low or high.
• Checkpoints for use
<1> Select a pressure inlet pipe which is
sturdy enough to prevent pressure
leaks.
<2> Fix the pressure inlet pipe securely
so as to prevent pressure leaks.
<3> Do not block the pressure inlet pipe.
Methods of transmitting air pressures
When the pressure
is low
(4.9 to 98.1 kPa)
Printed-
circuit
board
When the pressure
is high
(196.1 to 980.7 kPa)
Printed-
circuit
board
O-ring
Tube
Pressure
inlet pipe
Amplifier circuit unit
If a tube is used as the pressure inlet pipe,
it may become disengaged. Therefore, use
a sturdy tube and secure it using O-rings.
OP
AMP
OP
AMP
OP
AMP
