PS (ADP4)
ULTRA SMALL
HIGHLY SEMICONDUCTOR
PRESSURE SENSOR
FEATURES
• Ultra-miniature size: much more
compact than the PF pressure sen-
sors offered in the past
• Base area:
8.6
.339
7.2(W) x 7.2(D) mm
7.2
.283
.283(W) x .283(D)
PS
inch
7.2
• Only 60% in mounting
.283
10.0
.394
area and 91% in over-
Existing products
all height of previous
models (PF)
PS PRESSURE
SENSOR
kgf/cm
2
) units are also available.
mall
Ultra-sture
minia
• Improved ease of DIP pin insertion
into printed circuit boards
The ends of the DIP pins are chamfered to
ensure easy insertion into printed circuit
Example of pressure characteristics
(when the rated pressure is between 98.1 kPa
{1.0 kgf/cm
2
})
Drive current: 1.5 mA rated current; ambient temperature: 25°C
77°F
100
Output voltage, mV
<Actual size>
<Cross-section of Sensor Chip>
Silicon
Piezo resistance
strain gauge
Anode
junction
Pressure
Glass
base
50
• High-level precision and linearity
A high degree of precision and linear detector
response have been achieved by applying the
semiconductor strain gauge system. Highly
reproducible based on repeated pressure.
0
0 {0}
49 {0.5}
98.1 {1}
Pressure (gauge pressure), (kPa {kgf/cm
2
})
• Impressive line-up of models
Highly reliable wire
bonding technology
Pressure
High reliability
die bonding
technology
Very strong,
heat resistant body
• Taking their place alongside the standard
5kΩ
bridge resistance models are those
with a 3.3kΩ resistance which is optimally
suited to 5V drive circuits.
• Economy model (no glass base) gives out-
standing value for consumer appliances
40 kPa (0.4 kgf/cm
2
) and 49 kPa (0.5
TYPICAL APPLICATIONS
• Medical equipment: Electronic hemody-
namometer
• Home appliance: Vacuum cleaner
• Gas equipment: Microprocessor gas
meter, gas leakage detector
• Industrial equipment: Absorption
device, etc.
ORDERING INFORMATION
Ex. ADP
Part No.
Terminal profile and direction
1: DIP terminal: Direction opposite the
pressure inlet direction
0:
1:
2:
3:
4:
5:
6:
7:
8:
9:
A:
4
Rated pressure
4.9 kPa
14.7 kPa
34.3 kPa
49.0 kPa
98.1 kPa
196.1 kPa
343.2 kPa
490.3 kPa
833.6 kPa
980.7 kPa
40.0 kPa
{approx. 0.05 kgf/cm
2
}
{approx. 0.15 kgf/cm
2
}
{approx. 0.35 kgf/cm
2
}
{approx. 0.5 kgf/cm
2
}
{approx. 1.0 kgf/cm
2
}
{approx. 2.0 kgf/cm
2
}
{approx. 3.5 kgf/cm
2
}
{approx. 5.0 kgf/cm
2
}
{approx. 8.5 kgf/cm
2
}
{approx. 10.0 kgf/cm
2
}
{approx. 0.4 kgf/cm
2
}
ADP4:
PS pressure sensor
2: DIP terminal: Pressure inlet direction
Type
1 : Standard type
(With glass base)
2: Economy type
(Without glass
base)
Bridge resistance
0 : 5.0kΩ
3 : 3.3kΩ
Bridge resistance
Terminal
Pressure
DIP terminal:
Direction opposite
the pressure inlet
direction
ADP41010
ADP41110
ADP41210
ADP41310
ADP41410
ADP41510
ADP41610
ADP41710
ADP41810
2
2
5.0kΩ
DIP terminal:
Pressure inlet
direction
ADP42010
ADP42110
ADP42210
ADP42310
ADP42410
ADP42510
ADP42610
ADP42710
ADP42810
ADP42910
——
ADP42320
DIP terminal:
Direction opposite
the pressure inlet
direction
——
——
——
——
ADP41413
——
——
——
——
ADP41913
ADP41A23
——
3.3kΩ
DIP terminal:
Pressure inlet
direction
——
——
——
——
ADP42413
——
——
——
——
ADP42913
ADP42A23
——
4.9kPa
14.7kPa
34.3kPa
Standard
type
(With glass
base)
49.0kPa
98.1kPa
196.1kPa
343.2kPa
490.3kPa
833.6kPa
980.7kPa
Economy type
(Without glass
base)
40.0kPa
49.0kPa
approx. 0.05kgf/cm
2
approx. 0.15kgf/cm
approx. 0.5kgf/cm
approx. 2.0kgf/cm
approx. 5.0kgf/cm
2
approx. 0.35kgf/cm
2
approx. 1.0kgf/cm
2
2
approx. 3.5kgf/cm
2
2
approx. 8.5kgf/cm
2
approx. 10.0kgf/cm
approx. 0.4kgf/cm
2
approx. 0.5kgf/cm
2
ADP41910
——
ADP41320
23
PS (ADP4)
SPECIFICATIONS
Type
Type of pressure
Pressure medium
Unit: kPa
Rated
pressure Unit: kgf/cm
2
(approx.)
Max. applied pressure
Bridge resistance
Ambient temperature
Storage temperature
Temperature compensation range
Drive current (constant current)
Output span voltage
Offset voltage
Linearity
Pressure hysteresis
Offset voltage-temperature
characteristics (0 to 50°C
32 to 122°F)
Sensitivity-temperature
characteristics (0 to 50°C
32 to 122°F)
40±20 mV
±0.7%FS ±0.5%FS
±0.6%FS ±0.4%FS
±15%FS
±10%FS
Standard type (With glass base)
Economy type
(Without glass base)
Gauge pressure
Air (For other medium, please consult us.)
34.3
49.0
98.1
196.1
343.2
490.3
833.6
980.7
98.1
980.7
40.0
49.0
0.35
0.5
1.0
2.0
3.5
5.0
8.5
10.0
1.0
10.0
0.4
0.5
1.5 times
Twice the 1.5 times the
Twice
Twice the rated pressure
the rated pressure rated pressure rated pressure the rated pressure
5000±1000
Ω
3300±700
Ω
3300±600
Ω
5000±1000
Ω
–5 to +50°C –20 to +100°C
–20 to 100°C
–4 to 212°F
(no freezing or condensation)
+23 to +122°F –4 to +212°F
–20 to +70°C –40 to +120°C
–40 to 120°C
–40 to 248°F
(no freezing or condensation)
–4 to +158°F –40 to +248°F
0 to 60°C
5 to 45°C 0 to 50°C
0 to 50°C
32 to 122°F
32 to 140°F
41 to 113°F 32 to 122°F
1.5 mA DC
1.0 mA DC
1.5 mA DC
100±40 mV
65±25 mV
43.5±22.5 mV 85±45 mV
±20
mV
±15
mV
±25
mV
±0.3%FS
±0.5%FS
±0.6%FS
±1.0%FS
±0.3%FS
±0.2%FS
±0.4%FS
±1.0%FS
±0.7%FS
±5.0%FS
±2.5%FS
±3.5%FS
±10%FS
±8%FS
4.9
0.05
14.7
0.15
±1.3%FS ±2.5%FS
Notes) 1. Unless otherwise specified, measurements were taken with a drive current of ±0.01 mA and humidity ranging from 25% to 85%.
2. Please consult us if a pressure medium other than air is to be used.
3. This is the regulation which applies within the compensation temperature range.
4. Please consult us if the intended use involves a negative pressure.
DATA
1. Characteristics data
1-<1> Output characteristics
ADP41913
Drive current: 1.0 mA; temperature: 30°C
86°F
60
1-<2> Offset voltage – temperature
characteristics
ADP41913
Drive current: 1.0 mA; rating ±3.5%FS
Offset voltage – temperature characteristics (%FS)
4
3
1-<3> Sensitivity – temperature
characteristics (%FS)
ADP41913
Drive current: 1.0 mA; rating ±2.5%FS
4
Sensitivity – temperature characteristics (%FS)
3
50
Output voltage (mV)
40
2
2
30
1
1
20
0
0
10
–1
–1
0
–2
0
980.7/2 {5}
kpa {kgf/cm
2
}
980.7 {10}
Rated pressure
0
+32
30
+86
60
+140
Temperature (°C
°F)
–2
0
+32
30
+86
60
+140
Temperature (°C
°F)
2. Pressure cycle range (0 to rated pressure)
Tested sample: ADP41913, temperature: 100°C
212°F,
No. of cycle: 1×10
6
2-<1> Offset voltage range
3
2-<2> Output span voltage range
3
1
Output span voltage range (%FS)
2
2
Offset voltage range (%FS)
Even after testing for 1 million times, the vari-
ations in the offset voltage and output span
voltage are minimal.
1
0
0
–1
–1
–2
–2
–3
0
5×10
5
Pressure cycle (cycle)
1×10
6
–3
0
5×10
5
Pressure cycle (cycle)
1×10
6
24
PS (ADP4)
3. Evaluation test
Tested item
Storage at high
temperature
Storage at low
temperature
Environmental
characteristics
Humidity
Temperature cycle
Endurance
characteristics
High temperature/high
humidity operation
Vibration resistance
Mechanical
characteristics
Tested condition
Temperature: Left in a 120°C
248°F
constant temperature bath
Time: 1,000 hrs.
Temperature: Left in a –40°C
–40°F
constant temperature bath
Time: 1,000 hrs.
Temperature/humidity: Left at 40°C
104°F,
90% RH
Time: 1,000 hrs.
Temperature: –40°C to 120°C
–40°F to 248°F
1 cycle: 30 min.
Times of cycle: 100
Temperature/humidity: 40°C
104°F,
90% RH
Operation times: 10
6
, rated voltage applied
Double amplitude: 1.5 mm
.059 inch
Vibration: 10 to 55 Hz
Applied vibration direction: X, Y, Z 3 directions
Times: 2 hrs each
Dropping height: 75 cm
29.528 inch
Times: 2 times
Pulling strength: 9.8 N {1 kgf}, 10 sec.
Bending strength: 4.9 N {0.5 kgf}, left and right 90° 1 time
Temperature: 230°C
446°F
Time: 5 sec.
Temperature: 260°C
500°F
Time: 10 sec.
Result
Passed
Passed
Passed
Passed
Passed
Passed
Dropping resistance
Terminal strength
Passed
Passed
Passed
Passed
Soldering
Resistance
Soldered in
DIP soldering bath
Temperature
Note: For details other than listed above, please consult us.
DIMENSIONS
1. Terminal direction: Direction opposite the pressure inlet
derection ADP41
7.2
.283
Pressure
inlet hole
1.1 dia.
.043 dia.
Pressure
inlet hole
1.1 dia.
.043 dia.
7.2
.283
General tolerance: ±0.3
±.012
mm
inch
2. Terminal direction: Pressure inlet direction ADP42
7.2
.283
7.2
.283
4 dia.
.157 dia.
0
2.5
–0.1
dia.
0
.098
–.004
dia.
2.5
±.010
.098
8.2Max
.323Max
±0.25
2.5
±.010
.098
0.5
±.004
.020
±0.1
±0.25
9.5
±1.5
.374
±.059
4 dia.
.157 dia.
4 5
.157 .197
3.5
.138
4.6
.181
2.5
±.010
.098
±0.25
3.7
.164
4 5
.157 .197
3.5
.138
0.25
±.0
04
.010
±0
.1
0
2.5
–0.1
dia.
0
.098
–.004
dia.
.2
8
R0
.00
R
.2
R0
08
.0
R
0.5
2.5
±0.1
.020
±.004
±.010
1
2
JAPAN
3
8.2Max
.323Max
±0.25
.098
0.25
±0
.1
.010
±.0
04
9.5
±.059
.374
±1.5
Atmospheric
Pressure
inlet hole
6
5
1
Atmospheric
Pressure
inlet hole
6
2
JAPAN
3
Recommended PC board pattern
(BOTTOM VIEW)
6-0.9 dia.
6-.035 dia.
4
Recommended PC board pattern
(BOTTOM VIEW)
6-0.9 dia.
6-.035 dia.
5
4
7.5
.295
5d
.197
ia.
dia.
7.5
.295
Tolerance: ±0.1
.004
2.5
.098
2.5
.098
Tolerance: ±0.1
.004
2.5
.098
2.5
.098
3. Terminal connection diagram
+Output
Terminal No.
1
R
1
−Input
Name
Power supply (+)
Output (+)
Power supply (−)
Power supply (−)
Output (−)
No connection
R
2
+Input
R
3
2
3
4
5
6
R
4
−Output
Note: Leave terminal 6 unconnected.
25
PS (ADP4)
NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely fixed.
2. Soldering
1) Due to its small size, the thermal
capacity of the pressure sensor DIP type
is low. Therefore, take steps to minimize
the effects of external heat.
Dip soldering bath: Max. 260°C
500°F,
5
sec.
Soldering iron: 260 to 300°C
500 to
572°F
(30W) within 5 sec.
2) Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
3. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
4. Environment
Consult with us before using or storing
the pressure sensor chip in a place
exposed to corrosive gases (such as the
gases given off by organic solvents, sul-
fites, hydrogen sulfides, etc.) which will
adversely affect the performance of the
pressure sensor chip.
5. Quality check under actual loading
conditions
1) To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect
its performance.
2) As for test data, please contact us.
6. Other handling precautions
1) That using the wrong pressure range
or mounting method may result in acci-
dents.
2) Air can be used directly as a pressure
medium. Consult with us before using a
corrosive gas (such as a gas given off by
an organic solvent, sulfite or hydrogen
sulfide) as the pressure medium.
3) The pressure sensor chip is posi-
tioned inside the pressure inlet. Never
poke wires or other foreign matter
through the pressure inlet since they
may damage the chip or block the inlet.
Avoid use when the atmospheric pres-
sure inlet is blocked.
4) Leave pin No. 6 unconnected since
the pressure sensor chip may be dam-
aged if a voltage is applied to this pin.
5) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
6) Since this pressure sensor chip does
not have a water-proof construction, con-
sult with us if it is to be used in a location
where it may be sprayed with water, etc.
7) Avoid using the pressure sensor chip
in an environment where condensation
may form. Furthermore, its output may
fluctuate if any moisture adhering to it
freezes.
8) The pressure sensor chip is construct-
ed in such a way that its output will fluc-
tuate when it is exposed to light.
Especially when pressure is to be
applied by means of a transparent tube,
take steps to prevent the pressure sen-
sor chip from being exposed to light.
9) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic
or other high-frequency vibration.
10) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
•
When storing the pressure sensor
chips, use a conductive material to
short the pins or wrap the entire chip in
aluminum foil. Plastic containers
should not be used to store or transport
the chips since they readily become
charged.
•
When using the pressure sensor chips,
all the charged articles on the bench
surface and the work personnel should
be grounded so that any ambient static
will be safely discharged.
11) Due to the pressures involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
APPLICATION CIRCUIT
DIAGRAM (EXAMPLE)
The pressure sensor is designed to con-
vert a voltage by means of constant cur-
rent drive and then, if necessary, it
amplifies the voltage for use. The circuit
shown below is a typical example of a
circuit in which the pressure sensor is
used.
Constant current
circuit unit
Pressure
sensor
MOUNTING METHOD
The general method for transmitting air
pressures differs depending on whether
the pressure is low or high.
• Checkpoints for use
<1> Select a pressure inlet pipe which is
sturdy enough to prevent pressure
leaks.
<2> Fix the pressure inlet pipe securely
so as to prevent pressure leaks.
<3> Do not block the pressure inlet pipe.
Methods of transmitting air pressures
When the pressure
is low
(4.9 to 98.1 kPa)
Printed-
circuit
board
When the pressure
is high
(196.1 to 980.7 kPa)
Printed-
circuit
board
O-ring
Tube
Pressure
inlet pipe
Amplifier circuit unit
If a tube is used as the pressure inlet pipe,
it may become disengaged. Therefore, use
a sturdy tube and secure it using O-rings.
OP
AMP
OP
AMP
OP
AMP
12/1/2002
All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
模拟与混合信号
