型号
- 型号
- 关键词
16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85
器件标准：
| 型号 | ADS8254IRGCR | ADS8254IBRGCT | ADS8254IBRGCR | ADS8254IRGCT |
|---|---|---|---|---|
| 描述 | 16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85 | 16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85 | 16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85 | 16-Bit, 4 Channel Differential Complete Acquisition Solution (ADC, REF, and Input Buffer) 64-VQFN -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN | QFN | QFN | QFN |
| 包装说明 | VQFN-64 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 |
| 针数 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | compliant | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 4.096 V | - | 4.096 V | 4.096 V |
| 最小模拟输入电压 | -4.096 V | - | -4.096 V | -4.096 V |
| 最长转换时间 | 0.65 µs | - | 0.65 µs | 0.65 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PQCC-N64 | - | S-PQCC-N64 | S-PQCC-N64 |
| JESD-609代码 | e4 | - | e4 | e4 |
| 长度 | 9 mm | - | 9 mm | 9 mm |
| 最大线性误差 (EL) | 0.0023% | - | 0.0011% | 0.0023% |
| 湿度敏感等级 | 3 | - | 3 | 3 |
| 标称负供电电压 | -5 V | - | -5 V | -5 V |
| 模拟输入通道数量 | 4 | - | 4 | 4 |
| 位数 | 16 | - | 16 | 16 |
| 功能数量 | 1 | - | 1 | 1 |
| 端子数量 | 64 | - | 64 | 64 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C |
| 输出位码 | BINARY | - | BINARY | BINARY |
| 输出格式 | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | HVQCCN | HVQCCN |
| 封装等效代码 | LCC64,.35SQ,20 | - | LCC64,.35SQ,20 | LCC64,.35SQ,20 |
| 封装形状 | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 |
| 电源 | +-5,3/5 V | - | +-5,3/5 V | +-5,3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 采样速率 | 1 MHz | - | 1 MHz | 1 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | SAMPLE |
| 座面最大高度 | 1 mm | - | 1 mm | 1 mm |
| 最大压摆率 | 50 mA | - | 50 mA | 50 mA |
| 标称供电电压 | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | - | YES | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 9 mm | - | 9 mm | 9 mm |
