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AGB75LC04-QU-E

Multilayer Ceramic Capacitors MLCC - SMD/SMT 100V 4.7uF X7S 1206 20%

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Amulet Technologies

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Amulet Technologies
包装说明
,
Reach Compliance Code
unknown
湿度敏感等级
3
文档预览
Highly Integrated Amulet GEM Graphical OS
Chip
TM
for Color Graphical User Interfaces
Introduction:
Amulet’s new GUI processor for color displays
enables OEMs and design firms to take their
products to the next level by implementing
interactive color-rich GUIs designed in dynamic
HTML. The GEM Graphical OS Chip
TM
includes
all of the hardware and software required to turn
a color LCD and touch panel into a user interface.
Amulet’s solution is perfect for many embedded
system applications, including appliances,
consumer electronics, industrial controls, medical
equipment and office automation.
The accelerated graphic memory architecture
allows for concurrent access to 3 individual
memory subsystems for simultaneous program
execution, LCD refresh, and frame buffer
rendering.
Features:
• Integrated LCD Controller Supports Passive
and Active displays up to 24 bits per pixel
• USB 2.0, TWI, UART, and SPI Interfaces
• Power Management Controller for Low Power
Operation
• Directly Connects to 4- and 5-wire Resistive
Touch Panels
• Up to 45 General Purpose IO Lines in BGA
• Drag-and-drop GUI Creation in Dynamic
HTML
• PNG, GIF, and JPEG Image, and GIF
Animation Support
• Built-in Royalty-free Graphical Operating
System
• Inexpensive Development Tools
• PC Based UI Simulator Available to SimplifyUI
Prototyping
• Built-in copy protection option to protect un-
authorized duplication of user’s product
COLOR CHIP FAMILY
AGB75LC04-QU-E
AGB75LC04-BG-E
Data Sheet
Datasheet 2.3 - 0311
AGB75LC04
2
Typical Application Circuit
Cloak
Crystal
(12 MHz)
3.3V
and
1.2V
Power
Supply
Amulet Color
Chip
Reset
SDRAM*
Dataflash*
* Typical Serial Flash: Atmel AT45DB321D
* Typical SDRAM: ISSI IS42S32200E-6TL
3
3.1
Package and Pinout
208-pin PQFP Package (Top View)
Datasheet 2.3 - 0311
AGB75LC04
Datasheet 2.3 - 0311
3.11
Device and 208-pin PQFP Package Maximum Weight
AGB75LC04
5670.1
3.12
208-pin PQFP Package Characteristics
mg
Moisture Sensitivity Level
3.13
Package Reference
3
JEDEC Drawing Reference
JESD97 Classification
MS-029
e3
3.2
225-pin BGA Package
X
0.12
Z
A1 BALL PAD CORNER
0.10
4X
0.10
A
Z
Z
D
Y
&b
& 0.15 M
& 0.08
M
Z X Y
Z
E
Seating Plane
A2
Top View
Side View
A1 BALL PAD CORNER
e
15 14 13 12
11
10 9 8 7 6 5 4 3 2 1
Common Dimensions
(Unit of Measure = mm)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Symbol
D
E
A
A1
A2
e
b
MIN
NOM
13.00 BSC
13.00 BSC
MAX
NOTE
_
0.25
0.85
_
_
_
0.80 BSC
1.70
_
_
3
3
0.90 REF
0.90 REF
e
(225 Solder Balls)
Bottom View
0.45
0.50
0.55
4
Datasheet 2.3 - 0311
AGB75LC04
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