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AGLN250V5-VQ100

fpga - 现场可编程门阵列 250k system gates igloo nano

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Actel

厂商官网:http://www.actel.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Actel
包装说明
14 X 14 MM, 0.5 MM PITCH, 1.2 MM HEIGHT, VQFP-100
Reach Compliance Code
compli
最大时钟频率
250 MHz
JESD-30 代码
S-PQFP-G100
JESD-609代码
e0
长度
14 mm
湿度敏感等级
3
可配置逻辑块数量
6144
等效关口数量
250000
输入次数
68
逻辑单元数量
6144
输出次数
68
端子数量
100
最高工作温度
70 °C
最低工作温度
-20 °C
组织
6144 CLBS, 250000 GATES
封装主体材料
PLASTIC/EPOXY
封装代码
TFQFP
封装等效代码
TQFP100,.63SQ
封装形状
SQUARE
封装形式
FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
230
电源
1.5 V
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压
1.575 V
最小供电电压
1.425 V
标称供电电压
1.5 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
30
宽度
14 mm
文档预览
Revision 11
IGLOO nano Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
nanoPower Consumption—Industry’s Lowest Power
1.2 V to 1.5 V Core Voltage Support for Low Power
Supports Single-Voltage System Operation
Low Power Active FPGA Operation
Flash*Freeze Technology Enables Ultra-Low Power
Consumption while Maintaining FPGA Content
• Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
®
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
Advanced I/Os
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS
3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
• I/O Registers on Input, Output, and Enable Paths
• Selectable Schmitt Trigger Inputs
• Hot-Swappable and Cold-Sparing I/Os
• Programmable Output Slew Rate and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the IGLOO
®
Family
• Up to Six CCC Blocks, One with an Integrated PLL
• Configurable Phase Shift, Multiply/Divide, Delay
Capabilities, and External Feedback
• Wide Input Frequency Range (1.5 MHz up to 250 MHz)
Small Footprint Packages
• As Small as 3x3 mm in Size
Wide Range of Features
• 10,000 to 250,000 System Gates
• Up to 36 kbits of True Dual-Port SRAM
• Up to 71 User I/Os
Reprogrammable Flash Technology
130-nm, 7-Layer Metal, Flash-Based CMOS Process
Live-at-Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design When Powered Off
250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
Clock Conditioning Circuit (CCC) and PLL
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock
®
to Secure FPGA Contents
• 1.2 V Programming
Embedded Memory
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
• True Dual-Port SRAM (except × 18 organization)
Enhanced Commercial Temperature Range
• –20°C to +70°C
Table 1 •
IGLOO nano Devices
IGLOO nano Devices
IGLOO nano-Z Devices
System Gates
Typical Equivalent Macrocells
VersaTiles (D-flip-flops)
Flash*Freeze Mode (typical, µW)
RAM Kbits (1,024 bits)
2
4,608-Bit Blocks
Secure (AES)
2
1
AGLN010 AGLN015
10,000
86
260
2
1
2,3
AGLN020
AGLN030Z
1
20,000
172
520
4
1
4
3
52
52
UC81, CS81
QN68
30,000
256
768
5
1
6
2
77
83
UC81, CS81
QN48, QN68
VQ100
AGLN060
60,000
512
1,536
10
18
4
1
Yes
1
18
2
71
71
CS81
VQ100
AGLN125
125,000
1,024
3,072
16
36
8
1
Yes
1
18
2
71
71
CS81
VQ100
AGLN250
250,000
2,048
6,144
24
36
8
1
Yes
1
18
4
68
68
CS81
VQ100
AGLN060Z AGLN125Z AGLN250Z
15,000
128
384
4
1
4
3
49
FlashROM Kbits (1,024 bits)
ISP
2
Integrated PLL in CCCs
VersaNet Globals
I/O Banks
Maximum User I/Os (packaged device)
Maximum User I/Os (Known Good Die)
Package Pins
UC/CS
QFN
VQFP
4
2
34
34
UC36
QN48
QN68
Notes:
1.
2.
3.
4.
AGLN030 is available in the Z feature grade only.
AGLN030 and smaller devices do not support this feature.
AGLN060, AGLN125, and AGLN250 in the CS81 package do not support PLLs.
For higher densities and support of additional features, refer to the
IGLOO
and
IGLOOe
datasheets.
† AGLN030 and smaller devices do not support this feature.
July 2010
© 2010 Actel Corporation
I
IGLOO nano Low-Power Flash FPGAs
I/Os Per Package
IGLOO nano Devices
IGLOO nano-Z Devices
Known Good Die
UC36
QN48
QN68
UC81
CS81
VQ100
34
23
34
49
52
49
52
52
AGLN010
AGLN015
AGLN020
AGLN030Z
1
83
34
49
66
66
77
AGLN060
AGLN060Z
71
60
71
AGLN125
AGLN125Z
71
60
71
AGLN250
AGLN250Z
68
60
68
Notes:
1. AGLN030 is available in the Z feature grade only.
2. When considering migrating your design to a lower- or higher-density device, refer to the
IGLOO
datasheet and
IGLOO FPGA
Fabric User’s Guide
to ensure compliance with design and board migration requirements.
3. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not used as a regular I/O, the number of single-
ended user I/Os available is reduced by one.
4. "G" indicates RoHS-compliant packages. Refer to
"IGLOO nano Ordering Information" on page III
for the location of the "G" in
the part number. For nano devices, the VQ100 package is offered in both leaded and RoHS-compliant versions. All other
packages are RoHS-compliant only.
Table 2 •
IGLOO nano FPGAs Package Sizes Dimensions
Packages
Length × Width (mm\mm)
Nominal Area (mm
2
)
Pitch (mm)
Height (mm)
UC36
3x3
9
0.4
0.80
UC81
4x4
16
0.4
0.80
CS81
5x5
36
0.5
0.80
QN48
6x6
36
0.4
0.90
QN68
8x8
64
0.4
0.90
VQ100
14 x 14
196
0.5
1.20
IGLOO nano Device Status
IGLOO nano Devices
AGLN010
AGLN015
AGLN020
Status
Production
Production
Production
AGLN030Z
AGLN060
AGLN125
AGLN250
Production
Advance
Production
AGLN060Z
AGLN125Z
AGLN250Z
Production
Production
Production
Production
IGLOO nano-Z Devices
Status
II
R evis i o n 11
IGLOO nano Low Power Flash FPGAs
IGLOO nano Ordering Information
AGLN250
V2
_
Z
VQ
G
100
I
Application (Temperature Range)
Blank = Commercial (
20°C to +70°C Ambient Temperature)
I = Industrial (
40°C to +85°C Ambient Temperature)
PP = Pre-Production
ES = Engineering Sample (Room Temperature Only)
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G= RoHS-Compliant Packaging
Package Type
UC = Micro Chip Scale Package (0.4 mm pitch)
CS = Chip Scale Package (0.5 mm pitch)
QN = Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitches)
VQ = Very Thin Quad Flat Pack (0.5 mm pitch)
DIELOT = Known Good Die
Z = nano devices without enhanced features
1
Blank = Standard
Supply Voltage
2 = 1.2 V to 1.5 V
5 = 1.5 V only
Part Number
IGLOO nano Devices
AGLN010 = 10,000 System Gates
AGLN015 = 15,000 System Gates
AGLN020 = 20,000 System Gates
AGLN030 = 30,000 System Gates
AGLN060 = 60,000 System Gates
AGLN125 = 125,000 System Gates
AGLN250 = 250,000 System Gates
Notes:
1. AGLN030 is available in the Z feature grade only.
2. Z-feature grade devices AGLN060Z, AGLN125Z, and AGLN250Z do not support the enhanced nano features of Schmitt Trigger
input, bus hold (hold previous I/O state in Flash*Freeze mode), cold-sparing, hot-swap I/O capability and 1.2 V programming.
The AGLN030 Z feature grade does not support Schmitt trigger input, bus hold and 1.2 V programming. For the VQ100, CS81,
UC81, QN68, and QN48 packages, the Z feature grade and the N part number are not marked on the device.
3. Marking Information: IGLOO nano V2 devices do not have V2 marking, but IGLOO nano V5 devices are marked with a V5
designator.
Device Marking
Actel normally topside marks the full ordering part number on each device. There are some exceptions to this, such as some of the
Z feature grade nano devices, the V2 designator for IGLOO devices, and packages where space is physically limited. Packages that
have limited characters available are UC36, UC81, CS81, QN48, QN68, and QFN132. On these specific packages, a subset of the
device marking will be used that includes the required legal information and as much of the part number as allowed by character
limitation of the device. In this case, devices will have a truncated device marking and may exclude the applications markings, such
as the I designator for Industrial Devices or the ES designator for Engineering Samples.
R ev i si o n 1 1
III
IGLOO nano Low-Power Flash FPGAs
Figure 1
shows an example of device marking based on the AGL030V5-UCG81. The actual mark will vary by the device/package
combination ordered.
Device Name
(six characters)
Package
Wafer Lot #
ACTELXXX
AGL030YWW
UCG81XXXX
XXXXXXXX
Country of Origin
Date Code
Customer Mark
(if applicable)
Figure 1 •
Example of Device Marking for Small Form Factor Packages
IGLOO nano Product Available in the Z Feature Grade
IGLOO nano-Z Devices
AGLN030Z
QN48
QN68
UC81
CS81
Packages
VQ100
AGLN060Z
CS81
VQ100
AGLN125Z
CS81
VQ100
AGLN250Z
CS81
VQ100
Temperature Grade Offerings
AGLN010
Package
UC36
QN48
QN68
UC81
CS81
VQ100
C, I
C, I
C, I
C, I
C, I
C, I
AGLN015
AGLN020
AGLN030Z
1
C, I
C, I
C, I
C, I
C, I
AGLN060
AGLN060Z
C, I
C, I
AGLN125
AGLN125Z
C, I
C, I
AGLN250
AGLN250Z
C, I
C, I
Notes:
1. C = Extended Commercial temperature range: –20°C to 70°C ambient temperature.
2. I = Industrial temperature range: –40°C to 85°C ambient temperature.
Contact your local Actel representative for device availability:
http://www.actel.com/contact/default.aspx.
IV
R evis i o n 11
IGLOO nano Low Power Flash FPGAs
Table of Contents
IGLOO nano Device Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
IGLOO nano DC and Switching Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-57
Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-63
Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-70
Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-73
Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-86
JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-87
Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-88
Package Pin Assignments
36-Pin UC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
81-Pin UC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
81-Pin CS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
48-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
68-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
100-Pin VQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
R ev i si o n 1 1
V
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