SPECIFICATION FOR APPROVAL
REF : 20080424-A
PROD.
NAME
ABC'S DWG NO.
PAGE: 1
AL1608□□□□L□-□□□
THIN FILM CHIP INDUCTOR
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
D
D
C
B
I
G
( PCB Pattern )
I
Unit : m/m
Series
AL1608
A
1.60±0.10
B
0.80±0.10
C
0.45±0.10
D
0.30±0.20
G
0.9
H
0.9
H
I
0.6
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ceramic
b﹒Internal conductor：Cu
c﹒Terminal electrode：Cu/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
a
b
c
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Terminal strength：
F
Type
AL1608
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
F ( kgf )
0.5
Time ( sec )
30±5
Temperature (
℃
)
250
50sec max.
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
230
℃
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF : 20080424-A
PROD.
NAME
ABC'S DWG NO.
PAGE: 2
AL1608□□□□L□-□□□
THIN FILM CHIP INDUCTOR
ABC'S ITEM NO.
Ⅴ﹒ELECTRICAL
CHARACTERISITCS：
DWG No.
AL16081N0DL□-□□□
AL16081N2DL□-□□□
AL16081N5DL□-□□□
AL16081N8DL□-□□□
AL16082N2DL□-□□□
AL16082N7DL□-□□□
AL16083N3DL□-□□□
AL16083N9DL□-□□□
AL16084N7DL□-□□□
AL16085N6DL□-□□□
AL16086N8DL□-□□□
AL16088N2DL□-□□□
AL160810NJL□-□□□
AL160812NJL□-□□□
AL160815NJL□-□□□
AL160818NJL□-□□□
AL160822NJL□-□□□
AL160827NJL□-□□□
AL160833NJL□-□□□
AL160839NJL□-□□□
AL160847NJL□-□□□
AL160856NJL□-□□□
AL160868NJL□-□□□
AL1608R10JL□-□□□
Inductance
( nH )
1.0±0.3
1.2±0.3
1.5±0.3
1.8±0.3
2.2±0.3
2.7±0.3
3.3±0.3
3.9±0.3
4.7±0.3
5.6±0.3
6.8±0.3
8.2±0.3
10.0±5 %
12.0±5 %
15.0±5 %
18.0±5 %
22.0±5 %
27.0±5 %
33.0±5 %
39.0±5 %
47.0±5 %
56.0±5 %
68.0±5 %
100.0±5 %
Q
min
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
Test Freq.
( MHz )
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
SRF
( GHz )
min
13.0
13.0
10.0
10.0
8.0
6.0
6.0
6.0
5.0
5.0
5.0
4.0
4.0
3.0
3.0
2.0
2.0
2.0
1.5
1.5
1.5
1.0
1.0
1.0
DC Resistance
(
Ω
)
max
0.35
0.35
0.35
0.35
0.35
0.45
0.45
0.45
0.55
0.65
0.75
0.95
0.95
1.05
1.35
1.65
1.95
2.35
2.75
3.00
3.00
5.00
5.00
7.50
Rated Current
( mA )
max
800
800
800
300
300
300
300
300
300
300
300
300
300
300
300
300
250
250
250
200
200
150
150
100
1).
□：Packaging
Information… A：Bulk B：Taping Reel
2)."-
":Reference code
3). Tolerance：B：±0.1 C±0.2 D：±0.3 G：±2% J：±5%
□□□
AR-001A
SPECIFICATION FOR APPROVAL
REF : 20080424-A
PROD.
NAME
ABC'S DWG NO.
PAGE: 3
AL1608□□□□L□-□□□
THIN FILM CHIP INDUCTOR
ABC'S ITEM NO.
Ⅵ﹒PACKAGING
INFORMATION：
( 1 ) Configuration
T
Cover Tape
2.0±0.5
A
B
N
∮
C
∮
C
G
D
Emobossed Carrier
※
Carrier tape width : D
P:4 m/m
End
4 m/m
Start
Leader
no component
200 m/m min.
Components
User direction of feed
Trailer
no component
400 m/m min.
( 2 ) Dimensions
Style
07 - 08
A
178
B
21±0.8
C
13
D
8
G
10 +0
N
50 -0
Unit:m/m
T
12.5
( 3 ) Q'TY & G.W. Per pcakage
Inner : Reel
Series
AL1608
Q'TY (pcs)
G.W. (gw)
Style
Q'TY (pcs)
Outer : Carton
G.W. (Kg)
Size (cm)
5,000
90
07 - 08
250,000
7.0
41 x 39 x 22
AR-001A
SPECIFICATION FOR APPROVAL
REF : 20080424-A
PROD.
NAME
ABC'S DWG NO.
PAGE: 4
AL1608□□□□L□-□□□
THIN FILM CHIP INDUCTOR
ABC'S ITEM NO.
Ⅶ﹒DWGING
NUMBER EXPRESSION：
A
L
1
6
0
8
Reference code
Appendix code 2 : Package
Appendix code 1 : Classification
Tolerance code
Electrical code
Dimension code
Type code
Appendix code 1：Product Classification
L：Lead Free Standard products comply with RoHS' requirements
1 ~ 9：Lead Free Special products comply with RoHS' requirements
Appendix code 2：Package Information
Code
A
B
Inner package
T.B.D.
T / R ( Reel package )
Inner package Q'TY
T.B.D.
5000
pcs
Remark
AR-001A
SPECIFICATION FOR APPROVAL
REF : 20080424-A
PROD.
NAME
ABC'S DWG No.
PAGE: 5
AL1608□□□□L□-□□□
THIN FILM CHIP INDUCTOR
ABC'S ITEM No.
Ⅷ﹒RELIABILITY
TEST：
Test item
Specification
Test condition
Preheat : 155
℃
/ 4 hours.
Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent
Solder temp. : 235±5℃
Flux : Rosin
Dip time : 5±0.5 seconds
Solderability
More than 95% of the
terminal electrode
Shall be covered
With fresh solder.
Thermal shock test
( Temp. cycle )
Electrical oharacteristics shall
not change more
than
±20%
Room temp.
15 minutes
Room temp.
15 minutes
Total : 50 cycles
-55
℃
30 minutes
+125
℃
30 minutes
Humidity Test
Temperature : 40±2℃
Humidity : 90±5%
Time : 1000 hours
High temp.
Resistance test
Temperature : 125±5℃
Applied current : Per spec.
Time : 96 hours
AR-001A
