型号
- 型号
- 关键词
Standard SRAM, 1KX1, 20ns, ECL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16
厂商名称：AMD(超微)
厂商官网：http://www.amd.com
下载文档| 型号 | AM100415DCB | AM100415FC | AM100415FCB | AM100415DC |
|---|---|---|---|---|
| 描述 | Standard SRAM, 1KX1, 20ns, ECL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Standard SRAM, 1KX1, 20ns, ECL, CDFP16, CERAMIC, FP-16 | Standard SRAM, 1KX1, 20ns, ECL, CDFP16, CERAMIC, FP-16 | Standard SRAM, 1KX1, 20ns, ECL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | DIP | DFP | DFP | DIP |
| 包装说明 | DIP, DIP16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 20 ns | 20 ns | 20 ns | 20 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-GDIP-T16 | R-GDFP-F16 | R-GDFP-F16 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 19.431 mm | 10.16 mm | 10.16 mm | 19.431 mm |
| 内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 |
| 负电源额定电压 | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 字数 | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 组织 | 1KX1 | 1KX1 | 1KX1 | 1KX1 |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 可输出 | NO | NO | NO | NO |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DFP | DFP | DIP |
| 封装等效代码 | DIP16,.3 | FL16,.3 | FL16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.159 mm | 2.159 mm | 5.08 mm |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | ECL | ECL | ECL | ECL |
| 温度等级 | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 6.731 mm | 6.731 mm | 7.62 mm |