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AM25LS2518XM

D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16

器件类别:逻辑    逻辑   

厂商名称:AMD(超微)

厂商官网:http://www.amd.com

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器件参数
参数名称
属性值
厂商名称
AMD(超微)
零件包装代码
DIE
包装说明
DIE, DIE OR CHIP
针数
16
Reach Compliance Code
unknown
其他特性
STANDARD TOTEM OUTPUTS ALSO AVAILABLE
系列
TTL/H/L
JESD-30 代码
R-XUUC-N16
负载电容(CL)
50 pF
逻辑集成电路类型
D FLIP-FLOP
位数
4
功能数量
1
端子数量
16
最高工作温度
125 °C
最低工作温度
-55 °C
输出特性
3-STATE
输出极性
TRUE
封装主体材料
UNSPECIFIED
封装代码
DIE
封装等效代码
DIE OR CHIP
封装形状
RECTANGULAR
封装形式
UNCASED CHIP
最大电源电流(ICC)
28 mA
传播延迟(tpd)
40 ns
认证状态
Not Qualified
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
TTL
温度等级
MILITARY
端子形式
NO LEAD
端子位置
UPPER
触发器类型
POSITIVE EDGE
最小 fmax
25 MHz
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参数对比
与AM25LS2518XM相近的元器件有:AM25LS2518PC、AM25LS2518DC、AM25LS2518LM、AM25LS2518XC、AM25LS2518DM、AM25LS2518FM、AM25LS2518LC。描述及对比如下:
型号 AM25LS2518XM AM25LS2518PC AM25LS2518DC AM25LS2518LM AM25LS2518XC AM25LS2518DM AM25LS2518FM AM25LS2518LC
描述 D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16 D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PDIP16, PLASTIC, DIP-16 D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16 D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20 D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16 D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16 D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, FP-16 D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20
零件包装代码 DIE DIP DIP QLCC DIE DIP DFP QLCC
包装说明 DIE, DIE OR CHIP DIP, DIP16,.3 HERMETIC SEALED, CERDIP-16 QCCN, DIE, DIE OR CHIP HERMETIC SEALED, CERDIP-16 DFP, FL16,.3 QCCN, LCC20,.35SQ
针数 16 16 16 20 16 16 16 20
Reach Compliance Code unknown unknow unknow unknown unknown unknown unknown unknown
其他特性 STANDARD TOTEM OUTPUTS ALSO AVAILABLE STANDARD TOTEM OUTPUTS ALSO AVAILABLE STANDARD TOTEM OUTPUTS ALSO AVAILABLE STANDARD TOTEM OUTPUTS ALSO AVAILABLE STANDARD TOTEM OUTPUTS ALSO AVAILABLE STANDARD TOTEM OUTPUTS ALSO AVAILABLE STANDARD TOTEM OUTPUTS ALSO AVAILABLE STANDARD TOTEM OUTPUTS ALSO AVAILABLE
系列 TTL/H/L TTL/H/L LS TTL/H/L TTL/H/L LS TTL/H/L TTL/H/L
JESD-30 代码 R-XUUC-N16 R-PDIP-T16 R-CDIP-T16 S-PQCC-N20 R-XUUC-N16 R-CDIP-T16 R-XDFP-F16 S-PQCC-N20
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
位数 4 4 4 4 4 4 4 4
功能数量 1 1 1 1 1 1 1 1
端子数量 16 16 16 20 16 16 16 20
最高工作温度 125 °C 70 °C 70 °C 125 °C 70 °C 125 °C 125 °C 70 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 UNSPECIFIED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY UNSPECIFIED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED PLASTIC/EPOXY
封装代码 DIE DIP DIP QCCN DIE DIP DFP QCCN
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 UNCASED CHIP IN-LINE IN-LINE CHIP CARRIER UNCASED CHIP IN-LINE FLATPACK CHIP CARRIER
最大电源电流(ICC) 28 mA 28 mA 28 mA 28 mA 28 mA 28 mA 28 mA 28 mA
传播延迟(tpd) 40 ns 35 ns 35 ns 40 ns 35 ns 40 ns 40 ns 35 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.25 V 5.25 V 5.5 V 5.25 V 5.5 V 5.5 V 5.25 V
最小供电电压 (Vsup) 4.5 V 4.75 V 4.75 V 4.5 V 4.75 V 4.5 V 4.5 V 4.75 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES NO NO YES YES NO YES YES
技术 TTL TTL TTL TTL TTL TTL TTL TTL
温度等级 MILITARY COMMERCIAL COMMERCIAL MILITARY COMMERCIAL MILITARY MILITARY COMMERCIAL
端子形式 NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE FLAT NO LEAD
端子位置 UPPER DUAL DUAL QUAD UPPER DUAL DUAL QUAD
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
最小 fmax 25 MHz 30 MHz 30 MHz 25 MHz 30 MHz 25 MHz 25 MHz 30 MHz
厂商名称 AMD(超微) - AMD(超微) - AMD(超微) AMD(超微) AMD(超微) AMD(超微)
封装等效代码 DIE OR CHIP DIP16,.3 DIP16,.3 - DIE OR CHIP DIP16,.3 FL16,.3 LCC20,.35SQ
是否Rohs认证 - 不符合 不符合 - - 不符合 不符合 不符合
JESD-609代码 - e0 e0 - - e0 e0 e0
长度 - 19.304 mm 19.6215 mm 8.89 mm - 19.6215 mm - 8.89 mm
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
座面最大高度 - 5.08 mm 5.08 mm 2.54 mm - 5.08 mm - 2.54 mm
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子节距 - 2.54 mm 2.54 mm 1.27 mm - 2.54 mm 1.27 mm 1.27 mm
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 - 7.62 mm 7.62 mm 8.89 mm - 7.62 mm - 8.89 mm
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