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AM27C512-170LEB

UVPROM, 64KX8, 170ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32

器件类别:存储    存储   

厂商名称:AMD(超微)

厂商官网:http://www.amd.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
AMD(超微)
零件包装代码
QFJ
包装说明
WQCCN, LCC32,.45X.55
针数
32
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
170 ns
I/O 类型
COMMON
JESD-30 代码
R-CQCC-N32
JESD-609代码
e0
长度
13.97 mm
内存密度
524288 bit
内存集成电路类型
UVPROM
内存宽度
8
功能数量
1
端子数量
32
字数
65536 words
字数代码
64000
工作模式
ASYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-55 °C
组织
64KX8
输出特性
3-STATE
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
WQCCN
封装等效代码
LCC32,.45X.55
封装形状
RECTANGULAR
封装形式
CHIP CARRIER, WINDOW
并行/串行
PARALLEL
电源
5 V
认证状态
Not Qualified
座面最大高度
3.556 mm
最大待机电流
0.0001 A
最大压摆率
0.05 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
QUAD
宽度
11.43 mm
Base Number Matches
1
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FINAL
Am27C512
512 Kilobit (64 K x 8-Bit) CMOS EPROM
DISTINCTIVE CHARACTERISTICS
s
Fast access time
— Speed options as fast as 55 ns
s
Low power consumption
— 20 µA typical CMOS standby current
s
JEDEC-approved pinout
s
Single +5 V power supply
s
±10%
power supply tolerance standard
s
100% Flashrite™ programming
— Typical programming time of 8 seconds
s
Latch-up protected to 100 mA from –1 V to
V
CC
+ 1 V
s
High noise immunity
s
Versatile features for simple interfacing
— Both CMOS and TTL input/output compatibility
— Two line control functions
s
Standard 28-pin DIP, PDIP, and 32-pin PLCC
packages
GENERAL DESCRIPTION
The Am27C512 is a 512-Kbit, ultraviolet erasable pro-
grammable read-only memory. It is organized as 64K
words by 8 bits per word, operates from a single +5 V
supply, has a static standby mode, and features fast
single address location programming. Products are
available in windowed ceramic DIP packages, as well
as plastic one time programmable (OTP) PDIP and
PLCC packages.
Data can be typically accessed in less than 55 ns, al-
lowing high-performance microprocessors to operate
without any WAIT states. The device offers separate
Output Enable (OE#) and Chip Enable (CE#) controls,
thus eliminating bus contention in a multiple bus micro-
processor system.
AMD’s CMOS process technology provides high
speed, low power, and high noise immunity. Typical
power consumption is only 80 mW in active mode, and
100 µW in standby mode.
All signals are TTL levels, including programming sig-
nals. Bit locations may be programmed singly, in
blocks, or at random. The device supports AMD’s
Flashrite programming algorithm (100 µs pulses), re-
sulting in a typical programming time of 8 seconds.
BLOCK DIAGRAM
V
CC
V
SS
OE#/V
PP
CE#
Output Enable
Chip Enable
and
Prog Logic
Y
Decoder
A0–A15
Address
Inputs
Output
Buffers
Data Outputs
DQ0–DQ7
Y
Gating
X
Decoder
524,288
Bit Cell
Matrix
08140I-1
Publication#
08140
Rev:
I
Issue Date:
May 1998
Amendment/0
PRODUCT SELECTOR GUIDE
Family Part Number
Speed Options
V
CC
= 5.0 V
±
5%
V
CC
= 5.0 V
±
10%
-55
-55
55
55
35
-70
70
70
40
-90
90
90
40
-120
120
120
50
-150
150
150
50
-200
200
200
50
250
250
50
Am27C512
-255
Max Access Time (ns)
CE# (E#) Access (ns)
OE# (G#) Access (ns)
CONNECTION DIAGRAMS
Top View
DIP
A7
A12
A15
PLCC
V
CC
A14
A13
DU
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
A14
A13
A8
A9
A11
OE# (G#)/V
PP
A10
CE# (E#)
DQ7
DQ6
DQ5
DQ4
DQ3
08140I-2
4 3 2 1 32 31 30
A6
A5
A4
A3
A2
A1
A0
NC
DQ0
5
6
7
8
9
10
11
12
13
14 15 16 17 18 19 20
DQ1
DQ2
V
SS
DU
DQ3
DQ4
DQ5
29
28
27
26
25
24
23
22
21
A8
A9
A11
NC
OE# (G#)/V
PP
A10
CE# (E#)
DQ7
DQ6
08140I-3
Notes:
1. JEDEC nomenclature is in parenthesis.
2. Don’t use (DU) for PLCC.
PIN DESIGNATIONS
A0–A15
CE# (E#)
DQ0–DQ7
= Address Inputs
= Chip Enable Input
= Data Input/Outputs
LOGIC SYMBOL
16
A0–A15
DQ0–DQ7
CE# (E#)
OE# (G#)/
V
PP
08140I-4
8
OE# (G#)/V
PP
= Output Enable Input
Program Voltage Input
V
CC
V
SS
NC
= V
CC
Supply Voltage
= Ground
= No Internal Connection
2
Am27C512
ORDERING INFORMATION
UV EPROM Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed
by a combination of the following:
AM27C512
-55
D
C
B
OPTIONAL PROCESSING
Blank = Standard Processing
B
= Burn-In
TEMPERATURE RANGE
C = Commercial (0°C to +70
°
C)
I = Industrial (–40
°
C to +85
°
C)
E = Extended (–55°C to +125°C)
PACKAGE TYPE
D = 28-Pin Ceramic DIP (CDV028)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am27C512
512 Kilobit (65 K x 8-Bit) CMOS UV EPROM
Valid Combinations
Valid Combinations
AM27C512-55
V
CC
= 5.0 V
±
5%
AM27C512-55
V
CC
= 5.0 V
±
10%
AM27C512-70
DC, DCB, DI, DIB
AM27C512-90
AM27C512-120
AM27C512-150
AM27C512-200
AM27C512-255
V
CC
= 5.0 V
±
5%
DC, DCB, DI, DIB
DC, DCB, DI, DIB, DE, DEB
DC
DC, DCB
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
Am27C512
3
ORDERING INFORMATION
OTP EPROM Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed
by a combination of the following:
AM27C512
-70
P
C
OPTIONAL PROCESSING
Blank = Standard Processing
TEMPERATURE RANGE
C = Commercial (0
°
C to +70
°
C)
I = Industrial (–40
°
C to +85
°
C)
PACKAGE TYPE
P = 28-Pin Plastic DIP (PD 028)
J = 32-Pin Plastic Leaded Chip Carrier (PL 032)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am27C512
512 Kilobit (65 K x 8-Bit) CMOS OTP EPROM
Valid Combinations
AM27C512-55
V
CC
= 5.0 V
±
5%
AM27C512-55
V
CC
= 5.0 V
±
5%
AM27C512-70
AM27C512-90
AM27C512-120
AM27C512-150
AM27C512-200
AM27C512-255
V
CC
= 5.0 V
±
5%
JC, PC, JI, PI
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
JC, PC
4
Am27C512
FUNCTIONAL DESCRIPTION
Device Erasure
In order to clear all locations of their programmed con-
tents, the device must be exposed to an ultraviolet light
source. A dosage of 15 W seconds/cm
2
is required to
completely erase the device. This dosage can be ob-
tained by exposure to an ultraviolet lamp—wavelength
of 2537 Å—with intensity of 12,000 µW/cm
2
for 15 to 20
minutes. The device should be directly under and about
one inch from the source, and all filters should be re-
moved from the UV light source prior to erasure.
Note that all UV erasable devices will erase with light
sources having wavelengths shorter than 4000 Å, such
as fluorescent light and sunlight. Although the erasure
process happens over a much longer time period, ex-
posure to any light source should be prevented for
maximum system reliability. Simply cover the package
window with an opaque label or substance.
OE#/V
PP
= 12.75 V
±
0.25 V, will program that particu-
lar device. A high-level CE# input inhibits the other de-
vices from being programmed.
Program Verify
A verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verify should be performed with OE#/V
PP
and CE#
at V
IL
, and V
PP
between 12.5 V and 13.0 V.
Autoselect Mode
The autoselect mode provides manufacturer and de-
vice identification through identifier codes on DQ0–
DQ7. This mode is primarily intended for programming
equipment to automatically match a device to be pro-
grammed with its corresponding programming algo-
rithm. This mode is functional in the 25°C
±
5°C
ambient temperature range that is required when pro-
gramming the device.
To activate this mode, the programming equipment
must force V
H
on address line A9. Two identifier bytes
may then be sequenced from the device outputs by tog-
gling address line A0 from V
IL
to V
IH
(that is, changing
the address from 00h to 01h). All other address lines
must be held at V
IL
during the autoselect mode.
Byte 0 (A0 = V
IL
) represents the manufacturer code,
and Byte 1 (A0 = V
IH
), the device identifier code. Both
codes have odd parity, with DQ7 as the parity bit.
Device Programming
Upon delivery, or after each erasure, the device has
all of its bits in the “ONE”, or HIGH state. “ZEROs” are
loaded into the device through the programming pro-
cedure.
The device enters the programming mode when 12.75
V
±
0.25 V is applied to the OE#/V
PP
pin, and CE# is at
V
IL
.
For programming, the data to be programmed is ap-
plied 8 bits in parallel to the data pins.
The flowchar t in the Programming section of the
EPROM Products Data Book (Section 5, Figure 5-1)
shows AMD’s Flashrite algorithm. The Flashrite algo-
rithm reduces programming time by using a 100 µs pro-
gramming pulse and by giving each address only as
many pulses to reliably program the data. After each
pulse is applied to a given address, the data in that ad-
dress is verified. If the data does not verify, additional
pulses are given until it verifies or the maximum pulses
allowed is reached. This process is repeated while se-
quencing through each address of the device. This part
of the algorithm is done at V
CC
= 6.25 V to assure that
each EPROM bit is programmed to a sufficiently high
threshold voltage. After the final address is completed,
the entire EPROM memory is verified at V
CC
= V
PP
=
5.25 V.
Please refer to Section 5 of the EPROM Products Data
Book for additional programming information and spec-
ifications.
Read Mode
To obtain data at the device outputs, Chip Enable (CE#)
and Output Enable (OE#/V
PP
) must be driven low. CE#
controls the power to the device and is typically used to
select the device. OE#/V
PP
enables the device to out-
put data, independent of device selection. Addresses
must be stable for at least t
ACC
–t
OE
. Refer to the
Switching Waveforms section for the timing diagram.
Standby Mode
The device enters the CMOS standby mode when CE#
is at V
CC
±
0.3 V. Maximum V
CC
current is reduced to
100 µA. The device enters the TTL-standby mode
when CE# is at V
IH
. Maximum V
CC
current is reduced
to 1.0 mA. When in either standby mode, the device
places its outputs in a high-impedance state, indepen-
dent of the OE# input.
Output OR-Tieing
To accommodate multiple memory connections, a
two-line control function provides:
s
Low memory power dissipation, and
s
Assurance that output bus contention will not occur.
CE# should be decoded and used as the primary de-
vice-selecting function, while OE#/V
PP
be made a com-
Program Inhibit
Programming different data to multiple devices in par-
allel is easily accomplished. Except for CE#, all like in-
puts of the devices may be common. A TTL low-level
program pulse applied to one device’s CE# input with
Am27C512
5
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