OTP ROM, 64KX8, 90ns, CMOS, PDIP28, PLASTIC, DIP-28
厂商名称:AMD(超微)
厂商官网:http://www.amd.com
下载文档型号 | AM27C512-90PI | AM27C512-90JI | AM27C512-55PC5 | AM27C512-55JC5 | AM27C512-200JI | AM27C512-55DC5 | AM27C512-200JC | AM27C512-150PI | AM27C512-70JI | AM27C512-70JC |
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描述 | OTP ROM, 64KX8, 90ns, CMOS, PDIP28, PLASTIC, DIP-28 | OTP ROM, 64KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 64KX8, 55ns, CMOS, PDIP28, PLASTIC, DIP-28 | OTP ROM, 64KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 64KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | UVPROM, 64KX8, 55ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | OTP ROM, 64KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28 | OTP ROM, 64KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 64KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | QFJ | DIP | QFJ | QFJ | DIP | QFJ | DIP | QFJ | QFJ |
包装说明 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | WDIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
针数 | 28 | 32 | 28 | 32 | 32 | 28 | 32 | 28 | 32 | 32 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 90 ns | 90 ns | 55 ns | 55 ns | 200 ns | 55 ns | 200 ns | 150 ns | 70 ns | 70 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 | R-CDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 |
长度 | 37.084 mm | 13.97 mm | 37.084 mm | 13.97 mm | 13.97 mm | 37.1475 mm | 13.97 mm | 37.084 mm | 13.97 mm | 13.97 mm |
内存密度 | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | UVPROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 32 | 28 | 32 | 32 | 28 | 32 | 28 | 32 | 32 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | QCCJ | DIP | QCCJ | QCCJ | WDIP | QCCJ | DIP | QCCJ | QCCJ |
封装等效代码 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 220 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.715 mm | 3.55 mm | 5.715 mm | 3.55 mm | 3.55 mm | 5.588 mm | 3.55 mm | 5.715 mm | 3.55 mm | 3.55 mm |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
最大压摆率 | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | YES | NO | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | J BEND |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 15.24 mm | 11.43 mm | 15.24 mm | 11.43 mm | 11.43 mm | 15.24 mm | 11.43 mm | 15.24 mm | 11.43 mm | 11.43 mm |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |