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AM27C512-90PI

OTP ROM, 64KX8, 90ns, CMOS, PDIP28, PLASTIC, DIP-28

器件类别:存储    存储   

厂商名称:AMD(超微)

厂商官网:http://www.amd.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
零件包装代码
DIP
包装说明
DIP, DIP28,.6
针数
28
Reach Compliance Code
unknow
ECCN代码
EAR99
最长访问时间
90 ns
I/O 类型
COMMON
JESD-30 代码
R-PDIP-T28
JESD-609代码
e0
长度
37.084 mm
内存密度
524288 bi
内存集成电路类型
OTP ROM
内存宽度
8
功能数量
1
端子数量
28
字数
65536 words
字数代码
64000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
64KX8
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP28,.6
封装形状
RECTANGULAR
封装形式
IN-LINE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
5 V
认证状态
Not Qualified
座面最大高度
5.715 mm
最大待机电流
0.0001 A
最大压摆率
0.025 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
15.24 mm
Base Number Matches
1
文档预览
FINAL
Am27C512
512 Kilobit (64 K x 8-Bit) CMOS EPROM
DISTINCTIVE CHARACTERISTICS
n
Fast access time
— Speed options as fast as 55 ns
n
Low power consumption
— 20 µA typical CMOS standby current
n
JEDEC-approved pinout
n
Single +5 V power supply
n
±10%
power supply tolerance standard
n
100% Flashrite™ programming
— Typical programming time of 8 seconds
n
Latch-up protected to 100 mA from –1 V to
V
CC
+ 1 V
n
High noise immunity
n
Versatile features for simple interfacing
— Both CMOS and TTL input/output compatibility
— Two line control functions
n
Standard 28-pin DIP, PDIP, and 32-pin PLCC
packages
GENERAL DESCRIPTION
The Am27C512 is a 512-Kbit, ultraviolet erasable pro-
grammable read-only memory. It is organized as 64K
words by 8 bits per word, operates from a single +5 V
supply, has a static standby mode, and features fast
single address location programming. Products are
available in windowed ceramic DIP packages, as well
as plastic one time programmable (OTP) PDIP and
PLCC packages.
Data can be typically accessed in less than 55 ns, al-
lowing high-performance microprocessors to operate
without any WAIT states. The device offers separate
Output Enable (OE#) and Chip Enable (CE#) controls,
thus eliminating bus contention in a multiple bus micro-
processor system.
AMD’s CMOS process technology provides high
speed, low power, and high noise immunity. Typical
power consumption is only 80 mW in active mode, and
100 µW in standby mode.
All signals are TTL levels, including programming sig-
nals. Bit locations may be programmed singly, in
blocks, or at random. The device supports AMD’s
Flashrite programming algorithm (100 µs pulses), re-
sulting in a typical programming time of 8 seconds.
BLOCK DIAGRAM
V
CC
V
SS
OE#/V
PP
CE#
Output Enable
Chip Enable
and
Prog Logic
Y
Decoder
A0–A15
Address
Inputs
Output
Buffers
Data Outputs
DQ0–DQ7
Y
Gating
X
Decoder
524,288
Bit Cell
Matrix
08140J-1
Publication#
08140
Rev:
J
Amendment/+2
Issue Date:
June 1, 1999
PRODUCT SELECTOR GUIDE
Family Part Number
Speed Options
V
CC
= 5.0 V
±
5%
V
CC
= 5.0 V
±
10%
-55
-55
55
55
35
-70
70
70
40
-90
90
90
40
-120
120
120
50
-150
150
150
50
-200
200
200
50
250
250
50
Am27C512
-255
Max Access Time (ns)
CE# (E#) Access (ns)
OE# (G#) Access (ns)
CONNECTION DIAGRAMS
Top View
DIP
A7
A12
A15
PLCC
V
CC
A14
A13
DU
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
A14
A13
A8
A9
A11
OE# (G#)/V
PP
A10
CE# (E#)
DQ7
DQ6
DQ5
DQ4
DQ3
08140J-2
4 3 2 1 32 31 30
A6
A5
A4
A3
A2
A1
A0
NC
DQ0
5
6
7
8
9
10
11
12
13
14 15 16 17 18 19 20
DQ1
DQ2
V
SS
DU
DQ3
DQ4
DQ5
29
28
27
26
25
24
23
22
21
A8
A9
A11
NC
OE# (G#)/V
PP
A10
CE# (E#)
DQ7
DQ6
08140J-3
Notes:
1. JEDEC nomenclature is in parenthesis.
2. Don’t use (DU) for PLCC.
PIN DESIGNATIONS
A0–A15
CE# (E#)
DQ0–DQ7
= Address Inputs
= Chip Enable Input
= Data Input/Outputs
LOGIC SYMBOL
16
A0–A15
DQ0–DQ7
CE# (E#)
OE# (G#)/
V
PP
08140J-4
8
OE# (G#)/V
PP
= Output Enable Input
Program Voltage Input
V
CC
V
SS
NC
= V
CC
Supply Voltage
= Ground
= No Internal Connection
2
Am27C512
ORDERING INFORMATION
UV EPROM Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed
by a combination of the following:
AM27C512
-55
D
C
5
B
OPTIONAL PROCESSING
Blank = Standard Processing
B
= Burn-In
VOLTAGE TOLERANCE
5 = V
CC
±5%
See Product Selector Guide and Valid Combinations
TEMPERATURE RANGE
C = Commercial (0°C to +70
°
C)
I = Industrial (–40
°
C to +85
°
C)
E = Extended (–55°C to +125°C)
PACKAGE TYPE
D = 28-Pin Ceramic DIP (CDV028)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am27C512
512 Kilobit (64 K x 8-Bit) CMOS UV EPROM
Valid Combinations
AM27C512-55
V
CC
= 5.0 V
±
5%
AM27C512-55
V
CC
= 5.0 V
±
10%
AM27C512-70
DC, DCB, DI, DIB
AM27C512-90
AM27C512-120
AM27C512-150
AM27C512-200
AM27C512-255
V
CC
= 5.0 V
±
5%
DC, DCB, DI, DIB
DC, DCB, DI, DIB, DE, DEB
DC5
DC, DCB
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
Am27C512
3
ORDERING INFORMATION
OTP EPROM Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed
by a combination of the following:
AM27C512
-55
P
C
5
B
OPTIONAL PROCESSING
Blank = Standard Processing
VOLTAGE TOLERANCE
5 = V
CC
±5%
See Product Selector Guide and Valid Combinations
TEMPERATURE RANGE
C = Commercial (0°C to +70
°
C)
I = Industrial (–40
°
C to +85
°
C)
E = Extended (–55°C to +125°C)
PACKAGE TYPE
P = 28-Pin Plastic DIP (PD 028)
J = 32-Pin Plastic Leaded Chip Carrier (PL 032)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am27C512
512 Kilobit (64 K x 8-Bit) CMOS OTP EPROM
Valid Combinations
AM27C512-55
V
CC
= 5.0 V
±
5%
AM27C512-55
V
CC
= 5.0 V
±
10%
AM27C512-70
AM27C512-90
AM27C512-120
AM27C512-150
AM27C512-200
AM27C512-255
V
CC
= 5.0 V
±
5%
JC, PC, JI, PI
JC5, PC5
JC, PC
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
4
Am27C512
FUNCTIONAL DESCRIPTION
Device Erasure
In order to clear all locations of their programmed con-
tents, the device must be exposed to an ultraviolet light
source. A dosage of 15 W seconds/cm
2
is required to
completely erase the device. This dosage can be ob-
tained by exposure to an ultraviolet lamp—wavelength
of 2537 Å—with intensity of 12,000 µW/cm
2
for 15 to 20
minutes. The device should be directly under and
about one inch from the source, and all filters should be
removed from the UV light source prior to erasure.
Note that all UV erasable devices will erase with light
sources having wavelengths shorter than 4000 Å, such
as fluorescent light and sunlight. Although the erasure
process happens over a much longer time period, ex-
posure to any light source should be prevented for
maximum system reliability. Simply cover the package
window with an opaque label or substance.
OE#/V
PP
= 12.75 V
±
0.25 V, will program that particu-
lar device. A high-level CE# input inhibits the other de-
vices from being programmed.
Program Verify
A verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verify should be performed with OE#/V
PP
and CE#
at V
IL
, and V
PP
between 12.5 V and 13.0 V.
Autoselect Mode
The autoselect mode provides manufacturer and de-
vice identification through identifier codes on DQ0–
DQ7. This mode is primarily intended for programming
equipment to automatically match a device to be pro-
grammed with its corresponding programming algo-
rithm. This mode is functional in the 25°C
±
5°C
ambient temperature range that is required when pro-
gramming the device.
To activate this mode, the programming equipment
must force V
H
on address line A9. Two identifier bytes
may then be sequenced from the device outputs by
toggling address line A0 from V
IL
to V
IH
(that is, chang-
ing the address from 00h to 01h). All other address
lines must be held at V
IL
during the autoselect mode.
Byte 0 (A0 = V
IL
) represents the manufacturer code,
and Byte 1 (A0 = V
IH
), the device identifier code. Both
codes have odd parity, with DQ7 as the parity bit.
Device Programming
Upon delivery, or after each erasure, the device has
all of its bits in the “ONE”, or HIGH state. “ZEROs” are
loaded into the device through the programming pro-
cedure.
The device enters the programming mode when 12.75
V
±
0.25 V is applied to the OE#/V
PP
pin, and CE# is at
V
IL
.
For programming, the data to be programmed is ap-
plied 8 bits in parallel to the data pins.
The flowchart in the Programming section of the
EPROM Products Data Book (Section 5, Figure 5-1)
shows AMD’s Flashrite algorithm. The Flashrite algo-
rithm reduces programming time by using a 100 µs pro-
gramming pulse and by giving each address only as
many pulses to reliably program the data. After each
pulse is applied to a given address, the data in that ad-
dress is verified. If the data does not verify, additional
pulses are given until it verifies or the maximum pulses
allowed is reached. This process is repeated while se-
quencing through each address of the device. This part
of the algorithm is done at V
CC
= 6.25 V to assure that
each EPROM bit is programmed to a sufficiently high
threshold voltage. After the final address is completed,
the entire EPROM memory is verified at V
CC
= V
PP
=
5.25 V.
Please refer to Section 5 of the EPROM Products Data
Book for additional programming information and spec-
ifications.
Read Mode
To obtain data at the device outputs, Chip Enable
(CE#) and Output Enable (OE#/V
PP
) must be driven
low. CE# controls the power to the device and is typi-
cally used to select the device. OE#/V
PP
enables the
device to output data, independent of device selection.
Addresses must be stable for at least t
ACC
–t
OE
. Refer
to the Switching Waveforms section for the timing dia-
gram.
Standby Mode
The device enters the CMOS standby mode when CE#
is at V
CC
±
0.3 V. Maximum V
CC
current is reduced to
100 µA. The device enters the TTL-standby mode
when CE# is at V
IH
. Maximum V
CC
current is reduced
to 1.0 mA. When in either standby mode, the device
places its outputs in a high-impedance state, indepen-
dent of the OE# input.
Output OR-Tieing
To accommodate multiple memory connections, a
two-line control function provides:
n
Low memory power dissipation, and
n
Assurance that output bus contention will not occur.
Program Inhibit
Programming different data to multiple devices in par-
allel is easily accomplished. Except for CE#, all like in-
puts of the devices may be common. A TTL low-level
program pulse applied to one device’s CE# input with
Am27C512
5
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参数对比
与AM27C512-90PI相近的元器件有:AM27C512-90JI、AM27C512-55PC5、AM27C512-55JC5、AM27C512-200JI、AM27C512-55DC5、AM27C512-200JC、AM27C512-150PI、AM27C512-70JI、AM27C512-70JC。描述及对比如下:
型号 AM27C512-90PI AM27C512-90JI AM27C512-55PC5 AM27C512-55JC5 AM27C512-200JI AM27C512-55DC5 AM27C512-200JC AM27C512-150PI AM27C512-70JI AM27C512-70JC
描述 OTP ROM, 64KX8, 90ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 55ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 UVPROM, 64KX8, 55ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 OTP ROM, 64KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DIP QFJ DIP QFJ QFJ DIP QFJ DIP QFJ QFJ
包装说明 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 WDIP, DIP28,.6 QCCJ, LDCC32,.5X.6 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6
针数 28 32 28 32 32 28 32 28 32 32
Reach Compliance Code unknow unknow unknow unknow unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 90 ns 90 ns 55 ns 55 ns 200 ns 55 ns 200 ns 150 ns 70 ns 70 ns
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PDIP-T28 R-PQCC-J32 R-PDIP-T28 R-PQCC-J32 R-PQCC-J32 R-CDIP-T28 R-PQCC-J32 R-PDIP-T28 R-PQCC-J32 R-PQCC-J32
长度 37.084 mm 13.97 mm 37.084 mm 13.97 mm 13.97 mm 37.1475 mm 13.97 mm 37.084 mm 13.97 mm 13.97 mm
内存密度 524288 bi 524288 bi 524288 bi 524288 bi 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
内存集成电路类型 OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM UVPROM OTP ROM OTP ROM OTP ROM OTP ROM
内存宽度 8 8 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 28 32 28 32 32 28 32 28 32 32
字数 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000 64000 64000 64000 64000 64000 64000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C
组织 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP QCCJ DIP QCCJ QCCJ WDIP QCCJ DIP QCCJ QCCJ
封装等效代码 DIP28,.6 LDCC32,.5X.6 DIP28,.6 LDCC32,.5X.6 LDCC32,.5X.6 DIP28,.6 LDCC32,.5X.6 DIP28,.6 LDCC32,.5X.6 LDCC32,.5X.6
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE, WINDOW CHIP CARRIER IN-LINE CHIP CARRIER CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 220 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.715 mm 3.55 mm 5.715 mm 3.55 mm 3.55 mm 5.588 mm 3.55 mm 5.715 mm 3.55 mm 3.55 mm
最大待机电流 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
最大压摆率 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.25 V 5.25 V 5.5 V 5.25 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.75 V 4.75 V 4.5 V 4.75 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES NO YES YES NO YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子形式 THROUGH-HOLE J BEND THROUGH-HOLE J BEND J BEND THROUGH-HOLE J BEND THROUGH-HOLE J BEND J BEND
端子节距 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
端子位置 DUAL QUAD DUAL QUAD QUAD DUAL QUAD DUAL QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 15.24 mm 11.43 mm 15.24 mm 11.43 mm 11.43 mm 15.24 mm 11.43 mm 15.24 mm 11.43 mm 11.43 mm
JESD-609代码 e0 - e0 e0 e0 e0 e0 e0 e0 e0
端子面层 Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Base Number Matches 1 1 1 1 1 1 1 1 1 -
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