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AM29BDS640HF9VMF

Flash, 4MX16, 45ns, PBGA64, FBGA-64

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

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器件参数
参数名称
属性值
厂商名称
SPANSION
零件包装代码
BGA
包装说明
FBGA-64
针数
64
Reach Compliance Code
unknown
ECCN代码
3A991.B.1.A
最长访问时间
45 ns
其他特性
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 代码
R-PBGA-B64
JESD-609代码
e1
长度
8.95 mm
内存密度
67108864 bit
内存集成电路类型
FLASH
内存宽度
16
湿度敏感等级
3
功能数量
1
端子数量
64
字数
4194304 words
字数代码
4000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
4MX16
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行
PARALLEL
峰值回流温度(摄氏度)
240
编程电压
1.8 V
认证状态
Not Qualified
座面最大高度
1 mm
最大供电电压 (Vsup)
1.95 V
最小供电电压 (Vsup)
1.65 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN SILVER COPPER
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
类型
NOR TYPE
宽度
7.95 mm
Base Number Matches
1
参数对比
与AM29BDS640HF9VMF相近的元器件有:AM29BDS128HF9VKF、AM29BDS128HF8VKI、AM29BDS128HF9VKI、AM29BDS128HF8VKF、AM29BDS640HF8VMF、AM29BDS640HF8VMI、AM29BDS640HF9VMI。描述及对比如下:
型号 AM29BDS640HF9VMF AM29BDS128HF9VKF AM29BDS128HF8VKI AM29BDS128HF9VKI AM29BDS128HF8VKF AM29BDS640HF8VMF AM29BDS640HF8VMI AM29BDS640HF9VMI
描述 Flash, 4MX16, 45ns, PBGA64, FBGA-64 Flash, 8MX16, 45ns, PBGA80, FBGA-80 Flash, 8MX16, 45ns, PBGA80, FBGA-80 Flash, 8MX16, 45ns, PBGA80, FBGA-80 Flash, 8MX16, 45ns, PBGA80, FBGA-80 Flash, 4MX16, 45ns, PBGA64, FBGA-64 Flash, 4MX16, 45ns, PBGA64, FBGA-64 Flash, 4MX16, 45ns, PBGA64, FBGA-64
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 FBGA-64 FBGA-80 VFBGA, VFBGA, FBGA-80 FBGA-64 FBGA-64 FBGA-64
针数 64 80 80 80 80 64 64 64
Reach Compliance Code unknown unknown compliant compliant unknown unknown compliant compliant
ECCN代码 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
最长访问时间 45 ns 45 ns 45 ns 45 ns 45 ns 45 ns 45 ns 45 ns
其他特性 SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 代码 R-PBGA-B64 R-PBGA-B80 R-PBGA-B80 R-PBGA-B80 R-PBGA-B80 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64
长度 8.95 mm 11.5 mm 11.5 mm 11.5 mm 11.5 mm 8.95 mm 8.95 mm 8.95 mm
内存密度 67108864 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 67108864 bit 67108864 bit 67108864 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1
端子数量 64 80 80 80 80 64 64 64
字数 4194304 words 8388608 words 8388608 words 8388608 words 8388608 words 4194304 words 4194304 words 4194304 words
字数代码 4000000 8000000 8000000 8000000 8000000 4000000 4000000 4000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 4MX16 8MX16 8MX16 8MX16 8MX16 4MX16 4MX16 4MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA VFBGA VFBGA VFBGA VFBGA VFBGA VFBGA VFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 240 240 240 240 240 240 240
编程电压 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
最大供电电压 (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
最小供电电压 (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30
宽度 7.95 mm 9 mm 9 mm 9 mm 9 mm 7.95 mm 7.95 mm 7.95 mm
Base Number Matches 1 1 1 1 1 1 1 1
厂商名称 SPANSION - SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION
JESD-609代码 e1 e1 e0 e0 e1 - e0 e0
湿度敏感等级 3 3 - - 3 3 3 3
端子面层 TIN SILVER COPPER TIN SILVER COPPER TIN LEAD TIN LEAD TIN SILVER COPPER - TIN LEAD TIN LEAD
类型 NOR TYPE NOR TYPE - - NOR TYPE NOR TYPE NOR TYPE NOR TYPE
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