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AM29F032B150SI

4MX8 FLASH 5V PROM, 150ns, PDSO44, SOP-44

器件类别:存储    存储   

厂商名称:AMD(超微)

厂商官网:http://www.amd.com

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器件参数
参数名称
属性值
厂商名称
AMD(超微)
零件包装代码
SOIC
包装说明
SOP,
针数
44
Reach Compliance Code
unknown
最长访问时间
150 ns
JESD-30 代码
R-PDSO-G44
内存密度
33554432 bit
内存集成电路类型
FLASH
内存宽度
8
功能数量
1
端子数量
44
字数
4194304 words
字数代码
4000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
4MX8
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
PARALLEL
编程电压
5 V
认证状态
Not Qualified
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子位置
DUAL
文档预览
Am29F032B
32 Megabit (4 M x 8-Bit)
CMOS 5.0 Volt-only, Uniform Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
5.0 V ± 10%, single power supply operation
— Minimizes system level power requirements
s
Manufactured on 0.32 µm process technology
s
High performance
— Access times as fast as 70 ns
s
Low power consumption
— 30 mA typical active read current
— 30 mA typical program/erase current
— <1 µA typical standby current (standard access
time to active mode)
s
Flexible sector architecture
— 64 uniform sectors of 64 Kbytes each
— Any combination of sectors can be erased.
— Supports full chip erase
— Group sector protection:
— A hardware method of locking sector groups to
prevent any program or erase operations within
that sector group
— Temporary Sector Group Unprotect allows code
changes in previously locked sectors
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies bytes at specified addresses
s
Minimum 1,000,000 write/erase cycles
guaranteed
s
20-year data retention at 125°C
— Reliable operation for the life of the system
s
Package options
— 40-pin TSOP
— 44-pin SO
s
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply Flash standard
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting program
or erase cycle completion
s
Ready/Busy output (RY/BY#)
— Provides a hardware method for detecting
program or erase cycle completion
s
Erase Suspend/Resume
— Suspends a sector erase operation to read data
from, or program data to, a non-erasing sector,
then resumes the erase operation
s
Hardware reset pin (RESET#)
— Resets internal state machine to the read mode
This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication#
21610
Rev:
D
Amendment/+1
Issue Date:
December 5, 2000
GENERAL DESCRIPTION
The Am29F032B is a 32 Mbit, 5.0 volt-only Flash
memory organized as 4,194,304 bytes of 8 bits each.
The 4 Mbytes of data are divided into 64 sectors of 64
Kbytes each for flexible erase capability. The 8 bits of
data appear on DQ0–DQ7. The Am29F032B is offered
in 40-pin TSOP and 44-pin SO packages. The
Am29F032B is manufactured using AMD’s 0.32 µm
process technology. This device is designed to be pro-
grammed in-system with the standard system 5.0 volt
V
CC
supply. A 12.0 volt V
PP
is not required for program
or erase operations. The device can also be pro-
grammed in standard EPROM programmers.
The standard device offers access times of 70, 90,
120, and 150 ns, allowing high-speed microprocessors
to operate without wait states. To eliminate bus con-
tention, the device has separate chip enable (CE#),
write enable (WE#), and output enable (OE#) controls.
The device is entirely command set compatible with
the JEDEC single-power-supply Flash standard. Com-
mands are written to the command register using stan-
dard microprocessor write timings. Register contents
serve as input to an internal state machine that con-
trols the erase and programming circuitry. Write cycles
also internally latch addresses and data needed for
the programming and erase operations. Reading data
out of the device is similar to reading from 12.0 volt
Flash or EPROM devices.
The device is programmed by executing the program
command sequence. This invokes the Embedded Pro-
gram algorithm—an internal algorithm that automati-
cally times the program pulse widths and verifies
proper cell margin. The device is erased by executing
the erase command sequence. This invokes the Em-
bedded Erase algorithm—an internal algorithm that
automatically preprograms the array (if it is not already
programmed) before executing the erase operation.
During erase, the device automatically times the erase
pulse widths and verifies proper cell margin.
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. A sector is typically
erased and verified within one second. The device is
erased when shipped from the factory.
The hardware sector group protection feature disables
both program and erase operations in any combination
of the eight sector groups of memory. A sector group
consists of four adjacent sectors.
The Erase Suspend feature enables the system to put
erase on hold for any period of time to read data from,
or program data to, a sector that is not being erased.
True background erase can thus be achieved.
The device requires only a single 5.0 volt power supply
for both read and write functions. Internally generated
and regulated voltages are provided for the program
and erase operations. A low V
CC
detector automati-
cally inhibits write operations during power transitions.
The host system can detect whether a program or
erase cycle is complete by using the RY/BY# pin, the
DQ7 (Data# Polling) or DQ6 (toggle) status bits. After
a program or erase cycle has been completed, the de-
vice automatically returns to the read mode.
A hardware RESET# pin terminates any operation in
progress. The internal state machine is reset to the
read mode. The RESET# pin may be tied to the sys-
tem reset circuitry. Therefore, if a system reset occurs
during either an Embedded Program or Embedded
Erase algorithm, the device is automatically reset to the
read mode. This enables the system’s microprocessor
to read the boot-up firmware from the Flash memory.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
h i g h e s t l eve l s o f q u a l i t y, r e l i a b i l i t y, a n d c o s t
effectiveness. The device electrically erases all bits
within a sector simultaneously via Fowler-Nordheim
tunneling. The bytes are programmed one byte at
a time using the programming mechanism of hot
electron injection.
2
Am29F032B
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . .
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .
Device Bus Operations . . . . . . . . . . . . . . . . . . . . .
Requirements for Reading Array Data .....................................
Writing Commands/Command Sequences ..............................
Program and Erase Operation Status ......................................
Standby Mode ..........................................................................
RESET#: Hardware Reset Pin .................................................
Output Disable Mode................................................................
4
4
5
6
6
7
8
8
8
9
9
9
9
DQ3: Sector Erase Timer ....................................................... 20
Figure 5. Toggle Bit Algorithm........................................................ 20
Table 6. Write Operation Status..................................................... 21
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 22
Figure 6. Maximum Negative Overshoot Waveform ...................... 22
Figure 7. Maximum Positive Overshoot Waveform........................ 22
Table 1. Am29F032B Device Bus Operations .................................. 8
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 22
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23
TTL/NMOS Compatible .......................................................... 23
CMOS Compatible.................................................................. 23
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 8. Test Setup...................................................................... 24
Table 7. Test Specifications ........................................................... 24
Table 2. Am29F032B Sector Address Table................................... 10
Autoselect Mode..................................................................... 11
Table 3. Am29F032B Autoselect Codes ......................................... 11
Key To Switching Waveforms . . . . . . . . . . . . . . . 24
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25
Read-only Operations............................................................. 25
Figure 9. Read Operation Timings ................................................. 25
Sector Group Protection/Unprotection.................................... 12
Table 4. Sector Group Addresses................................................... 12
Hardware Reset (RESET#) .................................................... 26
Figure 10. RESET# Timings .......................................................... 26
Temporary Sector Group Unprotect ....................................... 12
Figure 1. Temporary Sector Group Unprotect Operation................ 12
Write (Erase/Program) Operations ......................................... 27
Figure 11. Program Operation Timings..........................................
Figure 12. Chip/Sector Erase Operation Timings ..........................
Figure 13. Data# Polling Timings (During Embedded Algorithms).
Figure 14. Toggle Bit Timings (During Embedded Algorithms)......
Figure 15. DQ2 vs. DQ6.................................................................
28
29
30
30
31
Hardware Data Protection ...................................................... 13
Low VCC Write Inhibit..................................................................... 13
Write Pulse “Glitch” Protection ........................................................ 13
Logical Inhibit .................................................................................. 13
Power-Up Write Inhibit .................................................................... 13
Temporary Sector Unprotect .................................................. 31
Figure 16. Temporary Sector Group Unprotect Timings ................ 31
Command Definitions . . . . . . . . . . . . . . . . . . . . . 13
Reading Array Data ................................................................ 13
Reset Command..................................................................... 13
Autoselect Command Sequence ............................................ 14
Byte Program Command Sequence....................................... 14
Chip Erase Command Sequence ........................................... 14
Figure 2. Program Operation .......................................................... 15
Write (Erase/Program) Operations—Alternate CE#
Controlled Writes .................................................................... 32
Figure 17. Alternate CE# Controlled Write Operation Timings ...... 33
Sector Erase Command Sequence ........................................ 15
Erase Suspend/Erase Resume Commands........................... 15
Figure 3. Erase Operation............................................................... 16
Command Definitions ............................................................. 17
Table 5. Am29F032B Command Definitions................................... 17
Write Operation Status . . . . . . . . . . . . . . . . . . . . 18
DQ7: Data# Polling................................................................. 18
Figure 4. Data# Polling Algorithm ................................................... 18
RY/BY#: Ready/Busy# ...........................................................
DQ6: Toggle Bit I ....................................................................
DQ2: Toggle Bit II ...................................................................
Reading Toggle Bits DQ6/DQ2 ..............................................
DQ5: Exceeded Timing Limits ................................................
19
19
19
19
20
Erase And Programming Performance . . . . . . . 34
Latchup Characteristic . . . . . . . . . . . . . . . . . . . . 34
TSOP And SO Pin Capacitance . . . . . . . . . . . . . 34
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 35
SO 044–44-Pin Small Outline Package.................................. 35
TS 040–40-Pin Standard Thin Small Outline Package........... 36
TSR040–40-Pin Reversed Thin Small Outline Package ........ 37
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 38
Revision A (June 1998) .......................................................... 38
Revision B (July 1998)............................................................ 38
Revision C (January 1999) ..................................................... 38
Revision C+1 (April 14, 1999)................................................. 38
Revision D (November 17, 1999) ........................................... 38
Revision D+1 (December 5, 2000) ......................................... 38
Am29F032B
3
PRODUCT SELECTOR GUIDE
Family Part Number
Speed Options
Max access time, ns (t
ACC
)
Max CE# access time, ns (t
CE
)
Max OE# access time, ns (t
OE
)
V
CC
= 5.0 V
±
5%
V
CC
= 5.0 V
±
10%
70
70
40
-75
-90
90
90
40
-120
120
120
50
-150
150
150
75
Am29F032B
Note:
See “AC Characteristics” for full specifications.
BLOCK DIAGRAM
DQ0
DQ7
V
CC
V
SS
RY/BY#
RESET#
State
Control
Command
Register
Sector Switches
Erase Voltage
Generator
Input/Output
Buffers
WE#
PGM Voltage
Generator
Chip Enable
Output Enable
STB
Data
Latch
CE#
OE#
STB
V
CC
Detector
Timer
Address Latch
Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
A0–A21
4
Am29F032B
CONNECTION DIAGRAMS
A19
A18
A17
A16
A15
A14
A13
A12
CE#
V
CC
NC
RESET#
A11
A10
A9
A8
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
A20
A21
WE#
OE#
RY/BY#
DQ7
DQ6
DQ5
DQ4
V
CC
V
SS
V
SS
DQ3
DQ2
DQ1
DQ0
A0
A1
A2
A3
40-Pin Standard TSOP
A20
A21
WE#
OE#
RY/BY#
DQ7
DQ6
DQ5
DQ4
V
CC
V
SS
V
SS
DQ3
DQ2
DQ1
DQ0
A0
A1
A2
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40-Pin Reverse TSOP
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
A19
A18
A17
A16
A15
A14
A13
A12
CE#
V
CC
NC
RESET#
A11
A10
A9
A8
A7
A6
A5
A4
NC
RESET#
A11
A10
A9
A8
A7
A6
A5
A4
NC
NC
A3
A2
A1
A0
DQ0
DQ1
DQ2
DQ3
V
SS
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
SO
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
V
CC
CE#
A12
A13
A14
A15
A16
A17
A18
A19
NC
NC
A20
A21
WE#
OE#
RY/BY#
DQ7
DQ6
DQ5
DQ4
V
CC
Am29F032B
5
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参数对比
与AM29F032B150SI相近的元器件有:AM29F032B150SE、AM29F032B150EI、AM29F032B150SC。描述及对比如下:
型号 AM29F032B150SI AM29F032B150SE AM29F032B150EI AM29F032B150SC
描述 4MX8 FLASH 5V PROM, 150ns, PDSO44, SOP-44 4MX8 FLASH 5V PROM, 150ns, PDSO44, SOP-44 4MX8 FLASH 5V PROM, 150ns, PDSO40, TSOP-40 4MX8 FLASH 5V PROM, 150ns, PDSO44, SOP-44
零件包装代码 SOIC SOIC TSOP SOIC
包装说明 SOP, SOP, SOP, SOP,
针数 44 44 40 44
Reach Compliance Code unknown unknown unknown unknown
最长访问时间 150 ns 150 ns 150 ns 150 ns
JESD-30 代码 R-PDSO-G44 R-PDSO-G44 R-PDSO-G40 R-PDSO-G44
内存密度 33554432 bit 33554432 bit 33554432 bit 33554432 bit
内存集成电路类型 FLASH FLASH FLASH FLASH
内存宽度 8 8 8 8
功能数量 1 1 1 1
端子数量 44 44 40 44
字数 4194304 words 4194304 words 4194304 words 4194304 words
字数代码 4000000 4000000 4000000 4000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 125 °C 85 °C 70 °C
最低工作温度 -40 °C -55 °C -40 °C -
组织 4MX8 4MX8 4MX8 4MX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP SOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL MILITARY INDUSTRIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING GULL WING
端子位置 DUAL DUAL DUAL DUAL
厂商名称 AMD(超微) AMD(超微) - AMD(超微)
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