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Am29LV320D

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not available for designs. For new and current designs,

S29AL032D supersedes Am29LV320D and is the factory-recommended migration path. Please refer

to the S29AL032D datasheet for specifications and ordering information. Availability of this docu-

ment is retained for reference and historical purposes only.

April 2005

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appro-

priate, and changes will be noted in a revision summary.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

23579

Revision

Amendment

Issue Date

December 14, 2005

THIS PAGE LEFT INTENTIONALLY BLANK.

Am29LV320D

32 Megabit (4 M x 8-Bit/2 M x 16-Bit)

CMOS 3.0 Volt-only, Boot Sector Flash Memory

This product has been retired and is not available for designs. For new and current designs, S29AL032D supersedes Am29LV320D and is the factory-recommended migration path. Please

refer to the S29AL032D datasheet for specifications and ordering information. Availability of this document is retained for reference and historical purposes only.

DISTINCTIVE CHARACTERISTICS

ARCHITECTURAL ADVANTAGES

Secured Silicon

— 64 Kbyte Sector Size; Replacement/substitute

devices (such as Mirrorbit

™

) have 256 bytes.

—

Factory locked and identifiable:

16 bytes (8 words)

available for secure, random factory Electronic Serial

Number; verifiable as factory locked through

autoselect function. ExpressFlash option allows

entire sector to be available for factory-secured data

—

Customer lockable:

Can be programmed once and

then permanently locked after being shipped from

AMD

Zero Power Operation

— Sophisticated power management circuits reduce

power consumed during inactive periods to nearly

zero.

Package options

— 48-pin TSOP

— 48-ball FBGA

Sector Architecture

— Eight 8 Kbyte sectors

— Sixty-three 64 Kbyte sectors

Top or bottom boot block

Manufactured on 0.23 µm process technology

Compatible with JEDEC standards

— Pinout and software compatible with

single-power-supply flash standard

PERFORMANCE CHARACTERISTICS

High performance

— Access time as fast 90 ns

— Program time: 7µs/word typical utilizing Accelerate

function

Ultra low power consumption (typical values)

— 2 mA active read current at 1 MHz

— 10 mA active read current at 5 MHz

— 200 nA in standby or automatic sleep mode

Minimum 1 million erase cycles guaranteed per

sector

20 Year data retention at 125°C

— Reliable operation for the life of the system

SOFTWARE FEATURES

Supports Common Flash Memory Interface (CFI)

Erase Suspend/Erase Resume

— Suspends erase operations to allow programming in

non-suspended sectors

Data# Polling and Toggle Bits

— Provides a software method of detecting the status of

program or erase cycles

Unlock Bypass Program command

— Reduces overall programming time when issuing

multiple program command sequences

HARDWARE FEATURES

Any combination of sectors can be erased

Ready/Busy# output (RY/BY#)

— Hardware method for detecting program or erase

cycle completion

Hardware reset pin (RESET#)

— Hardware method of resetting the internal state

machine to the read mode

WP#/ACC input pin

— Write protect (WP#) function allows protection of two

outermost boot sectors, regardless of sector protect

status

— Acceleration (ACC) function provides accelerated

program times

Sector protection

— Hardware method of locking a sector, either

in-system or using programming equipment, to

prevent any program or erase operation within that

sector

— Temporary Sector Unprotect allows changing data in

protected sectors in-system

This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data

Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.

Publication#

23579

Rev:

Amendment/8

Issue Date:

December 14, 2005

Refer to AMD’s Website (www.amd.com) for the latest information.

D A T A S H E E T

GENERAL DESCRIPTION

The Am29LV320D is a 32 megabit, 3.0 volt-only flash

memory device, organized as 2,097,152 words of 16

bits each or 4,194,304 bytes of 8 bits each. Word

mode data appears on DQ0–DQ15; byte mode data

appears on DQ0–DQ7. The device is designed to be

programmed in-system with the standard 3.0 volt V

supply, and can also be programmed in standard

EPROM programmers.

The device is available with an access time of 90 or

120 ns. The devices are offered in 48-pin TSOP and

48-ball FBGA packages. Standard control pins—chip

enable (CE#), write enable (WE#), and output enable

(OE#)—control normal read and write operations, and

avoid bus contention issues.

The device requires only a

single 3.0 volt power sup-

ply

for both read and write functions. Internally gener-

ated and regulated voltages are provided for the

program and erase operations.

or both. Customer Lockable parts may utilize the Se-

cured Silicon sector as bonus space, reading and writ-

ing like any other flash sector, or may permanently

lock their own code there.

The device offers complete compatibility with the

JEDEC single-power-supply Flash command set

standard.

Commands are written to the command

Reading data out of the device is similar to reading

from other Flash or EPROM devices.

The host system can detect whether a program or

erase operation is complete by using the device

sta-

tus bits:

RY/BY# pin, DQ7 (Data# Polling) and

DQ6/DQ2 (toggle bits). After a program or erase cycle

is completed, the device automatically returns to the

read mode.

The

sector erase architecture

allows memory sec-

tors to be erased and reprogrammed without affecting

the data contents of other sectors. The device is fully

erased when shipped from the factory.

Hardware data protection

measures include a low

detector that automatically inhibits write opera-

tions during power transitions. The

hardware sector

protection

feature disables both program and erase

operations in any combination of the sectors of mem-

ory. This can be achieved in-system or via program-

ming equipment.

The device offers two power-saving features. When

addresses are stable for a specified amount of time,

the device enters the

automatic sleep mode.

The

system can also place the device into the

standby

mode.

Power consumption is greatly reduced in both

modes.

Am29LV320D Features

The

Secured Silicon sector

is an extra sector capa-

ble of being permanently locked by AMD or custom-

ers. The

Secured Silicon Indicator Bit

(DQ7) is

permanently set to a 1 if the part is

factory locked,

and set to a 0 if

customer lockable.

This way, cus-

tomer lockable parts can never be used to replace a

factory locked part.

Note that the Am29LV320D has

a Secured Silicon sector size of 64 Kbytes. AMD

devices designated as replacements or substi-

tutes, such as the Am29LV320M, have 256 bytes.

This should be considered during system design.

Factory locked parts provide several options. The Se-

cured Silicon sector may store a secure, random 16

byte ESN (Electronic Serial Number), customer code

(programmed through AMD’s ExpressFlash service),

Am29LV320D

December 14, 2005

D A T A S H E E T

TABLE OF CONTENTS

Continuity of Specifications ....................................................... i

For More Information ................................................................. i

Distinctive Characteristics . . . . . . . . . . . . . . . . . . 1

ARCHITECTURAL ADVANTAGES ...................................... 1

PERFORMANCE CHARACTERISTICS ............................... 1

SOFTWARE FEATURES ..................................................... 1

HARDWARE FEATURES .................................................... 1

General Description . . . . . . . . . . . . . . . . . . . . . . . 2

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Special Package Handling Instructions .................................... 7

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV320D Device Bus Operations ..............................10

Reset Command ..................................................................... 25

Autoselect Command Sequence ............................................ 25

Table 13. Autoselect Codes ........................................................... 25

Enter Secured Silicon Sector/Exit Secured Silicon Sector

Command Sequence .............................................................. 25

Byte/Word Program Command Sequence ............................. 26

Unlock Bypass Command Sequence .................................. 26

Figure 4. Program Operation ......................................................... 27

Chip Erase Command Sequence ........................................... 27

Sector Erase Command Sequence ........................................ 27

Erase Suspend/Erase Resume Commands ........................... 28

Figure 5. Erase Operation.............................................................. 28

Command Definitions ............................................................. 29

Table 14. Am29LV320D Command Definitions ............................. 29

Write Operation Status . . . . . . . . . . . . . . . . . . . . 30

DQ7: Data# Polling ................................................................. 30

Figure 6. Data# Polling Algorithm .................................................. 30

Word/Byte Configuration ........................................................ 11

Requirements for Reading Array Data ................................... 11

Writing Commands/Command Sequences ............................ 11

Accelerated Program Operation .......................................... 11

Autoselect Functions ........................................................... 11

Standby Mode ........................................................................ 12

Automatic Sleep Mode ........................................................... 12

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Table 2. Top Boot Sector Addresses (Am29LV320DT) ..................13

Table 3. Top Boot Secured Silicon Sector Addresses ................... 14

Table 4. Bottom Boot Sector Addresses (Am29LV320DB) .............14

Table 5. Bottom Boot Secured Silicon Sector Addresses .............. 15

RY/BY#: Ready/Busy# ............................................................ 31

DQ6: Toggle Bit I .................................................................... 31

Figure 7. Toggle Bit Algorithm........................................................ 31

DQ2: Toggle Bit II ................................................................... 31

Reading Toggle Bits DQ6/DQ2 ............................................... 32

DQ5: Exceeded Timing Limits ................................................ 32

DQ3: Sector Erase Timer ....................................................... 32

Table 15. Write Operation Status ................................................... 33

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34

Figure 8. Maximum Negative Overshoot Waveform ...................... 34

Figure 9. Maximum Positive Overshoot Waveform........................ 34

Autoselect Mode ..................................................................... 16

Table 6. Autoselect Codes (High Voltage Method) ........................16

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

CMOS Compatible .................................................................. 35

Zero-Power Flash ................................................................. 36

Figure 10. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 36

Figure 11. Typical I

CC1

vs. Frequency ............................................ 36

Sector/Sector Block Protection and Unprotection .................. 17

Table 7. Top Boot Sector/Sector Block Addresses

for Protection/Unprotection .............................................................17

Table 8. Bottom Boot Sector/Sector Block

Addresses for Protection/Unprotection ...........................................17

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Figure 12. Test Setup.................................................................... 37

Table 16. Test Specifications ......................................................... 37

Figure 13. Input Waveforms and Measurement Levels ................. 37

Write Protect (WP#) ................................................................ 18

Temporary Sector Unprotect .................................................. 18

Figure 1. Temporary Sector Unprotect Operation........................... 18

Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 19

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38

Read-Only Operations ........................................................... 38

Figure 14. Read Operation Timings ............................................... 38

Secured Silicon Sector Flash Memory Region ....................... 20

Factory Locked: Secured Silicon Sector Programmed

and Protected at the Factory ............................................... 20

Customer Lockable: Secured Silicon Sector NOT Programmed

or Protected at the Factory .................................................. 20

Figure 3. Secured Silicon Sector Protect Verify .............................. 21

Hardware Reset (RESET#) .................................................... 39

Figure 15. Reset Timings ............................................................... 39

Word/Byte Configuration (BYTE#) ............................................. 40

Figure 16. BYTE# Timings for Read Operations............................ 40

Figure 17. BYTE# Timings for Write Operations............................ 40

Hardware Data Protection ...................................................... 21

Low VCC Write Inhibit ......................................................... 21

Write Pulse “Glitch” Protection ............................................ 21

Logical Inhibit ...................................................................... 21

Power-Up Write Inhibit ......................................................... 21

Common Flash Memory Interface (CFI) . . . . . . . 21

Table 9. CFI Query Identification String .......................................... 22

Table 10. System Interface String................................................... 22

Table 11. Device Geometry Definition ............................................ 23

Table 12. Primary Vendor-Specific Extended Query ...................... 24

Erase and Program Operations ................................................. 41

Figure 18. Program Operation Timings..........................................

Figure 19. Chip/Sector Erase Operation Timings ..........................

Figure 20. Data# Polling Timings (During Embedded Algorithms).

Figure 21. Toggle Bit Timings (During Embedded Algorithms)......

Figure 22. DQ2 vs. DQ6.................................................................

Temporary Sector Unprotect ..................................................... 46

Figure 23. Temporary Sector Unprotect Timing Diagram .............. 46

Figure 24. Accelerated Program Timing Diagram.......................... 46

Figure 25. Sector/Sector Block Protect and

Unprotect Timing Diagram ............................................................. 47

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25

Reading Array Data ................................................................ 25

December 14, 2005

Alternate CE# Controlled Erase and Program Operations ........ 48

Figure 26. Alternate CE# Controlled Write

Am29LV320D