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AM29LV320ML120RPCI

Flash, 2MX16, 120ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
SPANSION
零件包装代码
BGA
包装说明
13 X 11 MM, 1 MM PITCH, FBGA-64
针数
64
Reach Compliance Code
not_compliant
ECCN代码
3A991.B.1.A
最长访问时间
120 ns
备用内存宽度
8
启动块
BOTTOM/TOP
命令用户界面
YES
通用闪存接口
YES
数据轮询
YES
JESD-30 代码
R-PBGA-B64
JESD-609代码
e0
长度
13 mm
内存密度
33554432 bit
内存集成电路类型
FLASH
内存宽度
16
湿度敏感等级
3
功能数量
1
部门数/规模
64
端子数量
64
字数
2097152 words
字数代码
2000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
2MX16
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装等效代码
BGA64,8X8,40
封装形状
RECTANGULAR
封装形式
GRID ARRAY, LOW PROFILE
页面大小
4/8 words
并行/串行
PARALLEL
峰值回流温度(摄氏度)
240
电源
1.8/3.3,3.3 V
编程电压
3 V
认证状态
Not Qualified
就绪/忙碌
YES
座面最大高度
1.4 mm
部门规模
64K
最大待机电流
0.000005 A
最大压摆率
0.08 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
切换位
YES
类型
NOR TYPE
宽度
11 mm
文档预览
Am29LV320MH/L
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not available for designs. For new and current designs,
S29GL032A supersedes Am29LV320MH/L and is the factory-recommended migration path. Please
refer to the S29GL032A datasheet for specifications and ordering information. Availability of this
document is retained for reference and historical purposes only.
The following document contains information on Spansion memory products. Although the docu-
ment is marked with the name of the company that originally developed the specification, Spansion
will continue to offer these products to existing customers.
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal data sheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appro and
changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
Spansion continues to support existing part numbers beginning with “Am” and “MBM”. To order these
products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local sales office for additional information about Spansion memory solutions.
Publication Number
26517
Revision
B
Amendment
4
Issue Date
January 31, 2007
THIS PAGE LEFT INTENTIONALLY BLANK.
DATA SHEET
Am29LV320MH/L
32 Megabit (2 M x 16-Bit/4 M x 8-Bit) MirrorBit™
3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O™ Control
This product has been retired and is not available for designs. For new and current designs, S29GL032A supersedes Am29LV320M H/L and is the factory-recommended migration path.
Please refer to the S29GL032A datasheet for specifications and ordering information. Availability of this document is retained for reference and historical purposes only.
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
Single power supply operation
— 3 V for read, erase, and program operations
VersatileI/O™ control
— Device generates data output voltages and tolerates
data input voltages on the DQ inputs/outputs as
determined by the voltage on the V
IO
pin; operates
from 1.65 to 3.6 V
Manufactured on 0.23 µm MirrorBit process
technology
Secured Silicon Sector region
— 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
— May be programmed and locked at the factory or by
the customer
Flexible sector architecture
— Sixty-four 32 Kword/64-Kbyte sectors
Compatibility with JEDEC standards
— Provides pinout and software compatibility for
single-power supply flash, and superior inadvertent
write protection
Minimum 100,000 erase cycle guarantee per sector
20-year data retention at 125°C
PERFORMANCE CHARACTERISTICS
High performance
— 90 ns access time
— 25 ns page read times
— 0.5 s typical sector erase time
— 15 µs typical effective write buffer word programming
time: 16-word/32-byte write buffer reduces overall
programming time for multiple-word/byte updates
— 4-word/8-byte page read buffer
— 16-word/32-byte write buffer
Low power consumption (typical values at 3.0 V, 5
MHz)
— 13 mA typical active read current
— 50 mA typical erase/program current
— 1 µA typical standby mode current
Package options
— 56-pin TSOP
— 64-ball Fortified BGA
SOFTWARE & HARDWARE FEATURES
Software features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— Unlock Bypass Program command reduces overall
multiple-word programming time
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
Hardware features
— Sector Group Protection: hardware-level method of
preventing write operations within a sector group
— Temporary Sector Unprotect: V
ID
-level method of
changing code in locked sectors
— WP#/ACC input:
Write Protect input (WP#) protects first or last sector
regardless of sector protection settings
ACC (high voltage) accelerates programming time for
higher throughput during system production
— Hardware reset input (RESET#) resets device
— Ready/Busy# output (RY/BY#) indicates program or
erase cycle completion
Publication#
26517
Rev:
B
Amendment/4
Issue Date:
January 31, 2007
D A T A
S H E E T
GENERAL DESCRIPTION
The Am29LV320MH/L is a 32 Mbit, 3.0 volt single
power supply flash memory device organized as
2,097,152 words or 4,194,304 bytes. The device has
an 8-bit/16-bit bus and can be programmed either in
the host system or in standard EPROM programmers.
An access time of 90, 100, 110, or 120 ns is available.
Note that each access time has a specific operating
voltage range (V
CC
) and an I/O voltage range (V
IO
), as
specified in the
Product Selector Guide
and the
Order-
ing Information
sections. The device is offered in a
56-pin TSOP or 64-ball Fortified BGA package. Each
device has separate chip enable (CE#), write enable
(WE#) and output enable (OE#) controls.
Each device requires only a
single 3.0 volt power
supply
for both read and write functions. In addition to
a V
CC
input, a high-voltage
accelerated program
(ACC)
feature provides shorter programming times
through increased current on the WP#/ACC input. This
feature is intended to facilitate factory throughput dur-
ing system production, but may also be used in the
field if desired.
The device is entirely command set compatible with
the
JEDEC single-power-supply Flash standard.
Commands are written to the device using standard
microprocessor write timing. Write cycles also inter-
nally latch addresses and data needed for the pro-
gramming and erase operations.
The
sector erase architecture
allows memory sec-
tors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.
Device programming and erasure are initiated through
command sequences. Once a program or erase oper-
ation has begun, the host system need only poll the
DQ7 (Data# Polling) or DQ6 (toggle)
status bits
or
monitor the
Ready/Busy# (RY/BY#)
output to deter-
mine whether the operation is complete. To facilitate
programming, an
Unlock Bypass
mode reduces com-
mand sequence overhead by requiring only two write
cycles to program data instead of four.
The
VersatileI/O™
(V
IO
) control allows the host sys-
tem to set the voltage levels that the device generates
and tolerates on the CE# control input and DQ I/Os to
the same voltage level that is asserted on the V
IO
pin.
Refer to the
Ordering Information
section for valid V
IO
options.
Hardware data protection
measures include a low
V
CC
detector that automatically inhibits write opera-
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of sectors of memory.
This can be achieved in-system or via programming
equipment.
The
Erase Suspend/Erase Resume
feature allows
the host system to pause an erase operation in a given
sector to read or program any other sector and then
complete the erase operation. The
Program Sus-
pend/Program Resume
feature enables the host sys-
tem to pause a program operation in a given sector to
read any other sector and then complete the program
operation.
The
hardware RESET# pin
terminates any operation
in progress and resets the device, after which it is then
ready for a new operation. The RESET# pin may be
tied to the system reset circuitry. A system reset would
thus also reset the device, enabling the host system to
read boot-up firmware from the Flash memory device.
The device reduces power consumption in the
standby mode
when it detects specific voltage levels
on CE# and RESET#, or when addresses have been
stable for a specified period of time.
The
Write Protect (WP#)
feature protects the first or
last sector by asserting a logic low on the WP#/ACC
pin. The protected sector will still be protected even
during accelerated programming.
The
Secured Silicon Sector
provides a
128-word/256-byte area for code or data that can be
permanently protected. Once this sector is protected,
no further changes within the sector can occur.
AMD MirrorBit flash technology combines years of
Flash memory manufacturing experience to produce
the highest levels of quality, reliability and cost effec-
tiveness. The device electrically erases all bits within a
sector simultaneously via hot-hole assisted erase. The
data is programmed using hot electron injection.
2
Am29LV320MH/L
26517B4 January 31, 2007
D A T A
S H E E T
MIRRORBIT 32 MBIT DEVICE FAMILY
Device
LV033MU
LV320MT/B
LV320MH/L
Bus
x8
x8/x16
x8/x16
Sector Architecture
Uniform (64 Kbyte)
Boot (8 x 8 Kbyte
at top & bottom)
Uniform (64 Kbyte)
Packages
40-pin TSOP (std. & rev. pinout),
48-ball FBGA
48-pin TSOP, 48-ball Fine-pitch BGA,
64-ball Fortified BGA
56-pin TSOP (std. & rev. pinout),
64 Fortified BGA
V
IO
Yes
No
Yes
RY/BY#
Yes
Yes
Yes
WP#, ACC
ACC only
WP#/ACC pin
WP#/ACC pin
WP# Protection
No WP#
2 x 8 Kbyte
top or bottom
1 x 64 Kbyte
high or low
RELATED DOCUMENTS
To download related documents, click on the following
links or go to www.amd.com
Flash Memory
Prod-
uct Information
MirrorBit
Flash Information
Tech-
nical Documentation.
MirrorBit™ Flash Memory Write Buffer Programming
and Page Buffer Read
Implementing a Common Layout for AMD MirrorBit
and Intel StrataFlash Memory Devices
Migrating from Single-byte to Three-byte Device IDs
AMD MirrorBit™ White Paper
January 31, 2007 26517B4
Am29LV320MH/L
3
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