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AM29PL160CB-65RKF

Flash, 1MX16, 65ns, PDSO44, REVERSE, MO-180AA, SOP-44

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
零件包装代码
SOIC
包装说明
SOP,
针数
44
Reach Compliance Code
compliant
ECCN代码
EAR99
最长访问时间
65 ns
其他特性
MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
备用内存宽度
8
启动块
BOTTOM
数据保留时间-最小值
20
JESD-30 代码
R-PDSO-G44
JESD-609代码
e3
长度
28.2 mm
内存密度
16777216 bit
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
端子数量
44
字数
1048576 words
字数代码
1000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
1MX16
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
编程电压
3 V
认证状态
Not Qualified
座面最大高度
2.8 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
类型
NOR TYPE
宽度
13.3 mm
Base Number Matches
1
文档预览
Am29PL160C
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
DISTINCTIVE CHARACTERISTICS
s
16 Mbit Page Mode device
— Byte (8-bit) or word (16-bit) mode selectable via
BYTE# pin
— Page size of 16 bytes/8 words: Fast page read
access from random locations within the page
s
Single power supply operation
— Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
— Regulated voltage range: 3.0 to 3.6 volt read and
write operations and for compatibility with high
performance 3.3 volt microprocessors
s
5 V-tolerant data, address, and control signals
s
High performance read access times
— Page access times as fast as 25 ns at industrial
temperature range
— Random access times as fast as 65 ns
s
Power consumption (typical values at 5 MHz)
— 30 mA read current
— 20 mA program/erase current
— 1 µA standby mode current
— 1 µA Automatic Sleep mode current
s
Flexible sector architecture
— Sector sizes: One 16 Kbyte, two 8 Kbyte, one
224 Kbyte, and seven sectors of 256 Kbytes
each
— Supports full chip erase
s
Top or bottom boot block configurations
available
s
Sector Protection
— A hardware method of locking a sector to prevent
any program or erase operations within that
sector
— Sectors can be locked via programming
equipment
— Temporary Sector Unprotect command
sequence allows code changes in previously
locked sectors
s
Minimum 1 million write cycles guarantee
per sector
s
20-year data retention
s
Manufactured on 0.32 µm process technology
s
Software command-set compatible with JEDEC
standard
— Backward compatible with Am29F and Am29LV
families
s
CFI (Common Flash Interface) compliant
— Provides device-specific information to the
system, allowing host software to easily
reconfigure for different Flash devices
s
Unlock Bypass Program Command
— Reduces overall programming time when
issuing multiple program command sequences
s
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
s
Package Options
— 44-pin SO (mask-ROM compatible pinout)
— 48-pin TSOP (bottom boot only)
Publication#
22143
Rev:
C
Amendment/0
Issue Date:
February 21, 2000
Refer to AMD’s Website (www.amd.com) for the latest information.
GENERAL DESCRIPTION
The Am29PL160C is a 16 Mbit, 3.0 Volt-only Page
mode Flash memory device organized as 2,097,152
bytes or 1,048,576 words.The device is offered in a 44-
pin SO or a 48-pin TSOP (bottom boot only) package.
The word-wide data (x16) appears on DQ15–DQ0; the
byte-wide (x8) data appears on DQ7–DQ0. This de-
vice can be programmed in-system or with in standard
EPROM programmers. A 12.0 V V
PP
or 5.0 V
CC
are
not required for write or erase operations.
The device offers access times of 65, 70, 90, and 120
ns, allowing high speed microprocessors to operate
without wait states. To eliminate bus contention the de-
vice has separate chip enable (CE#), write enable
(WE#), and output enable (OE#) controls.
The sector sizes are as follows: one 16 Kbyte, two
8 K by te, one 224 K by te and s even se cto rs o f
256 Kbytes each. The device is available in both top
and bottom boot versions.
automatically times the program pulse widths and
verifies proper cell margin. The
Unlock Bypass
mode
facilitates faster programming times by requiring only
two write cycles to program data instead of four.
Device erasure occurs by executing the erase com-
mand sequence. This initiates the
Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase,
the device automatically times the erase pulse widths
and verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by reading the DQ7
(Data# Polling) and DQ6 (toggle)
status bits.
After a
program or erase cycle has been completed, the device
is ready to read array data or accept another command.
The
sector erase architecture
allows memory sec-
tors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection
measures include a low
V
CC
detector that automatically inhibits write opera-
tions during power transitions. The
hardware sector
protection
feature disables both program and erase
operations in any combination of the sectors of mem-
o r y. T h i s c a n b e a c h i ev e d i n - s y s t e m o r v i a
programming equipment.
The
Erase Suspend/Erase Resume
feature enables
the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is
not selected for erasure. True background erase can
thus be achieved.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the
automatic sleep mode.
The system can also place the device into the
standby
mode.
Power consumption is greatly reduced in both
these modes.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effective-
ness. The device electrically erases all bits within a
sector simultaneously via Fowler-Nordheim tunneling.
The data is programmed using hot electron injection.
Page Mode Features
The device is AC timing, pinout, and package
compat-
ible with 16 Mbit x 16 page mode Mask ROM.
The
page size is 8 words or 16 bytes.
After initial page access is accomplished, the page
mode operation provides fast read access speed of
random locations within that page.
Standard Flash Memory Features
The device requires only a
single 3.0 volt power sup-
ply
for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with
the
JEDEC single-power-supply Flash standard.
Commands are written to the command register using
standard microprocessor write timings. Register con-
tents serve as input to an internal state-machine that
controls the erase and programming circuitry. Write cy-
cles also internally latch addresses and data needed
for the programming and erase operations. Reading
data out of the device is similar to reading from other
Flash or EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the
Embedded
Program
algorithm—an inter nal algorithm that
Am29PL160C
2
PRODUCT SELECTOR GUIDE
Family Part Number
Speed Option
Regulated Voltage Range: V
CC
=3.0–3.6 V
Full Voltage Range: V
CC
= 2.7–3.6 V
Max access time, ns (t
ACC
)
Max CE# access time, ns (t
CE
)
Max page access time, ns (t
PACC
)
Max OE# access time, ns (t
OE
)
65
65
25
25
70
70
25
25
-65R
Am29PL160C
-70R
-90
90
90
30
30
-120
120
120
30
30
Note:
See “AC Characteristics” for full specifications.
BLOCK DIAGRAM
DQ0
DQ15
V
CC
V
SS
Erase Voltage
Generator
Input/Output
Buffers
WE#
BYTE#
State
Control
Command
Register
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
STB
Data
Latch
CE#
OE#
STB
V
CC
Detector
Timer
Address Latch
Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
A0–A19
A-1
22143C-1
3
Am29PL160C
CONNECTION DIAGRAMS
WE#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44-Pin
Standard SO
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
SS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
CC
22143C-2
NC
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
SS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
CC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44-Pin
Reverse SO
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
WE#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
22143C-3
Am29PL160C
4
CONNECTION DIAGRAMS
BYTE#
A16
A15
A14
A13
A12
A11
A10
A9
A8
A19
WE#
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48-pin Standard TSOP
(bottom boot devices only)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC
V
SS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
CC
V
CC
V
SS
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
V
SS
NC
5
Am29PL160C
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