AMC7812B
www.ti.com
SBAS625A – SEPTEMBER 2013 – REVISED SEPTEMBER 2013
12-Bit Analog Monitoring and Control Solution
with Multichannel ADC, DACs, and Temperature Sensors
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AMC7812B
1
FEATURES
DESCRIPTION
The AMC7812B is a complete analog monitoring and
control solution that includes a 16-channel, 12-bit,
analog-to-digital converter (ADC), twelve 12-bit
digital-to-analog converters (DACs), eight general-
purpose inputs and outputs (GPIOs), two remote
temperature sensor channels, and one local
temperature sensor channel.
The device has an internal +2.5-V reference that can
configure the DAC output voltage to a range of either
0 V to +5 V or 0 V to +12.5 V. An external reference
can be used as well. Typical power dissipation is
95 mW. The AMC7812B is ideal for multichannel
applications where board space, size, and low power
are critical.
The device is available in either a QFN-64 or HTQFP-
64 PowerPAD™ package and is fully specified from
–40°C to +105°C and operational over the full –40°C
to +125°C temperature range.
For applications that require a different channel
count, additional features, or converter resolutions,
Texas Instruments offers a complete family of analog
monitor and control (AMC) products. Refer to
www.ti.com/amc
for more information.
ADC-REF-IN/CMP
• 12, 12-Bit DACs with Programmable Outputs:
– 0 V to 5 V
– 0 V to 12.5 V
• DAC Shutdown to User-Defined Level
• 12-Bit, 500-kSPS ADC with 16 Inputs:
– 16 Single-Ended or
Two Differential + 12 Single-Ended
• Two Remote Temperature Sensors:
– ±2°C Accuracy, –40°C to +150°C
• One Internal Temperature Sensor:
– ±2.5°C Accuracy, –40°C to +125°C
• Input Out-of-Range Alarms
• 2.5-V Internal Reference
• Eight General-Purpose Inputs and Outputs
• Configurable I
2
C-Compatible and SPI™
Interface with 5-V and 3-V Logic
• Power-Down Mode
• Wide Operating Temperature Range:
–40°C to +125°C
• Small Packages: 9-mm × 9-mm QFN-64, and
10-mm × 10-mm HTQFP-64
2345
AMC7812B
Single-Ended/
Differential
APPLICATIONS
•
•
•
•
RF Power Amplifier Control in Base Stations
Test and Measurement
Industrial Control
General Analog Monitoring and Control
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
CH9
CH10
CH11
CH12
CH13
CH14
CH15
Reference
(2.5V)
REF-OUT
Single-Ended
REF-DAC
Trigger
ADC
DAC-0
DAC0-OUT
DAC1-OUT
DAC2-OUT
D1+
GPIO-5
Control/Limits/Status
Registers
DAC3-OUT
DAC4-OUT
DAC5-OUTDAC6-OUT
TEMP/GPIO
D1-
D2+
GPIO-4
GPIO-7
Remote
Temperature
Sensor
Driver
Local
Temperature
Sensor
DAC7-OUTDAC8-OUT
DAC9-OUTDAC10-OUT
DAC11-OUT
D2-
GPIO-6
GPIO Controller
DAC-11
GPIO
GPIO-3
GPIO-0
ALARM
LOAD-DAC
Out-of-Range
Alarms
DACs Clear Logic
DAC-CLR-0
DAC-CLR-1
RESET
Control
Logic
Serial Interface Register and Control
(SPI/I
2
C)
DAV
SDO/A1
AGND1
CS/A0
DGND
AV
DD1
SDI/SDA
AGND2
AGND3
A2
SPI/I2C
1
2
3
4
5
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments, Incorporated.
SPI, QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor.
All other trademarks are the property of their respective owners.
Copyright © 2013, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SCLK/SCL
AGND4
DV
DD
IOV
DD
CNVT
AV
DD2
AV
CC
AMC7812B
SBAS625A – SEPTEMBER 2013 – REVISED SEPTEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at
www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
AV
DD
to GND
DV
DD
to GND
IOV
DD
to GND
AV
CC
to GND
DV
DD
to DGND
Analog input voltage to GND
ALARM, GPIO-0, GPIO-1, GPIO-2, GPIO-3, SCLK/SCL, and SDI/SDA to GND
D1+/GPIO-4, D1–/GPIO-5, D2+/GPIO-6, D2–/GPIO-7 to GND
Digital input voltage to DGND
SDO and DAV to GND
Operating temperature range
Storage temperature range
Junction temperature range (T
J
max)
Electrostatic discharge (ESD)
ratings
(1)
Human body model (HBM)
Charged device model (CDM)
–0.3 to +6
–0.3 to +6
–0.3 to +6
–0.3 to +18
–0.3 to +6
–0.3 to AV
DD
+ 0.3
–0.3 to +6
–0.3 to AV
DD
+ 0.3
–0.3 to IOV
DD
+ 0.3
–0.3 to IOV
DD
+ 0.3
–40 to +125
–40 to +150
+150
2.5
1.0
UNIT
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
kV
kV
Stresses above those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
AMC7812B
THERMAL METRIC
θ
JA
θ
JCtop
θ
JB
ψ
JT
ψ
JB
θ
JCbot
(1)
(1)
RGC (QFN)
64 PINS
24.1
8.1
3.2
0.1
3.3
0.6
PAP (HTQFP)
64 PINS
33.7
9.5
9.0
0.3
8.9
0.2
UNITS
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
°C/W
For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics
application report,
SPRA953.
2
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AMC7812B
Copyright © 2013, Texas Instruments Incorporated
AMC7812B
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SBAS625A – SEPTEMBER 2013 – REVISED SEPTEMBER 2013
ELECTRICAL CHARACTERISTICS
At T
A
= –40°C to +105°C, AV
DD
= DV
DD
= 4.5 V to 5.5 V, AV
CC
= +15 V, AGND = DGND = 0 V, IOV
DD
= 2.7 V to 5.5 V,
internal 2.5-V reference, and the DAC output span = 0 V to 5 V, unless otherwise noted.
PARAMETER
DAC PERFORMANCE
DAC DC ACCURACY
Resolution
T
A
= –40°C to +105°C, measured by line passing
through codes 020h and FFFh
T
A
= –40°C to +125°C, measured by line passing
through codes 020h and FFFh
T
A
= –40°C to +125°C, measured by line passing
through codes 020h and FFFh
T
A
= +25°C, DAC output = 5.0 V
T
A
= +25°C, DAC output = 12.5 V
T
A
= +25°C, DAC output = 0 V to +5 V,
code 020h
T
A
= +25°C, DAC output = 0 V to +12.5 V,
code 020h
±1
T
A
= –40°C to +125°C, external reference,
output = 0 V to +5 V
T
A
= –40°C to +125°C, external reference,
output = 0 V to +12.5 V
±0.025
–0.15
±2
±0.15
±0.3
±0.3
12
±1
±1.25
±1
±10
±30
±2
±5
Bits
LSB
LSBs
LSB
mV
mV
mV
mV
ppm/°C
%FSR
%FSR
ppm/°C
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INL
Relative accuracy
DNL
TUE
Differential nonlinearity
Total unadjusted error
Offset error
Offset error temperature coefficient
Gain error
Gain temperature coefficient
DAC OUTPUT CHARACTERISTICS
Output voltage range
(1)
T
A
= –40°C to +125°C, V
REF
= 2.5 V, gain = 2
T
A
= –40°C to +125°C, V
REF
= 2.5 V, gain = 5
DAC output = 0 V to +5 V, code 400h to C00h,
to 1/2 LSB, from CS rising edge, R
L
= 2 kΩ,
C
L
= 200 pF
Full-scale current shorted to ground
Source within 200 mV of supply, T
A
= +25°C
Sink within 300 mV of supply, T
A
= +25°C
Load current
DAC output = 0 V to +5 V, code B33h. Source and
sink with voltage drop < 25 mV,
T
A
= –40°C to +95°C
R
L
= infinite
Code 800h
AV
CC
0 V to 5 V, 2-ms ramp
Code changes from 7FFh to 800h, 800h to 7FFh
Device is not accessed
T
A
= +25°C, at 1 kHz, code 800h, gain = 2,
excludes reference
f = 0.1 Hz to 10 Hz, excludes reference
DAC REFERENCE INPUT
Reference voltage input range
Input current
(2)
T
A
= –40°C to +125°C, REF-DAC pin
V
REF
= 2.5 V
1
(2)
0
0
3
1.5
5
12.5
V
V
µs
V/µs
mA
mA
mA
mA
nF
Output voltage settling time
(2)
Slew rate
(2)
Short-circuit current
(2)
30
+10
–10
±8
10
0.3
5
0.15
0.15
81
8
Capacitive load stability
(2)
DC output impedance
Power-on overshoot
Digital-to-analog glitch energy
Digital feedthrough
Output noise
Ω
mV
nV-s
nV-s
nV/√Hz
µV
PP
2.6
V
µA
170
(1)
(2)
The output voltage must not be greater than AV
CC
. See the
DAC Output
section for further details.
Sampled during initial release to ensure compliance; not subject to production testing.
Copyright © 2013, Texas Instruments Incorporated
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AMC7812B
SBAS625A – SEPTEMBER 2013 – REVISED SEPTEMBER 2013
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
At T
A
= –40°C to +105°C, AV
DD
= DV
DD
= 4.5 V to 5.5 V, AV
CC
= +15 V, AGND = DGND = 0 V, IOV
DD
= 2.7 V to 5.5 V,
internal 2.5-V reference, and the DAC output span = 0 V to 5 V, unless otherwise noted.
PARAMETER
INTERNAL REFERENCE
Output voltage
Output impedance
Reference temperature coefficient
Output current (sourcing and sinking)
Output voltage noise
ADC PERFORMANCE
ADC DC ACCURACY (for AV
DD
= 5 V)
Resolution
INL
DNL
Integral nonlinearity
Differential nonlinearity
T
A
= –40°C to +125°C
T
A
= –40°C to +125°C
12
±0.5
±0.5
±1
±1
Bits
LSB
LSB
T
A
= +25°C, f = 1 kHz
f = 0.1 Hz to 10 Hz
T
A
= –40°C to +125°C
T
A
= +25°C, REF-OUT pin
2.495
2.5
0.4
10
±5
260
13
25
2.505
V
Ω
ppm/°C
mA
nV/√Hz
µV
PP
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Single-Ended Mode
Offset error
Offset error match
Gain error
Gain error match
Differential Mode
External reference, 0 V to (2 × V
REF
) mode,
V
CM
= 2.5 V
External reference, 0 V to V
REF
mode,
V
CM
= 1.25 V
0 V to (2 × V
REF
) mode, V
CM
= 2.5 V
Zero code error
Zero code error match
Common-mode rejection
SAMPLING DYNAMICS
Conversion rate
Conversion time
(3)
Autocycle update rate
Throughput rate
ANALOG INPUT
(4)
(3)
±1
±0.4
External reference
±1
±0.4
±3
LSB
LSB
±5
LSB
LSB
±2
±1
±0.5
±1
±1
±0.5
±5
±5
LSB
LSB
LSB
Gain error
Gain error match
±3
±3
LSB
LSB
LSB
dB
External reference, 0 V to V
REF
mode,
V
CM
= 1.25 V
At dc, 0 V to (2 × V
REF
) mode
External single analog channel, auto mode
External single analog channel, direct mode
External single analog channel
All 16 single-ended inputs enabled
SPI clock, 12 MHz or greater, single channel
67
500
167
2
32
500
kSPS
kSPS
µs
µs
kSPS
T
A
= –40°C to +125°C, single-ended, 0 V to V
REF
T
A
= –40°C to +125°C, single-ended,
0 V to (2 × V
REF
)
Full-scale input voltage
T
A
= –40°C to +125°C, V
IN+
– V
IN–
, fully-differential,
0 V to V
REF
T
A
= –40°C to +125°C, V
IN+
– V
IN–
, fully-differential,
0 V to (2 × V
REF
)
Absolute input voltage
Input capacitance
(3)
DC input leakage current
ADC REFERENCE INPUT
Reference input voltage range
Input current
T
A
= –40°C to +125°C
V
REF
= 2.5 V
T
A
= –40°C to +125°C
0 V to V
REF
mode
0 V to (2 × V
REF
) mode
Unselected ADC input
0
0
–V
REF
–2 × V
REF
GND – 0.2
118
73
V
REF
2 × V
REF
+V
REF
2 × V
REF
AV
DD
+ 0.2
V
V
V
V
V
pF
pF
±10
µA
1.2
145
AV
DD
V
µA
(3)
(4)
Sampled during initial release to ensure compliance; not subject to production testing.
V
IN+
or V
IN–
must remain within GND – 0.2 V and AV
DD
+ 0.2 V; see the
Analog Inputs
section.
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AMC7812B
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Copyright © 2013, Texas Instruments Incorporated
AMC7812B
www.ti.com
SBAS625A – SEPTEMBER 2013 – REVISED SEPTEMBER 2013
ELECTRICAL CHARACTERISTICS (continued)
At T
A
= –40°C to +105°C, AV
DD
= DV
DD
= 4.5 V to 5.5 V, AV
CC
= +15 V, AGND = DGND = 0 V, IOV
DD
= 2.7 V to 5.5 V,
internal 2.5-V reference, and the DAC output span = 0 V to 5 V, unless otherwise noted.
PARAMETER
INTERNAL ADC REFERENCE BUFFER
Offset
INTERNAL TEMPERATURE SENSOR
Operating range
Accuracy
Resolution
Conversion rate
AV
DD
= 5 V, T
A
= –40°C to +125°C
AV
DD
= 5 V, T
A
= 0°C to +100°C
Per LSB
External temperature sensors are disabled
0.125
15
–40
±1.25
+125
±2.5
±1.5
°C
°C
°C
°C
ms
T
A
= +25°C
±5
mV
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EXTERNAL TEMPERATURE SENSOR (Using 2N3906 external transistor)
Operating range
Limited by external diode
AV
DD
= 5 V, T
A
= 0°C to +100°C,
T
D
= –40°C to +150°C
AV
DD
= 5 V, T
A
= –40°C to +100°C,
T
D
= –40°C to +150°C
Per LSB
With resistance cancellation
(RC bit = '1')
Without resistance cancellation
(RC bit = '0')
72
33
0.125
93
44
100
47
–40
+150
±1.5
±2
°C
°C
°C
°C
ms
ms
Accuracy
(5) (6)
Resolution
Conversion rate per sensor
DIGITAL LOGIC: GPIO
(7) (8)
and ALARM
V
IH
V
IL
Input high voltage
IOV
DD
= +5 V
T
A
= –40°C to +125°C, IOV
DD
= +3.3 V
IOV
DD
= +5 V
T
A
= –40°C to +125°C, IOV
DD
= +3.3 V
T
A
= –40°C to +125°C, IOV
DD
= +5 V, sinking 5 mA
V
OL
Output low voltage
High-impedance leakage
High-impedance output capacitance
DIGITAL LOGIC: All Except SCL, SDA, ALARM, and GPIO
V
IH
V
IL
Input high voltage
IOV
DD
= +5 V
T
A
= –40°C to +125°C, IOV
DD
= +3.3 V
IOV
DD
= +5 V
T
A
= –40°C to +125°C, IOV
DD
= +3.3 V
2.1
2.2
–0.3
–0.3
0.3 + IOV
DD
0.3 + IOV
DD
0.8
0.7
±1
5
IOV
DD
= +5 V, sourcing 3 mA
IOV
DD
= +3.3 V, sourcing 3 mA
IOV
DD
= +5 V, sinking 3 mA
IOV
DD
= +3.3 V, sinking 3 mA
4.8
2.9
0.4
0.4
±5
10
V
V
V
V
µA
pF
V
V
V
V
µA
pF
T
A
= –40°C to +125°C, IOV
DD
= +3.3 V,
sinking 2 mA
2.1
2.2
–0.3
–0.3
0.3 + IOV
DD
0.3 + IOV
DD
0.8
0.7
0.4
0.4
5
10
V
V
V
V
V
V
µA
pF
Input low voltage
Input low voltage
Input current
Input capacitance
V
OH
V
OL
Output high voltage
Output low voltage
High-impedance leakage
High-impedance output capacitance
(5)
(6)
(7)
(8)
T
D
is the external diode temperature.
Auto conversion mode disabled.
For pins GPIO0 to GPIO3, the external pull-up resistor must be connected to a voltage less than or equal to 5.5 V.
For pins GPIO4 to GPIO7, the external pull-up resistor must be connected to a voltage less than or equal to AV
DD
.
Copyright © 2013, Texas Instruments Incorporated
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