AMIS-30624, NCV70624
I
2
C Micro-stepping Motor
Driver
INTRODUCTION
The AMIS−30624/NCV70624 is a single−chip micro−stepping
motor driver with a position controller and control/diagnostic
interface. It is ready to build intelligent peripheral systems where up to
32 drivers can be connected to one I
2
C master. This significantly
reduces system complexity.
The chip receives positioning instructions through the bus and
subsequently drives the stator coils so the two−phase stepper motor
moves to the desired position. The on−chip position controller is
configurable (OTP or RAM) for different motor types, positioning
ranges and parameters for speed, acceleration and deceleration.
Micro−stepping allows silent motor operation and increased
positioning resolution. The advanced motion qualification mode
enables verification of the complete mechanical system in function of
the selected motion parameters. The AMIS−30624/NCV70624 can
easily be connected to an I
2
C bus where the I
2
C master can fetch
specific status information like actual position, error flags, etc. from
each individual slave node.
An integrated sensorless step−loss detection prevents the positioner
from loosing steps and stops the motor when running into stall. This
enables silent, yet accurate position calibrations during a referencing
run and allows semi−closed loop operation when approaching the
mechanical end−stops.
The chip is implemented in I2T100 technology, enabling both high
voltage analog circuitry and digital functionality on the same chip.
The NCV70624 is fully compatible with the automotive voltage
requirements.
PRODUCT FEATURES
Motor Driver
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SOIC−20
4 or DW010 SUFFIX
CASE 751AQ
NQFP−32
5 SUFFIX
CASE 560AA
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Micro−Stepping Technology
Sensorless Step−Loss Detection
Peak Current Up to 800 mA
Fixed Frequency PWM Current−Control
Selectable PWM Frequency
Automatic Selection of Fast and Slow Decay Mode
No external Fly−back Diodes Required
14 V/24 V Compliant
Motion Qualification Mode (Note 1)
Field Programmable Node Addresses
Full Diagnostics and Status Information
Protection
Overcurrent Protection
Undervoltage Management
Open−circuit Detection
High Temperature Warning and Management
Low Temperature Flag
EMI Compatibility
Controller with RAM and OTP Memory
High Voltage Outputs with Slope Control
Patents
Position Controller
Configurable Speeds and Acceleration
Input to Connect Optional Motion Switch
I
2
C Interface
US 7,271,993
US 7,288,956
This is a Pb−Free Device
NCV Prefix for Automotive and Other Applications
Requiring Site and Control Changes
Bi−Directional 2−Wire Bus for Inter IC Control
1. Not applicable for “Product Versions NCV70624DW010G, NCV70624DW010R2G”
Semiconductor Components Industries, LLC, 2009
September, 2009
−
Rev. 5
1
Publication Order Number:
AMIS−30624/D
AMIS−30624, NCV70624
APPLICATIONS
The AMIS−30624/NCV70624 is ideally suited for small
positioning applications. Target markets include:
automotive (headlamp alignment, HVAC, idle control,
cruise control), industrial equipment (lighting, fluid control,
labeling, process control, XYZ tables, robots) and building
Table 1. ORDERING INFORMATION
Part No.
AMIS30624C6244G
AMIS30624C6244RG
AMIS30624C6245G
AMIS30624C6245RG
NCV70624DW010G
NCV70624DW010R2G
Peak Current
800 mA
800 mA
800 mA
800 mA
800 mA
800 mA
Industrial
High Voltage Version
End Market/Version
Package*
SOIC−20
(Pb−Free)
SOIC−20
(Pb−Free)
NQFP−32 (7 x 7 mm)
(Pb−Free)
NQFP−32 (7 x 7 mm)
(Pb−Free)
Automotive
High Temperature
Version
SOIC−20
(Pb−Free)
SOIC−20
(Pb−Free)
Shipping
†
Tube/Tray
Tape & Reel
Tube/Tray
Tape & Reel
Tube/Tray
Tape & Reel
automation (HVAC, surveillance, satellite dish, renewable
energy systems). Suitable applications typically have
multiple axes or require mechatronic solutions with the
driver chip mounted directly on the motor.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
QUICK REFERENCE DATA
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
V
BB
, V
HW
, V
SWI
T
J
T
st
V
esd
(Note 4)
Supply voltage, hardwired address and SWI pins
Junction temperature range (Note 3)
Storage temperature
Human Body Model (HBM) Electrostatic discharge voltage on pins
Machine Model (MM) Electrostatic discharge voltage on pins
Min
−0.3
−50
−55
−2
−200
Max
+40 (Note 2)
+175
+160
+2
+200
Unit
V
C
C
kV
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. For limited time: V
BB
< 0.5 s, SWI and HW pins <1.0 s.
3. The circuit functionality is not guaranteed.
4. HBM according to AEC−Q100: EIA−JESD22−A114−B (100 pF via 1.5 kW) and MM according to AEC−Q100: EIA−JESD22−A115−A.
Table 3. OPERATING RANGES
Parameter
V
BB
T
J
Supply voltage
Operating temperature range
Min
+6.5
−40
Max
+29
+165
Unit
V
C
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2
AMIS−30624, NCV70624
Table of Contents
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick Reference Data . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package Thermal Resistance . . . . . . . . . . . . . . . . . . . . . 5
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Typical Application . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SDA
SCK
SWI
Positioning Parameters . . . . . . . . . . . . . . . . . . . . . . . . . 11
Structural Description . . . . . . . . . . . . . . . . . . . . . . . . . 14
Functions Description . . . . . . . . . . . . . . . . . . . . . . . . . 15
Position Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Main Control and Register . . . . . . . . . . . . . . . . . . . . . . 22
Autarkic Functionality in Undervoltage Condition . . . 24
OTP Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Priority Encoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Motordriver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
I
2
C Bus Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
I
2
C Application Commands . . . . . . . . . . . . . . . . . . . . . 42
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
AMIS−30624, NCV70624
I
2
C−
bus
Interface
Position
Controller
Controller
TST1
TST2
Decoder
Main Control
Registers
OTP
−
ROM
Sinewave
Table
DAC’s
4MHz
Vref
Temp
sense
Oscillator
PWM
regulator
Y
Charge Pump
I−sense
I−sense
HW
PWM
regulator
X
MOTXP
MOTXN
Stall detection
MOTYP
MOTYN
Voltage
Regulator
VBB
VDD
CPN
CPP
VCP
GND
Figure 1. Block Diagram
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AMIS−30624, NCV70624
GND
32
XP
XP
VBB
VBB
VBB
SWI
NC
SDA
9
SCK
VDD
GND
TST1
TST2
GND
HW
NC
1
2
3
4
5
6
7
8
AMIS−30624
NCV70624
(Top View)
31 30 29 28 27 26 24
23
22
21
20
19
18
10 11 12 13 14 15 17
16
GND
GND
GND
XN
YP
YP
XN
SDA
SCK
VDD
GND
TST1
TST2
GND
HW
CPN
CPP
1
2
3
4
5
6
7
8
9
10
SOIC−20
AMIS−30624
NCV70624
20
19
18
17
16
15
14
13
12
11
SWI
VBB
MOTXP
GND
MOTXN
MOTYP
GND
MOTYN
VBB
VCP
25
YN
YN
VBB
VBB
VBB
VCP
CPP
CPN
Figure 2. SOIC−20 and NQFP−32 Pin−out
Table 4. PIN DESCRIPTION
Pin Name
SDA
SCK
V
DD
GND
TST1
TST2
HW
CPN
CPP
VCP
V
BB
MOTYN
MOTYP
MOTXN
MOTXP
SWI
NC
I
2
C serial data line
I
2
C serial clock line
Internal supply (needs external decoupling capacitor)
Ground, heat sink
Test pin (to be tied to ground in normal operation)
Test pin (to be left open in normal operation: internally pulled up)
Hard wired address bit
Negative connection of pump−capacitor (charge pump)
Positive connection of pump−capacitor (charge pump)
Charge−pump filter−capacitor
Battery voltage supply
Negative end of phase Y coil
Positive end of phase Y coil
Negative end of phase X coil
Positive end of phase X coil
Switch input
Not connected (to be tied to ground)
Pin Description
SOIC−20
1
2
3
4, 7, 14, 17
5
6
8
9
10
11
12, 19
13
15
16
18
20
NQFP−32
8
9
10
11, 14, 25, 26, 31, 32
12
13
15
17
18
19
3, 4, 5, 20, 21, 22
23, 24
27, 28
29, 30
1, 2
6
7, 16
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AMIS−30624, NCV70624
PACKAGE THERMAL RESISTANCE
The AMIS−30624/NCV70624 is available in SOIC−20 or
optimized NQFP−32 packages. For cooling optimizations,
the NQFP has an exposed thermal pad which has to be
soldered to the PCB ground plane. The ground plane needs
thermal vias to conduct the head to the bottom layer. Figures
3 and 4 give examples for good power distribution solutions.
For precise thermal cooling calculations the major
thermal resistances of the devices are given. The thermal
media to which the power of the devices has to be given are:
Static environmental air (via the case)
PCB board copper area (via the device pins and
exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters.
Rth
Junction−to−Leads and
Exposed Pad
−
Rthjp
Rth
Junction−to−Leads
Rthjp
19
0,95
The major thermal resistances of the device are the Rth
from the junction to the ambient (Rthja) and the overall Rth
from the junction to the leads (Rthjp).
The NQFP device is designed to provide superior thermal
performance. Using an exposed die pad on the bottom
surface of the package is mainly contributing to this
performance. In order to take full advantage of the exposed
pad, it is most important that the PCB has features to conduct
heat away from the package. A thermal grounded pad with
thermal vias can achieve this.
In the table below, one can find the values for the Rthja and
Rthjp, simulated according to the JESD−51 norm:
Package
SOIC−20
NQFP−32
Rth
Junction−to−Ambient
Rthja (1S0P)
62
60
Rth
Junction−to−Ambient
Rthja (2S2P)
39
30
The Rthja for 2S2P is simulated conform to JESD−51 as
follows:
A 4−layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
Board thickness is 1.46 mm (FR4 PCB material)
The 2 signal layers: 70
mm
thick copper with an area of
5500 mm
2
copper and 20% conductivity
The 2 power internal planes: 36
mm
thick copper with
an area of 5500 mm
2
copper and 90% conductivity
The Rthja for 1S0P is simulated conform to JESD−51 as
follows:
A 1−layer printed circuit board with only 1 layer
Board thickness is 1.46 mm (FR4 PCB material)
The layer has a thickness of 70
mm
copper with an area
of 5500 mm
2
copper and 20% conductivity
Figure 3. Example of SOIC−20 PCB Ground Plane
Layout (preferred layout at top and bottom)
Figure 4. Example of NQFP−32 PCB Ground Plane
Layout (preferred layout at top and bottom)
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5
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SOIC−20
