AMMC-6545
8 to 45 GHz Sub-Harmonic Mixer
Data Sheet
Description
Avago’s AMMC-6545 is an easy-to-use broadband
sub-harmonic mixer, with the LO injected at half the
frequency of that required by a conventional mixer.
MMIC includes an 180° balanced diode based mixer.
The MMIC is fabricated using PHEMT technology. The
sub-harmonic mixer is designed to be an easy-to-use
component for any chip and wire application. Intended
applications include microwave radios, 802.16, VSAT and
satellite receivers. Since this one mixer can cover several
bands, the AMMC-6545 can reduce part inventory. For
improved reliability and moisture protection, the die is
passivated at the active areas.
IF
Features
•
RF Frequency: 18-45GHz
•
LO Frequency: 9-24GHz
•
IF Frequency: DC-3GHz
•
Suitable for Up and Down Conversion
•
Diode Mixer
Typical Performance
•
Conversion Loss: 11.0±1.5 dB
•
2*LO Leakage @ R port: -39 dBm
•
2*LO Leakage @ I port: -50 dBm
•
L-R Isolation: 40 dB
•
L-I Isolation: 36 dB
•
IP
3
(@LO=+17dBm): +15 dBm
LO
LP
HP
RF
•
LO Drive Power: +15 dBm
•
LO Drive range (dBm): +12 to +20
Applications
•
Microwave Radio systems
•
Satellite VSAT, DBS Up/Down Link
Chip Size: 885µm x 825µm
Chip Size Tolerance: ±10 µm (±0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ±0.4 mils)
Pad Dimensions: 120 x 80 µm (4.7 x 3.2 mils)
•
LMDS & Pt-Pt mmW Long Haul
•
Broadband Wireless Access (including 802.16 and
802.20 WiMax)
•
WLL and MMDS loops
Absolute Maximum Ratings
[1]
Symbol
Pin RF
Tb
Tstg
Tmax
Parameter/Condition
CW Input Power to RF Port
Operating Backside Temp.
Storage Temp.
Maximum Assembly Temp (60 sec max)
Units
dBm
°C
°C
°C
Minimum
-55
-65
Maximum
25
260
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
DC Specifications/Physical Properties
[2]
1. Operation in excess of any of these conditions may result in permanent damage to this device. The absolute
maximum ratings for Pin were determined at an ambient temperature of 25°C unless noted otherwise.
2. Ambient operational temperature T
A
=25°C unless noted.
3. Channel-to-backside Thermal Resistance (T
channel
= 34°C) as measured using infrared microscopy. Thermal
Resistance at backside temp. (T
b
) = 25°C calculated from measured data.
AMMC-6545 Operating Conditions
Symbol
RFfreq
LOfreq
IFfreq
LO
Parameters and Test Conditions
RF Frequency
LO Frequency
IF Frequency
LO Drive Power
Units
GHz
GHz
GHz
dBm
Minimum
18
9
DC
+12
Typical
Maximum
48
24
3
+15
+22
AMMC-6545 RF Specifications
T
A
= 25°C, Zo=50Ω, LO=+15 dBm, IF=2GHz.
Symbol
CL
Parameters
Conversion Loss
[2]
Frequency (GHz)
RF=21GHz, LO=11.5GHz
RF=23GHz, LO=12.5GHz
RF=26GHz, LO=14GHz
RF=21GHz, LO=11.5GHz
RF=23GHz, LO=12.5GHz
RF=26GHz, LO=14GHz
RF=21GHz, LO=10.5GHz
RF=23GHz, LO=11.5GHz
RF=26GHz, LO=13GHz
RF=21GHz, LO=10.5GHz
RF=23GHz, LO=11.5GHz
RF=26GHz, LO=13GHz
Units
dB
Minimum
Typical
10
Maximum
12
IIP3
Input Third Order
Intercept
[2]
2LO-R Leakage
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dB
dB
11
9.5
8.5
13.5
10.3
10.9
-45
-35
2LO-R
2LO-I
2LO-I Leakage
-50
40
36
L-R
L-I
Isolation
Isolation
Notes:
1. Production RF tested at 21, 23 and 26GHz in up-converter configuration.
2. All tested parameters are guaranteed with ±0.5dB for CL and ±1.5dBm for IIP3 and 2LO-R leakage.
AMMC-6545 Typical Performance
T
A
= 25°C, Z
o
=50Ω, LO=+15 dBm, IF=1GHz, LO Power = +15 dBm unless otherwise noted
5
6
7
8
C.L. (dB)
9
10
11
12
13
14
15
18
20
22
24
26
28
30
32
34
36
38
40
42
LO=+12dBm
LO=+14dBm
LO=+16dBm
LO=+18dBm
LO=+20dBm
Down Conversion
5
6
7
8
C.L.(dB)
9
10
11
12
13
14
15
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
RF Frequency (GHz)
LO=+12dBm
LO=+14dBm
LO=+16dBm
LO=+18dBm
LO=+20dBm
Up-Conversion
RF Frequency (GHz)
Figure 1. Down-Conversion Loss at LO=+12 to +20dBm
[LO Freq. = (RF+IF)/2, IF=1GHz].
Figure 2. Up-Conversion Loss at LO=+13 to +20dBm
[LO Freq. = (RF+IF)/2, IF=1GHz].
28
26
24
22
20
18
IIP3 (dBm)
16
14
12
10
8
6
4
2
0
18
20
22
24
26
28
30
32
34
36
38
40
42
LO=+12dBm
LO=+14dBm
LO=+16dBm
LO=+18dBm
LO=+20dBm
Down-Conversion
28
26
24
22
20
18
IIP3 (dB)
16
14
12
10
8
6
4
2
0
18
LO=+12dBm
LO=+14dBm
LO=+16dBm
LO=+18dBm
LO=+20dBm
20
22
24
26
28
30
32
34
36
38
40
42
44
46
Up-Conversion
RF FRequency (GHz)
RF Frequency (GHz)
Figure 3. Down-Conversion IIP3 at LO=+12 to +20dBm
[LO Freq. = (RF+IF)/2, IF=1GHz].
Figure 4. Up-Conversion IIP3 at LO=+12 to +20dBm
[LO Freq. = (RF+IF)/2, IF=1GHz].
0
-10
Power Leakage (dBm)
-20
-30
-40
-50
-60
-70
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
Isolation (dB)
0
2*LO-R
2*LO-I
L-R
10
L-I
L O = + 15 dBm
20
30
40
50
60
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
2*LO Frequency (GHz)
LO Frequency (GHz)
Figure 5. 2*LO-R and 2*LO-I Power Leakage @LO=+15dBm.
Figure 6. L-R and L-I Isolation @LO=+15dBm.
IF
LO
LP
HP
RF
Figure 7. Die dimension details.
Figure 8. Simplified Schematic of the mixer.
AMMC-6545 Ordering Information
AMMC-6545-W10 = 10 devices per tray
AMMC-6545-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 005-008 Avago Technologies Limited. All rights reserved.
AV0-059EN - June , 008
