APG2C1-780
IR High Power single chip LED
APG2C1-780 is a GaAlAs based, high power 780 nm single chip LED in standard emitter package for
general application.
Specifications
•
•
•
•
Structure: GaAlAs
Peak Wavelength: 780 nm
Optical Output Power: typ. 70 mW
Life Time: > 10.000 hours
Housing: standard emitter package
•
Absolute Maximum Ratings (T
a
=25°C)
Parameter
Power Dissipation, DC
Forward Current, DC
Pulsed Current (1% duty cycle, 1kHz)
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (max. 1,5 s)
Symbol
P
D
I
F
I
FP
U
R
T
opr
T
stg
T
sol
Value
1000
500
1000
-5
-30 … +70
-30 … +85
330
Unit
mW
mA
mA
V
°C
°C
°C
Electro-Optical Characteristics (T
a
=25°C)
Parameter
Forward Current
Viewing Angle
CW Output Power
Peak Wavelength
Forward Voltage
Half Width (FWHM)
Switching time
Symbol
I
F
φ
P
O
λ
P
U
F
Δλ
T
R
, t
F
Condition
I
F
= 350 mA
I
F
= 350 mA
I
F
= 350 mA
I
F
= 350 mA
I
F
= 350 mA
I
F
= 350 mA
Min.
-
Typ.
350
±
75
70
780
1.7
30
40
Max.
-
Unit
mA
deg.
mW
nm
V
nm
ns
-
-
-
Wavelength measurements tolerance is +/- 2%
Output power measurement tolerance is +/- 10%
Voltage measurement tolerance is +/- 2%
Device Materials
Item
Foundation
Lens
Electrodes
Heat Sink
Plastic
Acryl
AgCu
AgCu
Material
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Typical Performance Characteristics
Normalized Output Power vs. Wavelength:
Outline Dimensions
Emitter:
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Radiation Pattern (lambertian lens without optics)
Relative Intensity vs. Angular Displacement
Accessories
Collimating optics, holders, reflectors
10158 + 10146, 2° half angle spot optic + optic holder*
10048 + 10076, 4° half angle spot optic + optic holder*
10003 + 10043, 6° half angle spot optic + optic holder*
10003/15 + 10043, 15° half angle spot optic + optic holder*
10003/25 + 10043, 25° half angle spot optic + optic holder*
CLP17CR, 6° metalized polycarbonate reflector
CLP23CR, 20° metalized polycarbonate reflector
* optic holder can not be directly attached to APG2C1 LEDs
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Soldering Conditions
Reflow Soldering:
APG2C1 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use
a reflow soldering process for array assembly!
Hot Bar Soldering:
A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process
will only transfer heat to the leads and avoids overheating the emitter which will damage the
device. In order to transfer sufficient heat from the hot bar to the device, following parameters
must be carefully considered:
•
•
•
•
•
•
Amount of flux
Pressing force of solder tip
Hot bar temperature
For the standard assembly process, following parameters should be maintained:
Hot Bar temperature: 330 °C
Force of Hot Bar. 40 N
Soldering time: 1.5 s
It is recommended to use a copper nickel-plated hot bar mounted to standard temperature
controlled soldering equipment.
Manual Hand Soldering:
For prototype build or small series production runs, it is possible to place and solder the
emitters by hand. It is therefore recommended to maintain the following parameters:
•
•
•
Solder Tip Temperature 330 °C
Soldering time. < 1.5 s
Junction temperature must be kept below 70 °C
A visual inspection may be used to check the quality of the solder joint
General Soldering Precautions:
•
•
•
Mechanical stress, shock and vibration must be avoided during soldering
Only use non corrosive flux.
Do not apply current to the device until it has cooled down to room temperature after
soldering.
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