APTDF400AA60G
Dual Common Anode diodes
Power Module
V
RRM
= 600V
I
C
= 400A @ Tc = 80°C
Application
Uninterruptible Power Supply (UPS)
Induction heating
Welding equipment
High speed rectifiers
K1
A
Features
Benefits
Outstanding performance at high frequency
operation
Low losses
Low noise switching
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
RoHS Compliant
Ultra fast recovery times
Soft recovery characteristics
High blocking voltage
High current
Low leakage current
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
K2
Absolute maximum ratings
Symbol
V
R
V
RRM
I
F(AV)
I
F(RMS)
I
FSM
Parameter
Maximum DC reverse Voltage
Maximum Peak Repetitive Reverse Voltage
Maximum Average Forward
Current
Duty cycle = 50%
T
C
= 25°C
T
C
= 80°C
T
C
= 45°C
T
C
= 45°C
Max ratings
600
500
APTDF400AA60G – Rev 2 October, 2012
Unit
V
RMS Forward Current
Duty cycle = 50%
Non-Repetitive Forward Surge Current
8.3ms
400
500
3000
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
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1-5
APTDF400AA60G
All ratings @ T
j
= 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
V
F
I
RM
C
T
Diode Forward Voltage
Maximum Reverse Leakage Current
Junction Capacitance
Test Conditions
I
F
= 400A
I
F
= 800A
T
j
= 125°C
I
F
= 400A
T
j
= 25°C
V
R
= 600V
T
j
= 125°C
V
R
= 600V
Min
Typ
1.6
2.0
1.3
Max
2.0
Unit
V
750
1000
760
µA
pF
Dynamic Characteristics
Symbol Characteristic
t
rr
t
rr
Q
rr
I
RRM
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
F
= 400A
V
R
= 400V
I
F
= 400A
V
R
= 400V
di/dt = 800A/µs
Test Conditions
I
F
=1A,V
R
=30V
di/dt = 400A/µs
T
j
= 25°C
T
j
= 25°C
T
j
= 125°C
T
j
= 25°C
T
j
= 125°C
T
j
= 25°C
T
j
= 125°C
T
j
= 125°C
Min
Typ
34
160
220
1.16
6.12
20
52
100
11.6
176
Max
Unit
ns
ns
µC
A
ns
µC
A
di/dt = 4000A/µs
Thermal and package characteristics
Symbol
R
thJC
V
ISOL
T
J
T
STG
T
C
Torque
Wt
Characteristic
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
Min
4000
-40
-40
-40
3
2
Typ
Max
0.14
175
125
100
5
3.5
300
Unit
°C/W
V
°C
N.m
g
APTDF400AA60G – Rev 2 October, 2012
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
To heatsink
For terminals
M6
M5
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2-5
APTDF400AA60G
Typical Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.16
Thermal Impedance (°C/W)
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
0.00001
0.9
0.7
0.5
0.3
0.1
0.05
0.0001
0.001
Single Pulse
0.01
0.1
1
10
Rectangular Pulse Duration (Seconds)
Forward Current vs Forward Voltage
1200
I
F
, Forward Current (A)
1000
T
J
=175°C
300
t
rr
, Reverse Recovery Time (ns)
Trr vs. Current Rate of Charge
T
J
=125°C
V
R
=400V
250
400 A
800 A
800
600
400
200
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
V
F
, Anode to Cathode Voltage (V)
Q
RR
vs. Current Rate Charge
T
J
=125°C
V
R
=400V
800 A
T
J
=125°C
T
J
=25°C
200
150
100
50
0
800
1600 2400 3200 4000 4800
-di
F
/dt (A/µs)
200 A
T
J
=-55°C
Q
RR
, Reverse Recovery Charge (µC)
I
RRM
, Reverse Recovery Current (A)
16
240
200
160
120
80
40
0
0
I
RRM
vs. Current Rate of Charge
T
J
=125°C
V
R
=400V
800 A
400 A
200 A
12
400 A
200 A
8
4
0
0
800
1600 2400 3200 4000 4800
-diF/dt (A/µs)
Capacitance vs. Reverse Voltage
5600
4800
800
1600 2400 3200 4000 4800
-diF/dt (A/µs)
Max. Average Forward Current vs. Case Temp.
600
500
I
F
(AV) (A)
400
300
200
100
0
Duty Cycle = 0.5
T
J
=175°C
C, Capacitance (pF)
3200
2400
1600
800
0
1
10
100
1000
V
R
, Reverse Voltage (V)
25
50
75
100
125
150
175
Case Temperature (°C)
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3-5
APTDF400AA60G – Rev 2 October, 2012
4000
APTDF400AA60G
SP6 Package outline
(dimensions in mm)
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4-5
APTDF400AA60G – Rev 2 October, 2012
APTDF400AA60G
DISCLAIMER
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PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
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authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
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inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
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is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
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APTDF400AA60G – Rev 2 October, 2012
