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AS7C256A-12JCN

sram 256k, 5V, 12ns, fast 32k x 8 asynch sram

器件类别:半导体    其他集成电路(IC)   

厂商名称:All Sensors

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器件参数
参数名称
属性值
Manufacture
Alliance Memory
产品种类
Product Category
SRAM
RoHS
Yes
Memory Size
256 kbi
Organizati
32 k x 8
Access Time
12 ns
Interface
Parallel
电源电压-最大
Supply Voltage - Max
5.5 V
Supply Voltage - Mi
4.5 V
Maximum Operating Curre
2 mA
最大工作温度
Maximum Operating Temperature
+ 70 C
最小工作温度
Minimum Operating Temperature
0 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
SOJ-28
系列
Packaging
Tube
Maximum Clock Frequency
83 MHz
工厂包装数量
Factory Pack Quantity
25
文档预览
September 2004
®
AS7C256A
5V 32K X 8 CMOS SRAM (Common I/O)
Features
Pin compatible with AS7C256
Industrial and commercial temperature options
Organization: 32,768 words × 8 bits
High speed
- 10/12/15/20 ns address access time
- 5, 6, 7, 8 ns output enable access time
• Very low power consumption: ACTIVE
- 412.5 mW max @ 10 ns
• Very low power consumption: STANDBY
- 11 mW max CMOS I/O
• Easy memory expansion with CE and OE inputs
• TTL-compatible, three-state I/O
• 28-pin JEDEC standard packages
- 300 mil SOJ
- 8
×
13.4 mm TSOP 1
• ESD protection
2000 volts
• Latch-up current
200 mA
• 2.0V Data retention
Logic block diagram
V
CC
GND
Input buffer
Pin arrangement
28-pin TSOP 1 (8×13.4 mm)
28-pin SOJ (300 mil)
A0
A1
A2
A3
A4
A5
A6
A7
I/O7
Row decoder
Sense amp
256 X 128 X 8
Array
(262,144)
I/O0
OE
A11
A9
A8
A13
WE
V
CC
A14
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AS7C256A
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
Column decoder
WE
Control
circuit
OE
CE
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
WE
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
A A A A A A A
8 9 10 11 12 13 14
Selection guide
-10
Maximum address access time
Maximum output enable access time
Maximum operating current
Maximum CMOS standby current
10
5
75
2
-12
12
6
70
2
-15
15
7
65
2
-20
20
8
60
2
Unit
ns
ns
mA
mA
9/24/04; v.1.2
Alliance Semiconductor
P. 1 of 9
Copyright © Alliance Semiconductor. All rights reserved.
AS7C256A
AS7C256A
®
Functional description
The AS7C256A is a 5.0V high-performance CMOS 262,144-bit Static Random-Access Memory (SRAM) device organized
as 32,768 words × 8 bits. It is designed for memory applications requiring fast data access at low voltage, including
Pentium
TM
, PowerPC
TM
, and portable computing. Alliance’s advanced circuit design and process techniques permit 5.0V
operation without sacrificing performance or operating margins.
The device enters
standby mode
when
CE
is high. CMOS standby mode consumes
≤11
mW. Normal operation offers 75%
power reduction after initial access, resulting in significant power savings during CPU idle, suspend, and stretch mode.
Equal address access and cycle times (t
AA
, t
RC
, t
WC
) of 10/12/15/20 ns with output enable access times (t
OE
) of 5, 6, 7, 8 ns
are ideal for high-performance applications. The chip enable (
CE
) input permits easy memory expansion with multiple-bank
memory organizations.
A write cycle is accomplished by asserting chip enable (CE) and write enable (WE) LOW. Data on the input pins I/O0-I/O7
is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should
drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting chip enable (
CE
) and output enable (
OE
) LOW, with write enable (
WE
) high. The
chip drives I/O pins with the data word referenced by the input address. When chip enable or output enable is high, or write
enable is low, output drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible. Operation is from a single 5.0 ±0.5V supply. The AS7C256A is packaged
in high volume industry standard packages.
Absolute maximum ratings
Parameter
Voltage on V
CC
relative to GND
Voltage on any pin relative to GND
Power dissipation
Storage temperature (plastic)
Ambient temperature with V
CC
applied
DC current into outputs (low)
Symbol
V
t1
V
t2
P
D
T
stg
T
bias
I
OUT
Min
–0.5
–0.5
–65
–55
Max
+7.0
V
CC
+ 0.5
1.0
+150
+125
20
Unit
V
V
W
o
C
o
C
mA
Stresses greater than those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Truth table
CE
H
L
L
L
WE
X
H
H
L
OE
X
H
L
X
High Z
High Z
D
OUT
D
IN
Data
Mode
Standby (I
SB
, I
SB1
)
Output disable (I
CC
)
Read (I
CC
)
Write (I
CC
)
Key:
X = Don’t care, L = Low, H = High
9/24/04; v.1.2
Alliance Semiconductor
P. 2 of 9
AS7C256A
®
Recommended operating conditions
Parameter
Supply voltage
Input voltage
Ambient operating temperature
commercial
industrial
Symbol
V
CC
V
IH**
V
IL*
T
A
T
A
Min
4.5
2.2
-0.5
0
–40
Typical
5.0
Max
5.5
V
CC
+0.5
0.8
70
85
Unit
V
V
V
o
C
o
C
*
V
IL
min = –1.0V for pulse width less than 5ns.
**
V
IH
max = V
CC
+ 2.0V for pulse width less than 5ns.
DC operating characteristics (over the operating range)
1
-10
Parameter
Input leakage
current
Sym
|I
LI
|
Test conditions
V
CC
= Max,
V
in
= GND to V
CC
-12
-15
-20
Min Max Min Max Min Max Min Max Unit Notes
2.4
1
1
75
45
2.0
0.4
-
2.4
1
1
70
45
2.0
0.4
2.4
1
1
65
40
2.0
0.4
2.4
1
1
60
40
2.0
0.4
µA
µA
mA
mA
mA
V
V
4
4
Output leakage
V = Max,
|I
LO
|
CC
current
V
OUT
= GND to V
CC
Operating
V
CC
= Max, CE
<
V
IL
power supply I
CC
f = f
Max
, I
OUT
= 0mA
current
I
SB
Standby power
supply current
V
CC
= Max, CE
>
V
IH
f = f
Max
V
CC
= Max, CE
>
V
CC
–0.2V
I
SB1
V
IN
< 0.2V or
V
IN
> V
CC
–0.2V, f = 0
V
OL
I
OL
= 8 mA, V
CC
= Min
V
OH
I
OH
= –4 mA, V
CC
= Min
Output voltage
Capacitance (f = 1MHz, T
a
= room temperature, V
CC
= NOMINAL)
4
Parameter
Input capacitance
I/O capacitance
Symbol
C
IN
C
I/O
Signals
A, CE, WE, OE
I/O
Test conditions
V
in
= 0V
V
in
= V
out
= 0V
Max
5
7
Unit
pF
pF
9/24/04; v.1.2
Alliance Semiconductor
P. 3 of 9
AS7C256A
®
Read cycle (over the operating range)
2,8
-10
Parameter
Read cycle time
Address access time
Chip enable (CE) access time
Output enable (OE) access time
Output hold from address change
CE LOW to output in low Z
CE HIGH to output in high Z
OE LOW to output in low Z
OE HIGH to output in high Z
Power up time
Power down time
Symbol Min
t
RC
t
AA
t
ACE
t
OE
t
OH
t
CLZ
t
CHZ
t
OLZ
t
OHZ
t
PU
t
PD
10
3
3
0
0
Max
10
10
5
3
3
10
Min
12
3
3
0
0
-12
Max
12
12
6
3
3
12
Min
15
3
3
0
0
-15
Max
15
15
7
4
4
15
Min
20
3
3
0
0
-20
Max
20
20
8
5
5
20
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
4
3,4
3,4
3,4
3,4
3,4
3,4
2
2
Notes
Key to switching waveforms
Rising input
Falling input
Undefined output/don’t care
Read waveform 1 (address controlled)
2,5,6,8
t
RC
Address
t
AA
D
out
Data valid
t
OH
Read waveform 2 (CE controlled)
2,5,7,8
t
RC1
CE
t
OE
OE
t
OLZ
D
out
t
CLZ
Supply
current
t
PU
50%
t
ACE
Data valid
t
PD
50%
I
CC
I
SB
t
OHZ
t
CHZ
9/24/04; v.1.2
Alliance Semiconductor
P. 4 of 9
AS7C256A
®
Write cycle (over the operating range)
9
-10
Parameter
Write cycle time
Chip enable to write end
Address setup to write end
Address setup time
Write pulse width
Write recovery time
Address hold from end of write
Data valid to write end
Data hold time
Write enable to output in high Z
Output active from write end
Symbol
t
WC
t
CW
t
AW
t
AS
t
WP
t
WR
t
AH
t
DW
t
DH
t
WZ
t
OW
Min
10
8
8
0
7
0
0
5
0
3
Max
5
Min
12
8
8
0
8
0
0
6
0
3
-12
Max
6
Min
15
10
10
0
9
0
0
8
0
3
-15
Max
7
Min
20
12
12
0
12
0
0
10
0
3
-20
Max
8
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
3,4
3,4
3,4
Notes
Write waveform 1 (WE controlled)
9
t
AW
Address
WE
t
AS
D
in
t
WZ
D
out
t
WP
t
DW
Data valid
t
OW
t
WR
t
DH
t
WC
t
AH
Write waveform 2 (CE controlled)
9
t
AW
Address
t
AS
CE
WE
t
DW
D
in
Data valid
t
DH
t
CW
t
WR
t
WC
t
AH
9/24/04; v.1.2
Alliance Semiconductor
P. 5 of 9
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