ASMC-PxB9-Txxxx
Envisium Power PLCC-4
Surface Mount LED
Data Sheet
Envisium
Envisium is the premier class of
mid-Power LEDs from Agilent
and Lumileds utilizing the very
best solid-state lighting
technologies from these two
industry leaders. Envisium LEDs
offer unparalleled performance,
engineering and design flexibility.
For the very first time, customers
have options for mid-power LEDs.
Description
The Envisium Power PLCC-4 SMT
LED is an extension of Agilent’s
PLCC-4 SMT LEDs. The package
can be driven at high current due
to its superior package design.
The product is able to dissipate
the heat more efficiently
compared to the conventional
PLCC-2 SMT LEDs. These LEDs
produce higher light output with
better flux performance compared
to the conventional PLCC-4 SMT
LEDs.
The Envisium Power PLCC-4 SMT
LEDs are designed for higher
reliability, better performance,
and operate under a wide range of
environmental conditions. The
performance characteristics of
these new mid-power LEDs make
them uniquely suitable for use in
harsh conditions such as in
automotive applications, and in
electronics signs and signals.
To facilitate easy pick and place
assembly, the LEDs are packed in
EIA-compliant tape and reel.
Every reel is shipped in single
intensity and color bin (except for
red), to provide close uniformity.
These LEDs are compatible with
the IR solder reflow process. Due
to the high reliability feature of
these products, they also can be
mounted using through-the-wave
soldering process.
The Envisium Power PLCC-4 SMT
LED is available in 3 colors, red,
red-orange and amber.
Features
• Industry standard PLCC-4 (Plastic
Leaded Chip Carrier)
• High reliability LED package
• Mid-Power intensity brightness with
optimum flux performance using TS
AlInGaP dice technologies
• Available in Red, Red Orange and
Amber colors
• High optical efficiency
• Higher ambient temperature at the
same current possible compared to
PLCC-2
• Super wide viewing angle at 120°
• Available in 8 mm carrier tape on 7-
inch reel
• Compatible with both IR and TTW
soldering process
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Navigation and audio system
– Push button backlighting
• Exterior automotive
– Turn signals
– Side repeaters
– CHMSL
– Rear combination lamp
– Puddle light
• Electronic signs and signals
– Channel lettering
– Contour lighting
– Indoor variable message sign
• Office automation, home appliances,
industrial equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
Package Dimensions
2.8
±
0.2
2.2
±
0.2
A
C
0.1 TYP.
1.9
±
0.2
0.8
±
0.1
3.2
±
0.2
3.5
±
0.2
0.8
±
0.3
C
C
0.5
±
0.1
CATHODE MARKING
0.7
±
0.1
NOTE: ALL DIMENSIONS IN mm.
Device Selection Guide
Intensity
Bin
V1
Red
ASMC-PRB9-TV005
V2
W1
W1
Red Orange
ASMC-PHB9-TW005
W2
X1
V1
Amber
ASMC-PAB9-TV005
V2
W1
Min. I
V
(mcd)
630.00
790.00
1000.00
1000.00
1200.00
1580.00
630.00
790.00
1000.00
Max. I
V
(mcd)
1000.00
1260.00
1600.00
1600.00
2020.00
2500.00
1000.00
1260.00
1600.00
Total Flux
F
V
(mlm)
[2,3]
Typ.
2600.00
3300.00
-
4300.00
5000.00
-
3000.00
3800.00
-
50
AlInGaP
50
AlInGaP
50
AlInGaP
Test
Current
(mA)
Dice
Technology
Color
Part Number
Notes:
1. The luminous intensity, I
V
, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2.
F
V
is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
3. Flux tested at mono pulse conditions.
2
Part Numbering System
ASMC - PX
1
B9 - TX
2
X
3
X
4
X
5
Packaging Option
Color Bin Selection
Intensity Bin Limit
Intensity Bin Selection
LED Chip Color
Absolute Maximum Ratings (T
A
= 25°C)
Parameters
DC Forward Current
[1]
Peak Forward Current
[2]
Power Dissipation
Reverse Voltage
Junction Temperature
Operating Temperature
Storage Temperature
ASMC-PxB9-Txxxx
70 mA
[3,4]
200 mA
240 mW
5V
125°C
-40°C to +100°C
-40°C to +100°C
Notes:
1. Derate linearly as shown in figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
Optical Characteristics (T
A
= 25°C)
Luminous
Intensity/
Total Flux
I
V
(mcd)/
F
V[4,5]
(lm)
Typ.
0.30
0.29
0.26
Color
Red
Red Orange
Amber
Part Number
ASMC-PRB9-Txxx5
ASMC-PHB9-Txxx5
ASMC-PAB9-Txxx5
Dice
Technology
AlInGaP
AlInGaP
AlInGaP
Peak
Wavelength
l
PEAK
(nm)
Typ.
639.0
623.0
594.0
Dominant
Wavelength
l
D[1]
(nm)
Typ.
630.0
617.0
592.0
Viewing
Angle 2q
1
/
2[2]
(Degrees)
Typ.
120
120
120
Luminous
Efficacy
h
V[3]
(lm/W)
Typ.
155
263
500
Notes:
1. The dominant wavelength,
l
D
, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2.
q
1
/
2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = I
V
/h
V
, where I
V
is the luminous intensity in candelas and
h
V
is the
luminous efficacy in lumens/watt.
4.
F
V
is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
5. Flux tested at mono pulse conditions.
Electrical Characteristics (T
A
= 25°C)
Forward Voltage V
F
(Volts) @ I
F
= 50 mA
Part Number
ASMC-PxB9-Txxx5
Typ.
2.8
Max.
3.4
Reverse Voltage V
R
@ 100
µA
Min.
5
3
1.0
0.9
0.8
RELATIVE INTENSITY
RED ORANGE
AMBER
RED
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
380
430
480
530
580
630
680
730
780
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
80
1.4
80
MAXIMUM FORWARD CURRENT – mA
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75
DC FORWARD CURRENT – mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 50 mA)
70
1.2
1.0
0.8
0.6
0.4
0.2
0
70
60
50
40
30
20
10
0
0
20
40
60
80
100
120
FORWARD CURRENT – mA
60
50
40
30
20
10
0
0
1
2
3
4
FORWARD VOLTAGE – V
AMBIENT TEMPERATURE –
°C
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative intensity vs. forward current.
Figure 4. Maximum forward current vs. ambient
temperature. Derated based on T
J
MAX = 125°C,
RqJA = 300°C/W.
1.0
0.9
0.8
RELATIVE INTENSITY
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE – DEGREES
Figure 5. Radiation pattern.
4
20 SEC. MAX.
TEMPERATURE
240°C MAX.
3°C/SEC. MAX.
100-150°C
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
60-150 SEC.
183°C
–6°C/SEC.
MAX.
Figure 6a. Recommended Sn-Pb reflow soldering profile.
10 to 20 SEC.
217
°C
TEMPERATURE
+5
°C
255
°C
-0
°C
6
°C/SEC.
MAX.
3
°C/SEC.
MAX.
125
°C ±
25
°C
MAX. 120 SEC.
60 to 150 SEC.
TIME
* THE TIME FROM 25
°C
TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 6b. Recommended Pb-free reflow soldering profile.
TURBULENT WAVE
250
200
150
FLUXING
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TEMPERATURE –
°C
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
100
50
30
0
10
PREHEAT
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
5
FPGA/CPLD
