ASMT-QWB2-Nxxxx
Super 0.5W White Power PLCC-4
Surface Mount LED Indicator
Data Sheet
Description
The Super 0.5W White Power PLCC-4 SMT LED is first
white mid-Power PLCC-4 SMT LEDs using InGaN chip
technology. The package can be driven at high current
due to its superior package design. The product is able
to dissipate the heat more efficiently compared to the
Power PLCC-4 SMT LEDs. These LEDs produce higher light
output with better flux performance compared to the
Power PLCC-4 SMT LED.
The Super 0.5W White Power PLCC-4 SMT LEDs are
designed for higher reliability, better performance, and
operate under a wide range of environmental conditions.
The performance characteristics of these new mid-power
LEDs make them uniquely suitable for use in harsh condi-
tions such as in automotive applications, and in electron-
ics signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin, to provide close
uniformity.
Features
x
Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9mm)
x
High reliability package with enhanced silicone resin
encapsulation
x
High brightness with optimum flux performance
using InGaN chip technologies
x
Available in Cool White
x
High optical efficiency 30lm/W
x
Available in 8mm carrier tape and 7 inch reel
x
Low Thermal Resistance 60
qC/W
x
Super wide viewing angle at 120q
x
JEDEC MSL 2a
Applications
1. Interior automotive
a. Instrument panel backlighting
b. Central console backlighting
c. Navigation and audio system backlighting
d. Dome/Map lighting
e. Push button backlighting
f. Puddle lamp
g. Glove compartment illumination
2. Exterior automotive
a. Number plate illumination
b. Rear reverse lamp indicator
3. Electronic signs and signals
a. Decorative lighting
4. Office automation, home appliances, industrial
equipment
a. Panel/button backlighting
b. Display backlighting
CAUTION:
ASMT-QWB2-Nxxxx LEDs are Class 1C ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
1
Package Drawing
0.79 ± 0.3
2.8 ± 0.2
2.2 ± 0.2
A
A
1.9 ± 0.2
0.6 ± 0.3
1.15 ± 0.2
3.6
± 0.2
3.2
± 0.2
I
2.4
0.97
C
CATHODE
MARKING
C
0.7
Note:
1. All Dimensions in millimeters.
2. Lead Polarity as shown in Figure 11.
3. Terminal Finish: Ag plating
4. Encapsulation material: Silicone resin
Figure 1. Package Drawing
Table 1. Device Selection Guide (T
J
= 25 °C)
Luminous Flux,
)
V [1]
(lm)
Color
White
Part Number
ASMT-QWB2-NEF0E
Min. Flux (lm)
11.5
Typ. Flux (lm)
17.0
Max. Flux (lm)
19.5
0.56 (TYP.)
0.41 (TYP.)
Test Current (mA)
150
Dice Technology
InGaN
Notes:
1.
)
V
is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
2. Tolerance = ±12%
Part Numbering System
A S M
T –
Q
X
1
B 2
–
N
X
2
X
3
X
4
X
5
Packaging
Option
Colour Bin Selection
Max.
Flux
Bin Selection
Min.
Flux
Bin Selection
Color
W - Cool White
2
Table 2. Absolute Maximum Ratings (T
A
= 25 °C)
Parameters
DC Forward Current
[1]
Peak Forward Current
[2]
Power Dissipation
Reverse Voltage
Junction Temperature
Operating Temperature
Storage Temperature
ASMT-QWB2-Nxxxx
150 mA
300 mA
513 mW
Not Recommended for Reverse Bias
125 °C
-40 °C to +110 °C
-40 °C to +110 °C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table
3. Optical
Characteristics (T
J
= 25 °C)
Typical
Chromaticity
Coordinates
[1]
x
0.31
Color
White
Part Number
ASMT-QWB2-Nxxxx
Dice
Technology
InGaN
Viewing Angle
2O
½[1]
(Degrees)
Typ.
120
Luminous
Efficiency
K
e
(lm/W)
Typ.
30
Total Flux / Luminous
Intensity
F
V
(lm) / I
V
(cd)
Typ.
2.85
y
0.31
Notes:
1.
T
½
is the off-axis angle where the luminous intensity is ½ the peak intensity.
Table
4.
Electrical Characteristics (T
J
= 25 °C)
Forward Voltage
V
F
(Volts) @ I
F
= 150 mA
Part Number
ASMT-QWB2-Nxxxx
Typ.
3.6
Max.
4.1
Thermal
Resistance
RT
J-P
(°C/W)
60
1.0
0.9
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380 400 420 440 460 480
500 520 540 560 580 600 620 640 660 680 700 720 740 760 780
WAVELENGTH
-
nm
0.8
RELATIVE
INTENSITY
350
300
FORWARD
CURRENT
-
mA
250
200
150
100
50
0
0
1
2
3
4
FORWARD
VOLTAGE
-
V
5
Figure 2. Relative Intensity Vs. Wavelength
Figure
3.
Forward Current Vs. Forward Voltage.
3
1.2
NORMALIZED LUMINOUS
INTENSITY
1.4
1.2
1.0
RELATIVE LUMINOUS
FLUX
(NORMALIZATION AT
150mA)
0.8
0.6
0.4
0.2
0
0
25
50
75
100
DC
FORWARD
CURRENT
-
mA
125
150
1
0.8
0.6
0.4
0.2
0
-50
-25
0
25
50
75
JUNCTION
TEMPERATURE -
°C
100
125
Figure
4.
Relative Flux vs. Forward Current
Figure 5. Relative Intensity Vs. Temperature
160
MAXIMUM
FORWARD
CURRENT
-
mA
160
MAXIMUM
FORWARD
CURRENT
-
mA
140
120
100
80
60
40
20
0
0
20
40
60
80
AMBIENT
TEMPERATURE -
°C
100
120
Rθ
JA
=
90°C/W
Rθ
JA
= 110°C/W
140
120
Rθ
JP
=
60°C/W
100
80
60
40
20
0
0
20
40
60
80
SOLDER POINT
TEMPERATURE -
°C
100
120
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
Derated Based on T
JMAX
= 125°C, RT
J-A
= 90°C/W and 110 °C/W.
Figure 6b. Maximum forward current vs. solder point temperature.
Derated Based on T
JMAX
= 125°C, RT
JP
=60°C/W
0.25
0.2
FORWARD
VOLTAGE SHIFT
-
V
NORMALIZED
INTENSITY
0.15
0.1
0.05
0
-50
-25
-0.05
-0.1
-0.15
JUNCTION
TEMPERATURE -
°C
Figure 7. Forward Voltage Shift Vs. Temperature.
0
25
50
75
100
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT
-
DEGREES
90
Figure 8. Radiation Pattern
4
10 to
30
SEC.
255 - 260°C
3
°C/SEC. MAX.
6°C/SEC. MAX.
3
°C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
TEMPERATURE
D
217 °C
200 °C
150 °C
TIME
(Acc. to J - STD-020C)
Figure 10. Recommended Pb-free Reflow Soldering Profile
Note: Diameter "D" should be smaller than 2.2mm
Note: For detail information on reflow soldering of Avago surface mount
LEDs, do refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components
Figure 9. Recommended Pick and Place Nozzle Size
2.4
0.6
0.9
X
6
1.3
x 6
A
A
A
A
0.4
1.1
C
C
4.6
C
C
C
CATHODE
MARKING
C
0.3
SOLDER MASK
A
C
ANODE
CATHODE
CATHODE
MARKING
MINIMUM 55 mm
2
OF
CATHODE PAD
FOR IMPROVED HEAT
DISSIPATION
Figure 11. Recommended Soldering Pad Pattern
5
stm32/stm8
