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AT45CS1282-CL

Flash, 128MX1, PBGA44

器件类别:存储    存储   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
包装说明
8 X 12 MM, 1.20 MM HEIGHT, PLASTIC, CBGA-44
Reach Compliance Code
compliant
ECCN代码
3A991.B.1.A
其他特性
138412032 BITS OF MEMORY ORGANIZED AS 16384 PAGES OF 1056 BYTES EACH
JESD-30 代码
R-PBGA-B44
JESD-609代码
e1
长度
12 mm
内存密度
134217728 bit
内存集成电路类型
FLASH
内存宽度
1
湿度敏感等级
3
功能数量
1
端子数量
44
字数
134217728 words
字数代码
128000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
128MX1
封装主体材料
PLASTIC/EPOXY
封装代码
TBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE
并行/串行
PARALLEL/SERIAL
峰值回流温度(摄氏度)
260
编程电压
2.7 V
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
40
类型
NOR TYPE
宽度
8 mm
文档预览
Features
Single 2.7V - 3.6V Supply
Dual-interface Architecture
– RapidS
Serial Interface: 50 MHz Maximum Clock Frequency
(SPI Modes 0 and 3 Compatible for Frequencies up to 33 MHz)
– Rapid8
8-bit Interface: 20 MHz Maximum Clock Frequency
Page Program
– 16,384 Pages (1,056 Bytes/Page) Main Memory
Sector Erase Architecture
– Sixty-three 270,336-byte Sectors
– One 261,888-byte Sector
– One 8,488-byte Sector
Two 1056-byte SRAM Data Buffers – Allows Receiving of Data
while Reprogramming the Flash Array
Continuous Read Capability through Entire Array
– Ideal for Code Shadowing Applications
Low-power Dissipation
– 10 mA Active Read Current Typical – Serial Interface
– 12 mA Active Read Current Typical – 8-bit Interface
– 15 µA CMOS Standby Current Typical
Hardware Data Protection
Security: 128-byte Security Register
– 64-byte User Programmable Space
– Unique 64-byte Device Identifier
JEDEC Standard Manufacturer and Device ID Read
100 Program/Erase Cycles Per Sector Minimum
Data Retention – 10 Years
Commercial Temperature Range
128-megabit
2.7-volt
Dual-interface
Code Shadow
DataFlash
®
AT45CS1282
Preliminary
Description
The AT45CS1282 is a 2.7-volt, dual-interface sequential access Flash memory
ideally suited for infrequent code shadowing applications. This device utilizes Atmel’s
e
-
STAC
Multi-Level Cell (MLC) memory technology, which allows a single cell to
Pin Configurations
Pin Name
CS
SCK/CLK
SI
SO
I/O7 - I/O0
WP
RESET
RDY/BUSY
SER/BYTE
Function
Chip Select
Serial Clock/Clock
Serial Input
Serial Output
8-bit Input/Output
Hardware Page Write
Protect Pin
TSOP Top View: Type 1
NC
NC
RDY/BUSY
RESET
WP
NC
NC
NC
VCC
GND
NC
NC
NC
NC
CS
SCK
SI*
SO*
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
NC
NC
NC
NC
NC
I/O7*
I/O6*
I/O5*
I/O4*
VCCP*
GNDP*
I/O3*
I/O2*
I/O1*
I/O0*
SER/BYTE*
CLK
NC
NC
NC
CBGA Top View
1
2
3
4
5
A
Chip Reset
Ready/Busy
Serial/8-bit Interface
Control
B
C
NC SER/BYTE NC
I/O7
VCC
I/O6
I/O5
I/O4
D
I/O2 SCK/CLK GND
E
I/O1
CS RDY/BUSY WP
SO
SI
F
I/O0
RESET I/O3
NC
NC
G
NC
GNDP VCCP
H
Note:
*Optional Use – See pin description text
for connection information.
J
Rev. 3447A–DFLSH–2/04
1
store two bits of information delivering a very cost effective high density Flash mem-
ory. The AT45CS1282 supports RapidS serial interface and Rapid8 8-bit interface.
RapidS serial interface is SPI compatible for frequencies up to 33 MHz. The dual-inter-
face allows a dedicated serial interface to be connected to a DSP and a dedicated 8-bit
interface to be connected to a microcontroller or vice versa. However, the use of either
interface is purely optional. Its 138,412,032 bits of memory are organized as 16,384
pages of 1,056 bytes each. In addition to the 132-megabit main memory, the
AT45CS1282 also contains two SRAM buffers of 1,056 bytes each. The buffers allow
the receiving of data while a page in the main Memory is being reprogrammed, as well
as writing a continuous data stream. Unlike conventional Flash memories that are
accessed randomly with multiple address lines and a parallel interface, the DataFlash
uses either a RapidS serial interface or a 8-bit Rapid8 interface to sequentially access
its data. The simple sequential access dramatically reduces active pin count, facilitates
hardware layout, increases system reliability, minimizes switching noise, and reduces
package size. The device is optimized for use in many commercial applications where
high-density, low-pin count, low-voltage and low-power are essential. The device oper-
ates at clock frequencies up to 50 MHz with a typical active read current consumption of
10 mA.
To allow for simple in-system reprogrammability, the AT45CS1282 does not require
high input voltages for programming. The device operates from a single power supply,
2.7V to 3.6V, for both the program and read operations. The AT45CS1282 is enabled
through the chip select pin (CS) and accessed via a three-wire interface consisting of
the Serial Input (SI), Serial Output (SO), and the Serial Clock (SCK), or an 8-bit interface
consisting of the input/output pins (I/O7 - I/O0) and the clock pin (CLK).
All programming and erase cycles are self-timed.
Block Diagram
WP
FLASH MEMORY ARRAY
PAGE (1056 BYTES)
BUFFER 1 (1056 BYTES)
BUFFER 2 (1056 BYTES)
SCK/CLK
CS
RESET
VCC
GND
RDY/BUSY
SER/BYTE
I/O INTERFACE
SI
SO
I/O7 - I/O0
Memory Array
To provide optimal flexibility, the memory array of the AT45CS1282 is divided into two
levels of granularity comprising of sectors, and pages. The “Memory Architecture Dia-
gram” illustrates the breakdown of each level and details the number of pages per
sector. All program operations to the DataFlash occur on a page by page basis. The
erase operations is performed at the sector level.
2
AT45CS1282 [Preliminary]
3447A–DFLSH–2/04
AT45CS1282 [Preliminary]
Memory Architecture
Diagram
SECTOR ARCHITECTURE
SECTOR 0a = 8 Pages
8,448 bytes (8K + 256)
PAGE ARCHITECTURE
8 Pages
PAGE 0
PAGE 1
SECTOR 0b = 248 Pages
261,888 bytes (248K + 7,936)
PAGE 6
PAGE 7
SECTOR 1 = 256 Pages
270,336 bytes (256K + 8K)
PAGE 8
PAGE 9
SECTOR 2 = 256 Pages
270,336
bytes (256K + 8K)
PAGE 14
PAGE 15
PAGE 16
PAGE 17
PAGE 18
SECTOR 62 = 256 Pages
270,336 bytes (256K + 8K)
SECTOR 63 = 256 Pages
270,336 bytes (256K + 8K)
PAGE 16,382
PAGE 16,383
Page = 1,056 bytes
(1K + 32)
Device Operation
The device operation is controlled by instructions from the host processor. The list of
instructions and their associated opcodes are contained in Tables 1 through 4. A valid
instruction starts with the falling edge of CS followed by the appropriate 8-bit opcode
and the desired buffer or main memory address location. While the CS pin is low, tog-
gling the SCK/CLK pin controls the loading of the opcode and the desired buffer or main
memory address location through either the SI (serial input) pin or the 8-bit input pins
(I/O7 - I/O0). All instructions, addresses, and data are transferred with the most signifi-
cant bit (MSB) first.
Buffer addressing is referenced in the datasheet using the terminology BFA10 - BFA0 to
denote the 11 address bits required to designate a byte address within a buffer. Main
memory addressing is referenced using the terminology PA13 - PA0 and BA10 - BA0,
where PA13 - PA0 denotes the 14 address bits required to designate a page address
and BA10 - BA0 denotes the 11 address bits required to designate a byte address within
the page.
Read Commands
By specifying the appropriate opcode, data can be read from the main memory or from
either one of the two SRAM data buffers. The DataFlash supports RapidS and Rapid8
protocols for Mode 0 and Mode 3. Please refer to the “Detailed Bit-level Read Timing”
diagrams in this datasheet for details on the clock cycle sequences for each mode.
CONTINUOUS ARRAY READ:
By supplying an initial starting address for the main
memory array, the Continuous Array Read command can be utilized to sequentially
read a continuous stream of data from the device by simply providing a clock signal; no
additional addressing information or control signals need to be provided. The DataFlash
incorporates an internal address counter that will automatically increment on every clock
cycle, allowing one continuous read operation without the need of additional address
sequences. To perform a continuous read, an opcode of E8H must be clocked into the
device followed by four address bytes (which comprises 7 don’t care bits plus the 25-bit
page and byte address sequence) and a series of don’t care clock cycles (24 if using the
serial interface or 19 if using the 8-bit interface). The first 14 bits (PA13 - PA0) of the
3
3447A–DFLSH–2/04
25-bit address sequence specify which page of the main memory array to read, and the
last 11 bits (BA10 - BA0) of the 25-bit address sequence specify the starting byte
address within the page. The 24 or 19 don’t care clock cycles that follow the four
address bytes are needed to initialize the read operation. Following the don’t care clock
cycles, additional clock pulses on the SCK/CLK pin will result in data being output on
either the SO (serial output) pin or the eight output pins (I/O7- I/O0).
The CS pin must remain low during the loading of the opcode, the address bytes, the
don’t care bytes, and the reading of data. When the end of a page in main memory is
reached during a Continuous Array Read, the device will continue reading at the begin-
ning of the next page with no delays incurred during the page boundary crossover (the
crossover from the end of one page to the beginning of the next page). When the last bit
(or byte if using the 8-bit interface mode) in the main memory array has been read, the
device will continue reading back at the beginning of the first page of memory. As with
crossing over page boundaries, no delays will be incurred when wrapping around from
the end of the array to the beginning of the array.
A low-to-high transition on the CS pin will terminate the read operation and tri-state the
output pins (SO or I/O7-I/O0). The maximum SCK/CLK frequency allowable for the Con-
tinuous Array Read is defined by the f
CAR
specification. The Continuous Array Read
bypasses both data buffers and leaves the contents of the buffers unchanged.
MAIN MEMORY PAGE READ:
A main memory page read allows the user to read data
directly from any one of the 16384 pages in the main memory, bypassing both of the
data buffers and leaving the contents of the buffers unchanged. To start a page read, an
opcode of D2H must be clocked into the device followed by four address bytes (which
comprise 7 don’t care bits plus the 25-bit page and byte address sequence) and a series
of don’t care clock cycles (24 if using the serial interface or 19 if using the 8-bit inter-
face). The first 14 bits (PA13 - PA0) of the 25-bit address sequence specify the page in
main memory to be read, and the last 11 bits (BA10 - BA0) of the 25-bit address
sequence specify the starting byte address within that page. The 24 or 19 don’t care
clock cycles that follow the four address bytes are sent to initialize the read operation.
Following the don’t care bytes, additional pulses on SCK/CLK result in data being output
on either the SO (serial output) pin or the eight output pins (I/O7 - I/O0). The CS pin
must remain low during the loading of the opcode, the address bytes, the don’t care
bytes, and the reading of data. When the end of a page in main memory is reached, the
device will continue reading back at the beginning of the same page. A low-to-high tran-
sition on the CS pin will terminate the read operation and tri-state the output pins (SO or
I/O7 - I/O0). The maximum SCK/CLK frequency allowable for the Main Memory Page
Read is defined by the f
SCK
specification. The Main Memory Page Read bypasses both
data buffers and leaves the contents of the buffers unchanged.
BUFFER READ:
Data can be read from either one of the two buffers, using different
opcodes to specify which buffer to read from. With the serial interface, an opcode of
D4H is used to read data from buffer 1, and an opcode of D6H is used to read data from
buffer 2. Likewise with the 8-bit interface an opcode of 54H is used to read data from
buffer 1 and an opcode of 56H is used to read data from buffer 2. To perform a buffer
read, the opcode must be clocked into the device followed by four address bytes com-
prised of 21 don’t care bits and 11 buffer address bits (BFA10 - BFA0). Following the
four address bytes, additional don’t care bytes (one byte if using the serial interface or
two bytes if using the 8-bit interface) must be clocked in to initialize the read operation.
Since the buffer size is 1056 bytes, 11 buffer address bits are required to specify the first
byte of data to be read from the buffer. The CS pin must remain low during the loading
of the opcode, the address bytes, the don’t care bytes, and the reading of data. When
the end of a buffer is reached, the device will continue reading back at the beginning of
the buffer. A low-to-high transition on the CS pin will terminate the read operation and
tri-state the output pins (SO or I/O7 - I/O0).
4
AT45CS1282 [Preliminary]
3447A–DFLSH–2/04
AT45CS1282 [Preliminary]
Program and Erase Commands
BUFFER WRITE:
Data can be clocked in from the input pins (SI or I/O7 - I/O0) into
either buffer 1 or buffer 2. To load data into either buffer, a 1-byte opcode, 84H for buffer
1 or 87H for buffer 2, must be clocked into the device, followed by four address bytes
comprised of 21 don’t care bits and 11 buffer address bits (BFA10 - BFA0). The 11
buffer address bits specify the first byte in the buffer to be written. After the last address
byte has been clocked into the device, data can then be clocked in on subsequent clock
cycles. If the end of the data buffer is reached, the device will wrap around back to the
beginning of the buffer. Data will continue to be loaded into the buffer until a low-to-high
transition is detected on the CS pin.
BUFFER TO MAIN MEMORY PAGE PROGRAM:
A previously-erased page within main
memory can be programmed with the contents of either buffer 1 or buffer 2. The pro-
gramming time is selectable by the system through the use of different opcodes
between a normal mode and a fast mode (the fast program option will consume more
current). A 1-byte opcode, 88H for buffer 1 or 89H for buffer 2 (98H for buffer 1 fast pro-
gram or 99H for buffer 2 fast program), must be clocked into the device followed by four
address bytes consisting of 7 don’t care bits, 14-page address bits (PA13 - PA0) that
specify the page in the main memory to be written and 11 don’t care bits. When a low-to-
high transition occurs on the CS pin, the part will program the data stored in the buffer
into the specified page in the main memory. It is necessary that the page in main mem-
ory that is being programmed has been previously erased using the sector erase
commands. The programming of the page is internally self-timed and should take place
in a maximum time of t
P
for normal programming or t
FP
for fast programming. During this
time, the status register and the RDY/BUSY pin will indicate that the part is busy.
SECTOR ERASE:
The Sector Erase command can be used to individually erase any
sector in the main memory. There are 65 sectors and only one sector can be erased at
one time. Sector 0a requires a different opcode than sectors 0b-63. To perform a sector
0a erase, an opcode of 50h must be loaded into the device, followed by four address
bytes comprised of 7 don’t care bits, 11-page address bits (PA13 - PA3) and 14 don’t
care bits. To perform a sector 0b-63 erase, an opcode of 7Ch must be loaded into the
device, followed by four address bytes comprised of 7 don’t care bits, 6-page address
bits (PA13 - PA8) and 19 don’t care bits. The 6-page address bits are used to specify
which sector is to be erased. Refer to Sector Erase addressing table. When a low-to-
high transition occurs on the CS pin, the part will erase the selected sector. The erase
operation is internally self-timed and should take place in a maximum time of t
SE
. During
this time, the status register and the RDY/BUSY pin will indicate that the part is busy.
5
3447A–DFLSH–2/04
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参数对比
与AT45CS1282-CL相近的元器件有:AT45CS1282-TL。描述及对比如下:
型号 AT45CS1282-CL AT45CS1282-TL
描述 Flash, 128MX1, PBGA44 Flash, 128MX1, PDSO40
是否Rohs认证 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技)
包装说明 8 X 12 MM, 1.20 MM HEIGHT, PLASTIC, CBGA-44 10 X 20 MM, PLASTIC, MO-142CD, TSOP1-40
Reach Compliance Code compliant compliant
ECCN代码 3A991.B.1.A 3A991.B.1.A
其他特性 138412032 BITS OF MEMORY ORGANIZED AS 16384 PAGES OF 1056 BYTES EACH 138412032 BITS OF MEMORY ORGANIZED AS 16384 PAGES OF 1056 BYTES EACH
JESD-30 代码 R-PBGA-B44 R-PDSO-G40
JESD-609代码 e1 e3
长度 12 mm 18.4 mm
内存密度 134217728 bit 134217728 bit
内存集成电路类型 FLASH FLASH
内存宽度 1 1
湿度敏感等级 3 3
功能数量 1 1
端子数量 44 40
字数 134217728 words 134217728 words
字数代码 128000000 128000000
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 128MX1 128MX1
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TBGA TSOP1
封装形状 RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL/SERIAL PARALLEL/SERIAL
峰值回流温度(摄氏度) 260 260
编程电压 2.7 V 2.7 V
认证状态 Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn)
端子形式 BALL GULL WING
端子节距 1 mm 0.5 mm
端子位置 BOTTOM DUAL
处于峰值回流温度下的最长时间 40 40
类型 NOR TYPE NOR TYPE
宽度 8 mm 10 mm
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