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AT49LV8011T-90CI

8-megabit (512K x 16/1M x 8) 3-volt Only Flash Memory

器件类别:存储    存储   

厂商名称:Atmel (Microchip)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Atmel (Microchip)
零件包装代码
BGA
包装说明
TFBGA, BGA48,6X8,32
针数
48
Reach Compliance Code
unknow
ECCN代码
EAR99
最长访问时间
90 ns
备用内存宽度
8
启动块
BOTTOM
命令用户界面
YES
数据轮询
YES
JESD-30 代码
S-PBGA-B48
JESD-609代码
e0
长度
7 mm
内存密度
8388608 bi
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
部门数/规模
2,4,2,14
端子数量
48
字数
524288 words
字数代码
512000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
512KX16
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装等效代码
BGA48,6X8,32
封装形状
SQUARE
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行
PARALLEL
电源
3/3.3 V
编程电压
3 V
认证状态
Not Qualified
就绪/忙碌
YES
座面最大高度
1.2 mm
部门规模
16K,8K,32K,64K
最大待机电流
0.00001 A
最大压摆率
0.05 mA
最大供电电压 (Vsup)
3.3 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
切换位
YES
类型
NOR TYPE
宽度
7 mm
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Features
Single Supply for Read and Write: 2.7V to 3.3V (BV), 3.0V to 3.3V (LV)
Access Time – 90 ns
Sector Erase Architecture
Fourteen 32K Word (64K Byte) Sectors with Individual Write Lockout
Two 16K Word (32K Byte) Sectors with Individual Write Lockout
Two 8K Word (16K Byte) Sectors with Individual Write Lockout
Four 4K Word (8K Byte) Sectors with Individual Write Lockout
Fast Word Program Time – 20 µs
Fast Sector Erase Time – 200 ms
Dual Plane Organization, Permitting Concurrent Read while Program/Erase
Memory Plane A: Four 4K Word, Two 8K Word and Two 16K Word Sectors
Memory Plane B: Fourteen 32K Word Sectors
Erase Suspend Capability
– Supports Reading/Programming Data from Any Sector by Suspending Erase of
Any Different Sector
Low-power Operation
– 25 mA Active
– 10 µA Standby
Data Polling, Toggle Bit, Ready/Busy for End of Program Detection
Optional VPP Pin for Fast Programming
RESET Input for Device Initialization
Sector Program Unlock Command
TSOP and CBGA Package Options
Top or Bottom Boot Block Configuration Available
8-megabit
(512K x 16/1M x 8)
3-volt Only
Flash Memory
AT49BV8011
AT49BV8011T
AT49LV8011
AT49LV8011T
Description
The AT49BV/LV8011(T) is a 2.7- to 3.3-volt 8-megabit Flash memory organized as
524,288 words of 16 bits each or 1,048,576 bytes of 8 bits each. The x16 data
appears on I/O0 - I/O15; the x8 data appears on I/O0 - I/O7. The memory is divided
into 22 sectors for erase operations. The device is offered in 48-pin TSOP and 48-ball
CBGA packages. The device has CE, and OE control signals to avoid any bus
Pin Configurations
Pin Name
A0 - A18
CE
OE
WE
RESET
RDY/BUSY
VPP
I/O0 - I/O14
I/O15 (A-1)
BYTE
NC
VCCQ
(continued)
Function
Addresses
Chip Enable
Output Enable
Write Enable
Reset
READY/BUSY Output
Optional Power Supply for Faster
Program/Erase Operations
Data Inputs/Outputs
I/O15 (Data Input/Output, Word Mode)
A-1 (LSB Address Input, Byte Mode)
Selects Byte or Word Mode
No Connect
Output Power Supply
Rev. 1265E–01/00
1
TSOP Top View
Type 1
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE
RESET
VPP
NC
RDY/BUSY
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE
GND
I/O15/A-1
I/O7
I/O14
I/O6
I/O13
I/O5
I/O12
I/O4
VCC
I/O11
I/O3
I/O10
I/O2
I/O9
I/O1
I/O8
I/O0
OE
GND
CE
A0
CBGA Top View
1
A
A3
A7 RDY/BUSY WE
A17
A6
A5
I/O0
I/O8
I/O9
I/O1
NC
A18
NC
I/O2
I/O10
I/O11
I/O3
RESET
VPP
NC
I/O5
I/O12
VCC
I/O4
A9
A8
A10
A11
I/O7
I/O14
I/O13
I/O6
A13
A12
A14
A15
A16
BYTE
I/O15
/A-1
VSS
2
3
4
5
6
B
A4
C
A2
D
A1
E
A0
F
CE
G
OE
H
VSS
contention. This device can be read or reprogrammed
using a single 2.7V power supply, making it ideally suited
for in-system programming.
The device powers on in the read mode. Command
sequences are used to place the device in other operation
modes such as Program and Erase. The device has the
capability to protect the data in any sector. Once the data
protection for a given sector is enabled, the data in that
sector cannot be changed using input levels between
ground and V
CC
.
The device is segmented into two memory planes. Reads
from memory plane B may be performed even while pro-
gram or erase functions are being executed in memory
plane A and vice versa. This operation allows improved
system performance by not requiring the system to wait for
a program or erase operation to complete before a read is
performed. To further increase the flexibility of the device, it
contains an Erase Suspend feature. This feature will put
the Erase on hold for any amount of time and let the user
read data from or program data to any of the remaining
sectors within the same memory plane. There is no reason
to suspend the erase operation if the data to be read is in
the other memory plane. The end of a program or an Erase
cycle is detected by the Ready/Busy pin, Data polling, or by
the toggle bit.
A VPP pin is provided to improve program/erase times.
This pin can be tied to V
CC
. To take advantage of faster
programming and erasing, the pin should supply 4.5 to
5.5 volts during program and erase operations.
A 6-byte command (bypass unlock) sequence to remove
the requirement of entering the 3-byte program sequence
is offered to further improve programming time. After enter-
ing the 6-byte code, only single pulses on the write control
lines are required for writing into the device. This mode
(single-pulse byte/word program) is exited by powering
down the device, or by pulsing the RESET pin low for a
minimum of 50 ns and then bringing it back to V
CC
. Erase
and Erase Suspend/Resume commands will not work while
in this mode; if entered they will result in data being pro-
grammed into the device. It is not recommended that the
6-byte code reside in the software of the final product but
only exist in external programming code.
The BYTE pin controls whether the device data I/O pins
operate in the byte or word configuration. If the BYTE pin is
set at logic “1”, the device is in word configuration,
I/O0 - I/O15 are active and controlled by CE and OE.
If the BYTE pin is set at logic “0”, the device is in byte con-
figuration, and only data I/O pins I/O0 - I/O7 are active and
controlled by CE and OE. The data I/O pins I/O8 - I/O14
are tri-stated, and the I/O15 pin is used as an input for the
LSB (A-1) address function.
2
AT49BV/LV8011(T)
AT49BV/LV8011(T)
Block Diagram
I/O0 - I/O15/A-1
OUTPUT
BUFFER
INPUT
BUFFER
OUTPUT
MULTIPLEXER
A0 - A18
INPUT
BUFFER
DATA
REGISTER
IDENTIFIER
REGISTER
STATUS
REGISTER
COMMAND
REGISTER
ADDRESS
LATCH
DATA
COMPARATOR
CE
WE
OE
RESET
BYTE
RDY/BUSY
WRITE STATE
MACHINE
Y-DECODER
Y-GATING
PROGRAM/ERASE
VOLTAGE SWITCH
VPP
VCC
GND
X-DECODER
PLANE B
SECTORS
PLANE A SECTORS
Device Operation
READ:
The AT49BV/LV8011(T) is accessed like an
EPROM. When CE and OE are low and WE is high, the
data stored at the memory location determined by the
address pins are asserted on the outputs. The outputs are
put in the high impedance state whenever CE or OE is
high. This dual line control gives designers flexibility in pre-
venting bus contention.
COMMAND SEQUENCES:
When the device is first pow-
ered on it will be reset to the read or standby mode,
depending upon the state of the control line inputs. In order
to perform other device functions, a series of command
sequences are entered into the device. The command
sequences are shown in the Command Definitions table
(I/O8 - I/O15 are don’t care inputs for the command codes).
The command sequences are written by applying a low
pulse on the WE or CE input with CE or WE low (respec-
tively) and OE high. The address is latched on the falling
edge of CE or WE, whichever occurs last. The data is
latched by the first rising edge of CE or WE. Standard
microprocessor write timings are used. The address
locations used in the command sequences are not affected
by entering the command sequences.
RESET:
A RESET input pin is provided to ease some sys-
tem applications. When RESET is at a logic high level, the
device is in its standard operating mode. A low level on the
RESET input halts the present device operation and puts
the outputs of the device in a high impedance state. When
a high level is reasserted on the RESET pin, the device
returns to the read or standby mode, depending upon the
state of the control inputs. By applying a 12V
±
0.5V input
signal to the RESET pin, any sector can be reprogrammed
even if the sector lockout feature has been enabled (see
“Sector Programming Lockout Override” section).
ERASURE:
Before a byte/word can be reprogrammed, it
must be erased. The erased state of memory bits is a logi-
cal “1”. The entire device can be erased by using the Chip
Erase command or individual sectors can be erased by
using the Sector Erase commands.
3
CHIP ERASE:
The entire device can be erased at one time
by using the 6-byte chip erase software code. After the chip
erase has been initiated, the device will internally time the
erase operation so that no external clocks are required.
The maximum time to erase the chip is t
EC
.
If the sector lockout has been enabled, the Chip Erase will
not erase the data in the sector that has been locked; it will
erase only the unprotected sectors. After the chip erase,
the device will return to the read or standby mode.
SECTOR ERASE:
As an alternative to a full chip erase, the
device is organized into 22 sectors that can be individually
erased. The Sector Erase command is a six bus cycle
operation. The sector address is latched on the falling WE
edge of the sixth cycle while the 30H Data Input command
is latched on the rising edge of WE. The sector erase starts
after the rising edge of WE of the sixth cycle. The erase
operation is internally controlled; it will automatically time to
completion. The maximum time to erase a section is t
SEC
.
When the sector programming lockout feature is not
enabled, the sector will erase (from the same Sector Erase
command). Once a sector has been protected, data in the
protected sectors cannot be changed unless the RESET
pin is taken to 12V ± 0.5V. An attempt to erase a sector
that has been protected will result in the operation terminat-
ing in 2 µs.
BYTE/WORD PROGRAMMING:
Once a memory block is
erased, it is programmed (to a logical “0”) on a byte-by-byte
or on a word-by-word basis. Programming is accomplished
via the internal device command register and is a four bus
cycle operation. The device will automatically generate the
required internal program pulses.
Any commands written to the chip during the embedded
programming cycle will be ignored. If a hardware reset hap-
pens during programming, the data at the location being
programmed will be corrupted. Please note that a data “0”
cannot be programmed back to a “1”; only erase operations
can convert “0”s to “1”s. Programming is completed after
the specified t
BP
cycle time. The DATA polling feature or
the toggle bit feature may be used to indicate the end of a
program cycle.
SECTOR PROGRAMMING LOCKOUT:
Each sector has a
programming lockout feature. This feature prevents pro-
gramming of data in the designated sectors once the
feature has been enabled. These sectors can contain
secure code that is used to bring up the system. Enabling
the lockout feature will allow the boot code to stay in the
device while data in the rest of the device is updated. This
feature does not have to be activated; any sector’s usage
as a write-protected region is optional to the user.
Once the feature is enabled, the data in the protected sec-
tors can no longer be erased or programmed when input
levels of 5.5V or less are used. Data in the remaining
sectors can still be changed through the regular program-
ming method. To activate the lockout feature, a series of
six program commands to specific addresses with specific
data must be performed. Please refer to the Command
Definitions table.
SECTOR LOCKOUT DETECTION:
A software method is
available to determine if programming of a sector is locked
out. When the device is in the software product identifica-
tion mode (see “Software Product Identification Entry/Exit”
sections), a read from address location 00002H within a
sector will show if programming the sector is locked out. If
the data on I/O0 is low, the sector can be programmed; if
the data on I/O0 is high, the program lockout feature has
been enabled and the sector cannot be programmed. The
software product identification exit code should be used to
return to standard operation.
SECTOR PROGRAMMING LOCKOUT OVERRIDE:
The
user can override the sector programming lockout by taking
the RESET pin to 12V ± 0.5V. By doing this, protected data
can be altered through a chip erase, sector erase or
byte/word programming. When the RESET pin is brought
back to TTL levels, the sector programming lockout feature
is again active.
ERASE SUSPEND/ERASE RESUME:
The Erase Sus-
pend command allows the system to interrupt a sector
erase operation and then program or read data from a dif-
ferent sector within the same plane. Since this device has a
dual plane architecture, there is no need to use the erase
suspend feature while erasing a sector when you want to
read data from a sector in the other plane. After the Erase
Suspend command is given, the device requires a maxi-
mum time of 15 µs to suspend the erase operation. After
the erase operation has been suspended, the plane that
contains the suspended sector enters the erase-suspend-
read mode. The system can then read data or program
data to any other sector within the device. An address is
not required during the Erase Suspend command. During a
sector erase suspend, another sector cannot be erased. To
resume the sector erase operation, the system must write
the Erase Resume command. The Erase Resume com-
mand is a one bus cycle command that does require the
plane address, which is determined by A18 - A16. The
device also supports an erase suspend during a complete
chip erase. While the chip erase is suspended, the user
can read from any sector within the memory that is pro-
tected. The command sequence for a chip erase suspend
and a sector erase suspend are the same.
PRODUCT IDENTIFICATION:
The product identification
mode identifies the device and manufacturer as Atmel. It
may be accessed by hardware or software operation. The
hardware operation mode can be used by an external pro-
grammer to identify the correct programming algorithm for
the Atmel product.
4
AT49BV/LV8011(T)
AT49BV/LV8011(T)
For details, see “Operating Modes” (for hardware opera-
tion) or “Software Product Identification”. The manufacturer
and device code is the same for both modes.
DATA POLLING:
The AT49BV/LV8011(T) features DATA
polling to indicate the end of a program cycle. During a pro-
gram cycle an attempted read of the last byte/word loaded
will result in the complement of the loaded data on I/O7.
Once the program cycle has been completed, true data is
valid on all outputs and the next cycle may begin. During a
chip or sector erase operation, an attempt to read the
device will give a “0” on I/O7. Once the program or erase
cycle has completed, true data will be read from the device.
DATA polling may begin at any time during the program
cycle. Please see “Status Bit Table” for more details.
TOGGLE BIT:
In addition to DATA polling, the
AT49BV/LV8011(T) provides another method for determin-
ing the end of a program or erase cycle. During a program
or erase operation, successive attempts to read data from
the same memory plane will result in I/O6 toggling between
“1” and “0”. Once the program cycle has completed, I/O6
will stop toggling and valid data will be read. Examining the
toggle bit may begin at any time during a program cycle.
An additional toggle bit is available on I/O2, which can be
used in conjunction with the toggle bit that is available on
I/O6. While a sector is erase suspended, a read or a
program operation from the suspended sector will result in
the I/O2 bit toggling. Please see “Status Bit Table” for more
details.
RDY/BUSY:
An open drain READY/BUSY output pin pro-
vides another method of detecting the end of a program or
erase operation. RDY/BUSY is actively pulled low during
the internal program and erase cycles and is released at
the completion of the cycle. The open drain connection
allows for OR-tying of several devices to the same
RDY/BUSY line.
HARDWARE DATA PROTECTION:
Hardware features
protect against inadvertent programs to the
AT49BV/LV8011(T) in the following ways: (a) V
CC
sense: if
V
CC
is below 1.8V (typical), the program function is inhib-
ited. (b) V
CC
power on delay: once V
CC
has reached the
V
CC
sense level, the device will automatically time out
10 ms (typical) before programming. (c) Program inhibit:
holding any one of OE low, CE high or WE high inhibits
program cycles. (d) Noise filter: pulses of less than 15 ns
(typical) on the WE or CE inputs will not initiate a program
cycle.
INPUT LEVELS:
While operating with a 2.7V to 3.3V
power supply, the address inputs and control inputs (OE,
CE, and WE) may be driven from 0 to 5.5V without
adversely affecting the operation of the device. The I/O
lines can only be driven from 0 to V
CC
+ 0.6V.
5
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