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ATMXT1066T2-C2U021

Analog Circuit, 1 Func, PBGA114

器件类别:模拟混合信号IC    信号电路   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

下载文档
器件参数
参数名称
属性值
厂商名称
Microchip(微芯科技)
包装说明
UFBGA-114
Reach Compliance Code
compliant
模拟集成电路 - 其他类型
ANALOG CIRCUIT
JESD-30 代码
R-PBGA-B114
长度
7 mm
功能数量
1
端子数量
114
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
筛选级别
TS 16949
座面最大高度
0.65 mm
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
宽度
5 mm
文档预览
mXT1066T2 1.4
maXTouch 1066-node Touchscreen Controller
Product Brief
Description
The mXT1066T2 1.4 uses a unique charge-transfer acquisition engine to implement Microchip’s patented capacitive sensing
method. Coupled with a state-of-the-art CPU, the entire touchscreen sensing solution can measure, classify and track a number
of individual finger touches with a high degree of accuracy in the shortest response time. The mXT1066T2 1.4 allows for both
mutual and self capacitance measurements, with the self capacitance measurements being used to augment the mutual
capacitance measurements to produce reliable touch information.
maXTouch
®
Adaptive Sensing Touchscreen
Technology
• Up to 41 X (transmit) lines and 26 Y (receive) lines for
use by touchscreen and keys.
• A maximum of 1066 nodes can be allocated to the
touchscreen
• Touchscreen size of 12.4 inches (16:10 aspect ratio),
assuming a sensor electrode pitch of 6.5 mm. Other
sizes are possible with different electrode pitches and
appropriate sensor material
• Multiple touch support with up to 16 concurrent
touches tracked in real time
Touch Performance
• Moisture/Water Compensation
- No false touch with condensation or water drop up
to 22 mm diameter
- One-finger tracking with condensation or water
drop up to 22 mm diameter
• Glove Support
- Multiple-finger glove touches up to 1.5 mm
thickness (subject to stack-up design)
- Single-finger glove touch up to 5 mm thickness
(subject to stack-up design)
• Mutual capacitance and self capacitance
measurements supported for robust touch detection
• Noise suppression technology to combat ambient,
charger, and power-line noise
- Up to 240 V
PP
between 1 Hz and 1 kHz sinusoidal
waveform
- Up to 20 V
PP
between 1 kHz and 1 MHz
sinusoidal waveform
• Stylus Support
- Supports passive stylus with 1.5 mm contact
diameter, subject to configuration, stack-up, and
sensor design
• Scan Speed
- Up to 250 Hz reporting rate for one finger (subject
to configuration)
- Typical report rate for 16 touches
100
Hz
(subject to configuration)
- Initial touch latency <10 ms for first touch from idle
(subject to configuration)
- Configurable to allow for power and speed
optimization
Keys
• Up to 32 nodes can be allocated as mutual
capacitance sensor keys (subject to other
configurations)
• Adjacent Key Suppression (AKS) technology is
supported for false key touch prevention
Touch Sensor Technology
• Discrete/out-cell support including glass and PET film-
based sensors
• Support for standard (for example, Diamond) and
proprietary sensor patterns (review of designs by
Microchip or a Microchip-qualified touch sensor
module partner is recommended)
Front Panel Material
• Works with PET or glass, including curved profiles
(configuration and stack-up to be approved by
Microchip or a Microchip-qualified touch sensor
module partner)
• Glass 0.4 mm to 4.5 mm (dependent on screen size,
touch size, configuration and stack-up)
• Plastic 0.2 mm to 2.2 mm (dependent on screen size,
touch size, configuration and stack-up)
On-chip Gestures
• Supports wake up/unlock gestures, including symbol
recognition
2018 Microchip Technology Inc.
Product Brief
DS40002056A-page 1
MXT1066T2 1.4
Enhanced Algorithms
• Lens bending algorithms to remove display noise
• Touch suppression algorithms to remove unintentional large touches, such as palm
• Palm Recovery Algorithm for quick restoration to normal state
Product Data Store Area
• Up to 60 bytes of user-defined data can be stored during production
Power Saving
• Programmable timeout for automatic transition from active to idle states
• Pipelined analog sensing detection and digital processing to optimize system power efficiency
Application Interfaces
• I
2
C slave with support for Standard mode (up to 100 kHz), Fast mode (up to 400 kHz),
Fast-mode Plus (up to 1 MHz), High Speed mode (up to 3.4 MHz)
• Interrupt to indicate when a message is available
• SPI Debug Interface to read the raw data for tuning and debugging purposes
Power Supply
Digital (Vdd) 3.3 V nominal
Digital I/O (VddIO) 3.3 V nominal
Analog (AVdd) 3.3 V nominal
High voltage internal X line drive (XVdd) 6.6 V with internal voltage pump
High voltage internal X line drive (XVdd) 9.9 V with internal voltage pump
Packages
• 114-ball UFBGA 7 × 5 × 0.65 mm, 0.5 mm pitch, High Density Interconnect
• 117-ball UFBGA 9.5 × 7 × 0.65 mm, 0.65 mm pitch, non-HDI package
Operating Temperature
• –40C to +85C
DS40002056A-page 2
Product Brief
2018 Microchip Technology Inc.
MXT1066T2 1.4
PIN CONFIGURATION
114-ball UFBGA
1
2
3
4
5
6
7
8
9
10
11
12
13
A
X21
X22
XVDD
Y23
Y19
Y15
Y11
Y7
Y3
Y0
AVDD
X1
X0
B
X23
X24
GND
Y24
Y20
Y16
Y12
Y8
Y4
Y1
GND
X3
X2
C
X25
X26
GND
Y25
Y21
Y17
Y13
Y9
Y5
Y2
XVDD
X5
X4
D
X27
X28
X29
AVDD
Y22
Y18
Y14
Y10
Y6
GND
X8
X7
X6
E
X30
X31
X32
AVDD
GND
GND
VDDIO
X11
X10
X9
F
X33
X34
X35
VDDIO
NC
NOISE_IN
GPIO1
GPIO5
DBG_SS
TEST
PTCXY4
X14
X13
X12
G
X36
X37
XVDD
RESET
ADDSEL
I2CMODE
GPIO0
GPIO4
DBG_DAT
A
PTCXY3
XVDD
X16
X15
H
X38
X39
EXTCAP0
EXTCAP2
SDA
RESV
CHG
GPIO3
DBG_CLK
PTCXY2
PTCXY6
X18
X17
J
X40
DS0
EXTCAP1
EXTCAP3
SCL
VDDCORE
VDD
GPIO2
PTCXY0
PTCXY1
PTCXY5
X20
X19
Top View
2018 Microchip Technology Inc.
Product Brief
DS40002056A-page 3
MXT1066T2 1.4
117-ball UFBGA
1
2
3
4
5
6
7
8
9
10
11
12
13
A
X21
X22
XVDD
Y23
Y19
Y15
Y11
Y7
Y3
Y0
AVDD
X1
X0
B
X23
X24
GND
Y24
Y20
Y16
Y12
Y8
Y4
Y1
GND
X3
X2
C
X25
X26
GND
Y25
Y21
Y17
Y13
Y9
Y5
Y2
XVDD
X5
X4
D
X27
X28
X29
AVDD
Y22
Y18
Y14
Y10
Y6
GND
X8
X7
X6
E
X30
X31
X32
AVDD
GND
VDDCORE
VDD
GND
VDDIO
XVDD
X11
X10
X9
F
X33
X34
X35
VDDIO
NC
CHG
GPIO3
DBG_DAT
A
DBG_SS
TEST
PTCXY6
X14
X13
X12
G
X36
X37
XVDD
RESET
ADDSEL
NOISE_IN
GPIO2
DBG_CLK
PTCXY2
PTCXY5
RESV
X16
X15
H
X38
X39
EXTCAP0
EXTCAP2
SDA
I2CMODE
GPIO1
GPIO5
PTCXY1
PTCXY4
RESV
X18
X17
J
X40
DS0
EXTCAP1
EXTCAP3
SCL
RESV
GPIO0
GPIO4
PTCXY0
PTCXY3
RESV
X20
X19
Top View
DS40002056A-page 4
Product Brief
2018 Microchip Technology Inc.
MXT1066T2 1.4
1.0
1.1
NOTE
PACKAGING INFORMATION
114-ball UFBGA 7 × 5 × 0.65 mm
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2018 Microchip Technology Inc.
Product Brief
DS40002056A-page 5
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