BGA Heat Sink - High Performance
ASIC Cooling
ATS Part#:
Description:
ATS-56007-C1-R0
45.00 x 45.00 x 15.00 mm BGA Heat Sink - High Performance ASIC Cooling
Heat Sink Type:
Heat Sink Attachment:
Equivalent Part Number:
ASIC Cooling
Thermal Tape
ATS-56007-C3-R0
*Image above is for illustration purpose only.
Features & Benefits
maxiFLOW™
design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
Designed specifically for ASIC package and their unique cooling requirements
Comes preassembled with high performance thermal interface material
Thermal Performance
AIR VELOCITY
@200 LFM
1.0 M/S
Unducted Flow
THERMAL RESISTANCE
Ducted Flow
1.7
N/A
N/A
N/A
N/A
N/A
N/A
2.4 °C/W
@300 LFM
1.5 M/S
2 °C/W
@400 LFM
2.0 M/S
1.7 °C/W
@500 LFM
2.5 M/S
1.5 °C/W
@600 LFM
3.0 M/S
1.3 °C/W
@700 LFM
3.5 M/S
1.2 °C/W
@800 LFM
4.0 M/S
1.1 °C/W
Product Detail
Schematic Image
Dimension A
45.00 mm
Dimension B
45.00 mm
Dimension C
15.00 mm
Dimension D
64 mm
TIM
T412
Finish
BLACK-ANODIZED
Notes:
Dimension
A
and
B
refer to component size.
Dimension
C
is the heat sink height from the bottom of the base to the top of the fin field.
ATS-56007-C3-R0 is the exact heat sink assembly with an equivalent thermal interface material
(Saint-Gobain C675).
Thermal performance data are provided for reference only. Actual performance may vary by
application.
ATS reserves the right to update or change its products without notice to improve the design or
performance.
ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.
Contact ATS to learn about custom options available.
*Image above is for illustration purpose only.
For more information, to find a distributor or to place an order, please contact us at
781-769-2800 (North America),
sales@qats.com
or
www.qats.com.
© 2013 Advanced Thermal Solutions, Inc.
| 89-27 Access Road | Norwood MA | 02062 | USA
Rev - 040517
FPGA/CPLD
