SAM C20/C21 Family Data
Sheet
32-bit ARM Cortex-M0+ with 5V Support, CAN-FD, PTC,
and Advanced Analog
Features
Operating Conditions
• 2.7V – 5.5V, -40°C to +125°C, DC to 48 MHz
Core
• ARM
®
Cortex
®
-M0+ CPU running at up to 48 MHz
– Single-cycle hardware multiplier
– Micro Trace Buffer
– Memory Protection Unit (MPU)
Memories
• 32/64/128/256 KB in-system self-programmable Flash
• 1/2/4/8 KB independent self-programmable Flash for EEPROM emulation
• 4/8/16/32 KB SRAM Main Memory
System
• Power-on Reset (POR) and Brown-out Detection (BOD)
• Internal and external clock options with 48 MHz to 96 MHz Fractional Digital Phase Locked Loop
(FDPLL96M)
• External Interrupt Controller (EIC) (Interrupt pin debouncing is only available in SAM C21N)
• 16 external interrupts
– Hardware debouncing (only on the 100Pin TQFP)
• One non-maskable interrupt
• Two-pin Serial Wire Debug (SWD) programming, test, and debugging interface
Low-Power
• Idle and Standby Sleep modes
• SleepWalking peripherals
Peripherals
• Hardware Divide and Square Root Accelerator (DIVAS)
• 12-channel Direct Memory Access Controller (DMAC)
• 12-channel Event System
• Up to eight 16-bit Timer/Counters (TC), configurable as either (see
Note):
Note:
Maximum and minimum capture is only available in SAM C21N devices.
– One 16-bit TC with compare/capture channels
– One 8-bit TC with compare/capture channels
©
2019 Microchip Technology Inc.
Datasheet
DS60001479C-page 1
SAM C20/C21 Family Data Sheet
– One 32-bit TC with compare/capture channels, by using two TCs
• Two 24-bit Timer/Counters and one 16-bit Timer/Counter for Control (TCC), with extended functions:
– Up to four compare channels with optional complementary output
– Generation of synchronized pulse width modulation (PWM) pattern across port pins
– Deterministic fault protection, fast decay and configurable dead-time between complementary
output
– Dithering that increase resolution with up to 5 bit and reduce quantization error
• Frequency Meter (The division reference clock is only available in the SAM C21N)
• 32-bit Real Time Counter (RTC) with clock/calendar function
• Watchdog Timer (WDT)
• CRC-32 generator
• Up to two Controller Area Network (CAN) interfaces:
– CAN 2.0A/B and CAN-FD (ISO 11898-1:2015)
• Each CAN interface have two selectable pin locations to switch between two external CAN
transceivers (without the need for an external switch)
• Up to eight Serial Communication Interfaces (SERCOM), each configurable to operate as either:
– USART with full-duplex and single-wire half-duplex configuration
– I
2
C up to 3.4 MHz (Except SERCOM6 and SERCOM7)
– SPI
– LIN master/slave
– RS-485
– PMBus
• One Configurable Custom Logic (CCL)
• Up to Two 12-bit, 1 Msps Analog-to-Digital Converter (ADC) with up to 12 channels each (20 unique
channels)
– Differential and single-ended input
– Automatic offset and gain error compensation
– Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution
• One 16-bit Sigma-Delta Analog-to-Digital Converter (SDADC) with up to 3 differential channels
• 10-bit, 350 ksps Digital-to-Analog Converter (DAC)
• Up to four Analog Comparators (AC) with Window Compare function
• Integrated Temperature Sensor
• Peripheral Touch Controller (PTC)
– 256-Channel capacitive touch and proximity sensing
I/O
• Up to 84 programmable I/O pins
Qualification
• AEC-Q100 Grade 1 (-40°C to 125°C)
Packages
• 100-pin TQFP
• 64-pin TQFP, VQFN
• 56-pin WLCSP
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2019 Microchip Technology Inc.
Datasheet
DS60001479C-page 2
SAM C20/C21 Family Data Sheet
• 48-pin TQFP, VQFN
• 32-pin TQFP, VQFN
General
• Drop in compatible with SAM D20 and SAM D21 (see
Note)
Note:
Only applicable for 32-pin, 48-pin, and 64-pin TQFP and VQFN packages.
©
2019 Microchip Technology Inc.
Datasheet
DS60001479C-page 3
SAM C20/C21 Family Data Sheet
Table of Contents
Features.......................................................................................................................... 1
1. Configuration Summary...........................................................................................14
2. Ordering Information................................................................................................19
3. Block Diagram......................................................................................................... 20
4. Pinout...................................................................................................................... 22
4.1.
4.2.
4.3.
4.4.
SAM C21E / SAM C20E.............................................................................................................22
SAM C21G / SAM C20G............................................................................................................ 23
SAM C21J / SAM C20J.............................................................................................................. 24
SAM C21N / SAM C20N............................................................................................................ 26
5. Signal Descriptions List........................................................................................... 27
6. I/O Multiplexing and Considerations........................................................................29
6.1.
6.2.
Multiplexed Signals.................................................................................................................... 29
Other Functions..........................................................................................................................35
7. Power Supply and Start-Up Considerations............................................................ 38
7.1.
7.2.
7.3.
7.4.
Power Domain Overview............................................................................................................38
Power Supply Considerations.................................................................................................... 39
Power-Up................................................................................................................................... 41
Power-On Reset and Brown-Out Detector................................................................................. 42
8. Product Mapping..................................................................................................... 43
9. Memories.................................................................................................................47
9.1.
9.2.
9.3.
9.4.
9.5.
9.6.
Embedded Memories................................................................................................................. 47
Physical Memory Map................................................................................................................ 47
NVM User Row Mapping............................................................................................................48
NVM Software Calibration Area Mapping...................................................................................49
NVM Temperature Calibration Area Mapping, SAM C21........................................................... 50
Serial Number............................................................................................................................ 50
10. Processor and Architecture..................................................................................... 52
10.1.
10.2.
10.3.
10.4.
Cortex M0+ Processor............................................................................................................... 52
Nested Vector Interrupt Controller..............................................................................................54
Micro Trace Buffer...................................................................................................................... 57
High-Speed Bus System............................................................................................................ 58
11. PAC - Peripheral Access Controller.........................................................................61
11.1. Overview.................................................................................................................................... 61
11.2. Features..................................................................................................................................... 61
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2019 Microchip Technology Inc.
Datasheet
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SAM C20/C21 Family Data Sheet
11.3.
11.4.
11.5.
11.6.
11.7.
Block Diagram............................................................................................................................ 61
Product Dependencies............................................................................................................... 61
Functional Description................................................................................................................63
Register Summary......................................................................................................................66
Register Description................................................................................................................... 67
12. Peripherals Configuration Summary........................................................................87
12.1. SAM C20/C21 N.........................................................................................................................88
12.2. SAM C20/C21 E/G/J.................................................................................................................. 93
13. DSU - Device Service Unit...................................................................................... 97
13.1. Overview.................................................................................................................................... 97
13.2. Features..................................................................................................................................... 97
13.3. Block Diagram............................................................................................................................ 98
13.4. Signal Description...................................................................................................................... 98
13.5. Product Dependencies............................................................................................................... 98
13.6. Debug Operation........................................................................................................................ 99
13.7. Chip Erase................................................................................................................................101
13.8. Programming............................................................................................................................102
13.9. Intellectual Property Protection................................................................................................ 102
13.10. Device Identification................................................................................................................. 104
13.11. Functional Description..............................................................................................................105
13.12. Register Summary....................................................................................................................110
13.13. Register Description................................................................................................................. 112
14. DIVAS – Divide and Square Root Accelerator.......................................................135
14.1.
14.2.
14.3.
14.4.
14.5.
14.6.
14.7.
14.8.
Overview.................................................................................................................................. 135
Features................................................................................................................................... 135
Block Diagram.......................................................................................................................... 135
Signal Description.................................................................................................................... 135
Product Dependencies............................................................................................................. 135
Functional Description..............................................................................................................136
Register Summary....................................................................................................................139
Register Description................................................................................................................. 139
15. Clock System.........................................................................................................147
15.1.
15.2.
15.3.
15.4.
15.5.
15.6.
15.7.
Clock Distribution..................................................................................................................... 147
Synchronous and Asynchronous Clocks..................................................................................148
Register Synchronization......................................................................................................... 148
Enabling a Peripheral............................................................................................................... 150
On-demand, Clock Requests................................................................................................... 150
Power Consumption vs. Speed................................................................................................ 151
Clocks after Reset.................................................................................................................... 151
16. GCLK - Generic Clock Controller.......................................................................... 152
16.1. Overview.................................................................................................................................. 152
16.2. Features................................................................................................................................... 152
16.3. Block Diagram.......................................................................................................................... 152
©
2019 Microchip Technology Inc.
Datasheet
DS60001479C-page 5
