ATSAMR21B18-MZ210PA
ATSAMR21 Smart Connect Module
PRELIMINARY DATASHEET
Description
The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It
integrates an ATSAMR21E18 IC together with a serial data FLASH. The design
allows a variety of mounting positions with SMT as well as TH mounting. The
extended temperature range with operation up to 125°C is a distinguishing feature.
Features
•
ATSAMR21 Single-chip ARM® Cortex®-M0+ based 32-bit Microcontroller with
Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with
256KB Flash and 16 I/O’s
–
Max. operating freq. 48 MHz
–
128-bit AES crypto engine
–
32-bit MAC symbol counter
–
Temperature sensor
–
Automatic transmission modes
•
MX25L2006EZUK-12G 2-Mbit DataFlash
•
Lowest cost RF front end design with PCB antenna
•
FCC / ETSI compliant harmonic filter
•
Single 2.7V - 3.6V supply
•
Extended industrial temperature range -40°C to 125°C
•
Easy access 2mm pin header with several alternative functions
–
5 GPIO
–
1 analog input (12-bit, 350ksps Analog-to-Digital Converter)
–
4 PWM outputs
–
TWI (I2C up to 3.4MHz)
–
SPI
–
UART
•
High precision 16MHz crystal oscillator
Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015
Ta bl e of Conte nts
Description
Features
1
1
Table of Contents ............................................................................................................... 2
1
Integrated Devices and Block Diagram ...................................................................... 3
1.1
1.2
Module Block Diagram .......................................................................................................................... 3
Integrated system peripherals ............................................................................................................... 3
1.2.1 Serial Flash interconnect .......................................................................................................... 3
1.2.2 Available UART interfaces ........................................................................................................ 3
RF front end .......................................................................................................................................... 4
1.3
2
Mechanical Description............................................................................................... 5
2.1
2.2
Mechanical Dimensions ........................................................................................................................ 5
Footprint Recommendation ................................................................................................................... 5
2.2.1 Pin header mounting ................................................................................................................ 5
Surface solder mounting ....................................................................................................................... 7
3
Module pin assignment ............................................................................................... 8
3.1
3.2
Application pins ..................................................................................................................................... 8
Test points............................................................................................................................................. 9
3.2.1 Top layer test points ................................................................................................................. 9
3.2.2 Bottom layer test points ............................................................................................................ 9
4
Electrical Characteristics .......................................................................................... 11
4.1
4.2
4.3
4.4
Absolute Maximum Ratings................................................................................................................. 11
Recommended Operating Conditions ................................................................................................. 11
Power Consumption ............................................................................................................................ 11
Module performance data ................................................................................................................... 12
5
6
7
NV Memory Information ............................................................................................ 13
Boot loader ................................................................................................................ 13
Radio Certification..................................................................................................... 14
7.1
7.2
7.3
United States (FCC) ............................................................................................................................ 14
Europe (ETSI) ..................................................................................................................................... 14
Industry Canada (IC) Compliance statements..................................................................................... 15
8
9
Ordering Information ................................................................................................. 16
References ................................................................................................................. 17
10 Revision History ........................................................................................................ 17
2
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1.1
Integrated Devices and Block Diagram
Module Block Diagram
The module has been optimized for minimum costs in lighting applications as a primary design goal. Therefore
the list of peripheral devices is rather short with only a serial FLASH memory. Figure 1-1 shows the block
diagram for the module.
The harmonic filter is purely capacitive and the antenna is integrated on the PCB. Beside some test points, the
module interface is providing five GPIO lines only. See section 3 for detailed information.
ATSAMR21B18-MZ210PA
MX25L2006EZUK
-12G
2-Mbit DataFlash
SPI
ATSAMR21E18
ARM® Cortex®-M0+
Differential
Harmonic Filter
5 GPIO
Figure 1-1.
Module Block Diagram
1.2
Integrated system peripherals
A serial FLASH memory has been integrated to support over-the-air software upgrade functions. The memory
interface is using a SERCOM based SPI.
1.2.1
Serial Flash interconnect
DataFLASH
Signal
SO
SI
SCK
#CS
Table 1-1.
uC
Function
MISO
MOSI
SCK
GPIO
uC pin
22 / PA24
23 / PA25
27 / PA28
25 / PA27
Port & SERCOM Configuration
PA24 SERCOM3 PAD[2] DIPO=0x2
PA25 SERCOM3 PAD[3] DOPO=0x2
PA28 SERCOM3 PAD[1] DOPO=0x2
PA27 to be set low in software before SPI access
Microcontroller / data FLASH connection
The signals in this table are not available as module IO. More information about the FLASH IC can be found in its
related datasheet in section 7. (Macronix)
1.2.2
Available UART interfaces
There are two UART interfaces available for external use. SERCOM2 is available at test points for debug use
while SERCOM1 is available at connector X1 for application use.
The test points for SERCOM2 are duplicated on the PCB top layer and on the bottom layer. See Table 1-2 for
detailed information.
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Differential
Antenna
3
Module pin
TP7 & TP5
TP4 & TP6
X1.6
X1.5
uC
Function
UART RX
UART TX
UART RX
UART TX
uC pin
16 / PA15
15 / PA14
20 / PA19
19 / PA18
Port & SERCOM Configuration
SERCOM2; MUX=C; PAD[3] RXPO=0x3
SERCOM2; MUX=C; PAD[2] TXPO=0x1
SERCOM1; MUX=C; PAD[3] RXPO=0x3
SERCOM1; MUX=C; PAD[2] TXPO=0x1
Table 1-2.
Access to UART IO’s
1.3
RF front end
The module implements a lowest cost RF front end with a differential PCB antenna and a purely capacitive
harmonic filter as far as assembled parts are considered. This approach is saving the costs for inductive or
MLCC parts. The RF front end components are designated in Figure 1-2.
Figure 1-2.
RF front end sections
The integrated antenna is the cause of a number of design constraints for the base board. Please regard the
drawings and suggestions in section 2.2 when designing the base board. The same section does also contain
more information about the ground design.
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2.1
Mechanical Description
If not otherwise noted a tolerance of 0.1mm shall be considered for all dimensions.
Mechanical Dimensions
The module pins are arranged with a 2mm pitch distance. Figure 2-1 shows the actual dimensions and pin
locations within the module design.
Figure 2-1.
Module Bottom dimensions, seen from a CAD top perspective
The module can be solder mounted directly to a base board. Provision is made for direct SMT mounting and for
true hole mounting on a pin header with 2mm pitch. The module is delivered with true-hole pads. The pin header
is supposed to be part of the base board.
2.2
Footprint Recommendation
Since the antenna is integrated, a number of design constraints have to be considered for the base board design.
2.2.1
Pin header mounting
The module can be mounted on pin headers with 2mm pitch like the SAMTEC TMM series. This mounting
scheme requires a 7-pin single row header and two single pins next to the antenna. The pins are supposed to be
assembled on the base board in the normal top assembly process.
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