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ATWINC3400-MR210CA122-T

MODULE

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

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器件参数
参数名称
属性值
厂商名称
Microchip(微芯科技)
包装说明
MODULE-36
Reach Compliance Code
compliant
Factory Lead Time
20 weeks
Samacsys Description
WiFi Modules (802.11) ATWINC3400 802.11 b/g/n + BTLE4.0 Module
其他特性
SEATED HGT-CALCULATED
JESD-30 代码
R-XXMA-N36
长度
22.428 mm
端子数量
36
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
座面最大高度
2.087 mm
最大供电电压
4.2 V
最小供电电压
3 V
标称供电电压
3.6 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
NO LEAD
端子节距
1.204 mm
端子位置
UNSPECIFIED
宽度
14.732 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR CIRCUIT
文档预览
ATWINC3400-MR210CA
IEEE® 802.11 b/g/n Network Controller with Integrated
Bluetooth® Low Energy Module
Introduction
The ATWINC3400-MR210CA is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC)
network controller with Bluetooth Low Energy module. The ATWINC3400-MR210CA modules are
Bluetooth 5.0 certified. This module is optimized for low power and high performance mobile applications.
This module features small form factor with integrated Power Amplifier (PA), Low-Noise Amplifier (LNA),
®
Transmit/Receive (T/R) switch (for Wi-Fi and Bluetooth), Power Management Unit (PMU), and Chip
Antenna. The ATWINC3400-MR210CA module requires a 32.768 kHz clock for Sleep operation.
The ATWINC3400-MR210CA module utilizes highly optimized IEEE 802.11 Bluetooth coexistence
protocols, and provides Serial Peripheral Interface (SPI) to interface with the host controller.
Features
Wi-Fi features:
IEEE 802.11 b/g/n RF/PHY/MAC
IEEE 802.11 b/g/n (1x1) with Single Spatial Stream, up to 72 Mbps PHY Rate in 2.4 GHz ISM Band
Integrated Chip Antenna
Superior Sensitivity and Range via Advanced PHY Signal Processing
Advanced Equalization and Channel Estimation
Advanced Carrier and Timing Synchronization
Supports Soft-AP
Supports IEEE 802.11 WEP, WPA, and WPA2
Superior MAC Throughput through Hardware Accelerated Two-Level A-MSDU/A-MPDU Frame
Aggregation and Block Acknowledgment
On-Chip Memory Management Engine to Reduce the Host Load
Operating Temperature Range from -40°C to +85°C
®
Wi-Fi Alliance Certified for Connectivity and Optimizations
– ID:
WFA62065
Integrated On-Chip Microcontroller
SPI Host Interface
Integrated Flash Memory for Wi-Fi and Bluetooth System Software
Low Leakage On-Chip Memory for State Variables
Fast AP Re-Association (150 ms)
On-Chip Network Stack to Offload MCU
– Integrated network IP slack to minimize the host CPU requirements
©
2018 Microchip Technology Inc.
Datasheet Preliminary
DS70005350B-page 1
ATWINC3400-MR210CA
Network Features: Firmware Version 1:2:x
– TCP, UDP, DHCP, ARP, HTTP, SSL, DNS, and SNTP
Bluetooth features:
ATWINC3400-MR210CA Bluetooth Low Energy Certification (end product) QD ID
112092
Adaptive Frequency Hopping (AFH)
Superior Sensitivity and Range
©
2018 Microchip Technology Inc.
Datasheet Preliminary
DS70005350B-page 2
Table of Contents
Introduction......................................................................................................................1
Features.......................................................................................................................... 1
1. Ordering Information and Module Marking................................................................ 5
2. Block Diagram........................................................................................................... 6
3. Pinout and Package Information............................................................................... 7
3.1.
Package Description.................................................................................................................. 10
4. Electrical Characteristics..........................................................................................11
4.1.
4.2.
4.3.
4.4.
4.5.
Absolute Maximum Ratings........................................................................................................11
Recommended Operating Conditions........................................................................................ 11
DC Characteristics..................................................................................................................... 12
IEEE 802.11 b/g/n Radio Performance...................................................................................... 12
Bluetooth Radio Performance.................................................................................................... 14
5. Power Management................................................................................................ 17
5.1.
5.2.
5.3.
5.4.
Device States............................................................................................................................. 17
Controlling Device States........................................................................................................... 17
Power-Up/Down Sequence........................................................................................................ 18
Digital I/O Pin Behavior During Power-Up Sequences...............................................................19
6. Clocking...................................................................................................................21
6.1.
Low-Power Clock....................................................................................................................... 21
7. CPU and Memory Subsystem................................................................................. 22
7.1.
7.2.
7.3.
Processor................................................................................................................................... 22
Memory Subsystem....................................................................................................................22
Nonvolatile Memory....................................................................................................................22
8. WLAN Subsystem................................................................................................... 24
8.1.
8.2.
8.3.
MAC........................................................................................................................................... 24
PHY............................................................................................................................................ 25
Radio.......................................................................................................................................... 25
9. Bluetooth Low Energy............................................................................................. 27
10. External Interfaces...................................................................................................28
10.1.
10.2.
10.3.
10.4.
Interfacing with the Host Microcontroller.................................................................................... 28
SPI Interface...............................................................................................................................29
UART Interface...........................................................................................................................31
I2C Slave Interface.....................................................................................................................32
©
2018 Microchip Technology Inc.
Datasheet Preliminary
DS70005350B-page 3
ATWINC3400-MR210CA
11. Application Reference Design................................................................................. 34
11.1. Host Interface............................................................................................................................. 34
12. Module Outline Drawings........................................................................................ 36
13. Design Consideration.............................................................................................. 37
13.1.
13.2.
13.3.
13.4.
Module Placement and Routing Guidelines............................................................................... 37
Antenna Performance................................................................................................................ 38
Reflow Profile Information - TBD................................................................................................40
Module Assembly Considerations.............................................................................................. 40
14. Regulatory Approval................................................................................................ 41
14.1.
14.2.
14.3.
14.4.
United States..............................................................................................................................41
Canada.......................................................................................................................................42
Europe........................................................................................................................................44
Other Regulatory Information..................................................................................................... 45
15. Reference Documentation.......................................................................................46
16. Document Revision History..................................................................................... 47
The Microchip Web Site................................................................................................ 48
Customer Change Notification Service..........................................................................48
Customer Support......................................................................................................... 48
Microchip Devices Code Protection Feature................................................................. 48
Legal Notice...................................................................................................................49
Trademarks................................................................................................................... 49
Quality Management System Certified by DNV.............................................................50
Worldwide Sales and Service........................................................................................51
©
2018 Microchip Technology Inc.
Datasheet Preliminary
DS70005350B-page 4
ATWINC3400-MR210CA
Ordering Information and Module Marking
1.
Ordering Information and Module Marking
The following table provides the ordering details for the ATWINC3400-MR210CA module.
Table 1-1. Ordering Details
Model Number
ATWINC3400-
MR210CA
Ordering Code
Package
Description
Certified
module with
chip antenna
Regulatory
Information
FCC, IC, CE
ATWINC3400-MR210CAxxx 22.43 x
1
14.73 x 2.0
mm
Note: 
1. 'xxx' in the preceding table and following figure denotes the software version. For example, at the
time of publish the software is v1.22, so its equivalent order code is ATWINC3400-MR210CA122.
The order code changes as per the software version. For more information on ordering code, refer
to the
ATWINC3400 product page.
The following figure illustrates the ATWINC3400-MR210CA module marking information.
Figure 1-1. Marking Information
ATWINC3400
MR
2
1
0
C
A
xxx
Device name
MR: Industrial
2: OTA with shield
1: Reserved
0: Reserved
C: Chip antenna
Revision letter
Software version
©
2018 Microchip Technology Inc.
Datasheet Preliminary
DS70005350B-page 5
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