MLCC Gold Termination – AU Series
General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of Gold. This termination is
indicated by the use of a “7” or “G” in the 12th position of
the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. Please contact the factory if you require
additional information on our MLCC Gold Termination.
PART NUMBER
AU03
Size
AU01 - 0201
AU02 - 0402
AU03 - 0603
AU05 - 0805
AU06 - 1206
AU10 - 1210
AU12 - 1812
AU13 - 1825
AU14 - 2225
AU16 - 0306
AU17 - 0508
AU18 - 0612
Y
C
104
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
K
Capacitance
Tolerance
±.10 pF (<10pF)
±.25 pF (<10pF)
±.50 pF (<10pF)
±1% (≥ 10 pF)
±2% (≥ 10 pF)
±5%
±10%
±20%
A
Failure
Rate
A = Not
Applicable
7
Terminations
G* = 1.9 μ" to
7.87 μ"
7 = 100 μ"
minimum
2
Packaging
2 = 7" Reel
4 = 13" Reel
9 = Bulk
A
Special
Code
A = Std.
Product
Dielectric
Voltage
C0G (NP0) = A
6.3V = 6
X7R = C
10V = Z
X5R = D
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
B
C
D
F
G
J
K
M
=
=
=
=
=
=
=
=
Contact
Factory
For
Multiples
*
* Contact factory for availability.
30
MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
Cap
(pF)
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
AU01
Reflow/Epoxy/
Wire Bond*
All Paper
0.60 ± 0.03
(0.024 ± 0.001
0.30 ± 0.03
(0.011 ± 0.001)
0.15 ± 0.05
(0.006 ± 0.002)
16
25
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
AU02
Reflow/Epoxy/
Wire Bond*
All Paper
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
25
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
AU03
Reflow/Epoxy/
Wire Bond
All Paper
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
25
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
AU05
Reflow/Epoxy/
Wire Bond
Paper/Embossed
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
AU06
Reflow/Epoxy/
Wire Bond
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
P
M
P
M
P
M
P
M
P
M
16
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
16
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
Cap
(μF)
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
500
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
L
W
T
t
16
25
16
25
50
16
25
50
100
16
25
50
100
200
16
25
50
100
200
500
SIZE
* Contact factory
Letter
Max.
Thickness
A
0.33
(0.013)
AU01
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
AU02
G
0.90
(0.035)
J
0.94
(0.037)
AU03
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
AU05
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
AU06
Z
2.79
(0.110)
31
MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
Cap
(pF)
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
AU10
Reflow/Epoxy/
Wire Bond*
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
200
AU12
Reflow/Epoxy/
Wire Bond*
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
AU13
Reflow/Epoxy/
Wire Bond*
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
100
AU14
Reflow/Epoxy/
Wire Bond*
All Embossed
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
100
25
500
25
500
50
200
50
200
L
W
T
t
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
Cap
(μF)
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
J
J
J
J
M
M
M
Q
Q
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
25
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
50
K
K
K
K
K
K
K
K
K
M
M
M
M
K
K
K
K
K
P
P
P
P
P
X
M
M
M
M
P
Q
Q
Q
Q
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
25
50
100
200
500
100
200
500
50
100
200
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
Q
Q
50
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Y
Y
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
100
200
SIZE
* Contact factory
Letter
Max.
Thickness
A
0.33
(0.013)
C
0.56
(0.022)
AU10
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
AU12
M
1.27
(0.050)
N
1.40
(0.055)
AU13
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
AU14
32
MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t)
Terminal
Cap
(pF)
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
AU02
Reflow/Epoxy
Wire Bond*
All Paper
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
16
25
50
AU03
Reflow/Epoxy
Wire Bond*
All Paper
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16
25
50
AU05
Reflow/Epoxy
Wire Bond*
Paper/Embossed
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
50
AU06
Reflow/Epoxy
Wire Bond*
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25 50
100
6.3
10
100
200
6.3
10
100
200
6.3
10
16
200
500
Cap
(μF
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C*
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J*
J*
J*
J*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N*
P*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
Q
Q*
Q*
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q*
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Q
Q
Q
Q
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
M
M
M
M
P
P
K
K
K
K
M
M
M
M
P
P
P*
P*
P*
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
500
SIZE
* Contact factory
Letter
Max.
Thickness
A
0.33
(0.013)
AU02
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
AU03
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
AU05
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
AU06
Y
2.54
(0.100)
Z
2.79
(0.110)
= Under Development
33
MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
Cap
(pF)
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
AU10
Reflow/Epoxy/
Wire Bond*
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50
100
AU12
Reflow/Epoxy/
Wire Bond*
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
100
200
AU13
AU14
Reflow/Epoxy/ Reflow/Epoxy/
Wire Bond*
Wire Bond*
All Embossed All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
10
16
200
500
50
500
L
W
T
Cap
(μF
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
P
P
Z
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
X
X
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
M
P
Q
Q
X
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
M
M
Z
Z
M
M
M
M
M
M
P
Q
Q
t
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
Z
Z
Z
K
K
K
K
K
K
K
K
K
M
P
Q
X
Z
Z
K
K
K
K
K
K
K
P
P
X
K
P
P
X
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
P
P
P
P
P
P
P
X
10
16
25
50
100
200
500
50
100
200
500
50
100
50
100
SIZE
* Contact factory
Letter
Max.
Thickness
A
0.33
(0.013)
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
AU10
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
AU12
N
1.40
(0.055)
AU13
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
AU14
Y
2.54
(0.100)
Z
2.79
(0.110)
34
微控制器 MCU
