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AXK8L10124BG

Board to Board & Mezzanine Connectors CONN HEADER FPC .4MM 10POS SMD

器件类别:连接器    连接器   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

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器件参数
参数名称
属性值
是否Rohs认证
符合
包装说明
ROHS COMPLIANT
Reach Compliance Code
unknown
ECCN代码
EAR99
连接器类型
FFC/FPC CONNECTOR
联系完成配合
GOLD OVER NICKEL
触点性别
MALE
触点材料
COPPER ALLOY
DIN 符合性
NO
滤波功能
NO
IEC 符合性
NO
MIL 符合性
NO
插接信息
MULTIPLE MATING PARTS AVAILABLE
混合触点
NO
安装方式
STRAIGHT
安装类型
BOARD
装载的行数
2
选件
GENERAL PURPOSE
端子节距
0.4 mm
端接类型
SURFACE MOUNT
触点总数
10
UL 易燃性代码
94V-0
Base Number Matches
1
文档预览
AXK7L, 8L
For board-to-FPC
Narrow pitch connectors
(0.4mm pitch)
F4
Series
4. Easy to design product circuits
An insulating wall prevents contact
between the PC board enabling patterns
and the soldering terminals.
<Socket>
<Header>
FEATURES
1. 0.9 mm mated height low profile
two-piece type connectors
2. Strong resistance to adverse
environments! Utilizes
” construction
for high contact reliability.
3. Improved mating strength between
the socket and header
The simple locking structures provided
for the soldering terminals and the
contact points improve the mating
strength and provide tactile feedback
when locked.
Socket
Header
ORDERING INFORMATION
AXK
AXK: Narrow Pitch Connector Series
Series name;
7L: F4 (0.4 mm pitch) Socket
8L: F4 (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket>
2: For mated height 0.9 mm
<Header>
1: For mated height 0.9 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
3: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
4: Ni plating on base, Au plating on surface
Other specifications
<Header>
Note 1
B: Soldering terminals with fork type terminal
Packing
G: 3,000 pieces embossed tape and plastic reel
×
2
Notes: 1. “B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting,
and a construction that makes it difficult when mounting for excess solder to interfere with the socket.
Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern.
ACCTB28E 201303-T
m
0m
5.
m
1m
4.
Socket
Header
RoHS compliant
Pattern wiring under the connector is possible.
APPLICATIONS
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
Locking structure of the soldering terminals
G
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AXK7L, 8L
PRODUCT TYPES
Part number
Mated height
Number of pins
10
16
20
22
24
26
30
0.9 mm
34
40
44
50
54
60
70
80
Socket
AXK7L10223G
AXK7L16223G
AXK7L20223G
AXK7L22223G
AXK7L24223G
AXK7L26223G
AXK7L30223G
AXK7L34223G
AXK7L40223G
AXK7L44223G
AXK7L50223G
AXK7L54223G
AXK7L60223G
AXK7L70223G
AXK7L80223G
Header
AXK8L10124BG
AXK8L16124BG
AXK8L20124BG
AXK8L22124BG
AXK8L24124BG
AXK8L26124BG
AXK8L30124BG
AXK8L34124BG
AXK8L40124BG
AXK8L44124BG
AXK8L50124BG
AXK8L54124BG
AXK8L60124BG
AXK8L70124BG
AXK8L80124BG
3,000 pieces
6,000 pieces
(2 reels)
Inner carton
(1 reel)
Packing
Outer carton
Notes: 1. Regarding ordering units;
During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please contact our sales office.
Samples: Available. Please contact us.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. “B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting, and a
construction that makes it difficult when mounting for excess solder to interfere with the socket.
Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern.
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Electrical
characteristics
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Soldering terminal holding force
(Header soldering terminal)
Ambient temperature
Soldering heat resistance
Storage temperature
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (Initial)
Max. 90mΩ
Max. 1.70N/pin contacts
×
pin contacts (initial)
Min. 0.098N/pin contacts
×
pin contacts
Min. 0.49N/pin contacts
Min. 0.49N
–55°C to +85°C
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec, 350°C within 3 sec.
–55°C to +85°C (Product only)
–40°C to +50°C (Emboss packing)
Measuring the maximum force.
As the contact is axially pull out.
Measuring the maximum force.
As the soldering terminal is axially pull out.
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
No freezing at low temperatures
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C)
0
1
–55
−3
2
3
85
+3
0
4
0
–55
−3
Temperature 40±2°C,
humidity 90 to 95% R.H.
Temperature 35±2°C,
saltwater concentration 5±1%
Temperature 40±2°C,
gas concentration 3±1 ppm, humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200
times/hours
Time (minutes)
30
Max. 5
30
Max. 5
Conditions
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H
2
S resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Insertion and removal life
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
50 times
20 pin contacts; Socket: 0.03g Header: 0.01g
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB28E 201303-T
AXK7L, 8L
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Surface treatment
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Soldering terminals: Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal)
Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Contact/Post
Copper alloy
DIMENSIONS
(unit: mm)
• Socket (Mated height 0.9 mm)
CAD Data
Dimension table (mm)
0.87
A
B±0.1
0.40±0.05
0.15±0.03
This surface
C0.15
Suction
face
0.80
5.00
Terminal coplanarity
0.08
(Contact and
soldering terminals)
0.60
Soldering
terminals
Number of pins/
Dimensions
10
16
20
22
24
26
30
34
40
44
50
54
60
70
80
A
4.40
5.60
6.40
6.80
7.20
7.60
8.40
9.20
10.40
11.20
12.40
13.20
14.40
16.40
18.40
B
1.60
2.80
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
15.60
C
3.00
4.20
5.00
5.40
5.80
6.20
7.00
7.80
9.00
9.80
11.00
11.80
13.00
15.00
17.00
4.40
F
F
0.40±0.05
C±0.15
Soldering
terminals
0.10±0.03
F-F cross section
(5.00)
5.00
0.50
General tolerance:
±0.2
• Header (Mated height: 0.9 mm)
CAD Data
Dimension table (mm)
Terminal coplanarity
A
B
C±0.1
0.40±0.05
0.15±0.03
0.80±0.05
1.20±0.05
Suction face 2.30
0.63
0.08
(Contact and
soldering terminals)
0.65
Number of pins/
Dimensions
10
16
20
22
24
26
30
34
40
44
50
54
60
70
80
A
4.00
5.20
6.00
6.40
6.80
7.20
8.00
8.80
10.00
10.80
12.00
12.80
14.00
16.00
18.00
B
3.74
4.94
5.74
6.14
6.54
6.94
7.74
8.54
9.74
10.54
11.74
12.54
13.74
15.74
17.74
C
1.60
2.80
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
15.60
3.36
0.27
Soldering terminals
R0
.1
5
0.08±0.03
R0
.
Soldering
terminals
• Socket and header are mated
Header
0.90±0.15
Socket
ACCTB28E 201303-T
Panasonic Corporation
15
General tolerance:
±0.2
4.10
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AXK7L, 8L
EMBOSSED TAPE DIMENSIONS
(unit: mm) (Common for respective contact type, socket and header)
Tape dimensions
(Conforming to JIS C 0806:1990. However,
some tapes have mounting hole pitches that do not comply with
the standard.)
Tape I
Tape II
A±0.3
C
1.75
A±0.3
B
C
1.75
380 dia.
Top cover tape
Plastic reel dimensions
(Conforming to EIAJ ET–7200B)
D±1
Taping reel
Label
Pull out direction
Pull out direction
4
2
4
2
Embossed carrier tape
Embossed mounting-hole
8.0
8.0
1.5
+0.1
dia.
0
1.5
+0.1
dia.
0
TABLE OF DIMENSIONS
Mated height
Common for
socket and header:
0.9mm
Number of pins
Max. 24
26 to 70
80
Type of taping
Tape I
Tape I
Tape II
A
16.00
24.00
32.00
B
28.40
C
7.50
11.50
14.20
D
17.40
25.40
33.40
Quantity per reel
3,000
3,000
3,000
Connector orientation with respect to direction of progress of embossed tape
Type
Direction of
tape progress
Socket
Common for F4
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB28E 201303-T
AXK7L, 8L
NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on both the
soldering terminals and end terminals.
Please lift and remove from it’s side.
This will also prevent cracking of the
soldered parts.
Socket
Recommended PC board pattern
(Mount pad arrangement pattern)
1.40±0.03
0.40±0.03
0.23±0.03
0.
40
Header
Recommended PC board pattern
(Mount pad arrangement pattern)
1.40±0.03
0.40±0.03
0.23±0.03
Max. 2.20
0.57±0.03
4.70±0.03
: Insulation area
1.00±0.03
(Max. 2.20)
(3.20±0.03)
(4.70±0.03)
Mounting pad
: Insulation area
3.60±0.03
C
4.00±0.03
5.60±0.03
Pull
Relation between connector and mounting pad
NG
Pull
Recommended metal mask pattern
Metal mask thickness: When 150
µm
(Terminal portion opening area ratio: 53%)
(Metal portion opening area ratio: 100%)
(0.49)
1.40±0.01
1.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 150
µm
(Terminal portion opening area ratio: 52%)
(Metal portion opening area ratio: 80%)
(0.45)
(0.57)
3.36±0.01
4.50±0.01
0.20±0.01
0.40±0.01
3.60±0.01
4.50±0.01
0.20±0.01
0.40±0.01
1.40±0.01
0.57±0.01
1.40±0.01
0.46±0.01
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Note: if excess solder is used in the
header retaining soldering
terminals, this may cause
incomplete socket mating.
Therefore, please follow the
recommended conditions shown
on the right.
5.60±0.01
3.60±0.01
4.42±0.01
5.40±0.01
1.40±0.01
(1.00)
0.20±0.01
0.40±0.01
Recommended metal mask pattern
Metal mask thickness: When 120
µm
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 100%)
1.40±0.01
1.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 120
µm
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 100%)
5.60±0.01
3.60±0.01
(0.61)
4.18±0.01
5.40±0.01
1.40±0.01
(1.00)
0.20±0.01
0.40±0.01
Please refer to the latest product
specifications when designing your
product.
ACCTB28E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
0.40±0.01
0.40±0.01
0.40±0.03
1.40±0.03
3.20±0.03
C
0.
40
C
4
0.
0
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