30/20 A (N.O./N.C.) at 277 VAC, General Use [1][2]
20/10 A (N.O./N.C.) at 28 VDC[1]
2/0.5 HP (N.O./N.C.) at 250 VAC[1][2]
1/0.25 HP (N.O./N.C.) at 125 VAC[1][2]
20/60 (FLA/LRA) at 277 VAC 30k cycles N.O. [1]
10/33 (FLA/LRA) at 277 VAC 30k cycles N.C. [1]
VDE
Material
Contact factory for ratings
Silver cadmium oxide [1], silver tin oxide [2]
Release Time
Dielectric Strength
(at sea level for 1 min.)
Insulation Resistance
Dropout
Ambient Temperature
Operating
Storage
Vibration
Shock
Enclosure
Terminals
Max. Solder Temp.
Max. Solder Time
Max. Solvent Temp.
Max. Immersion Time
Weight
270°C (518°F)
5 seconds
80°C (176°F)
30 seconds
36 grams
Resistance
< 50 milliohms initially
(24 V, 1 A voltage drop method)
COIL
Power
At Pickup Voltage
(typical)
Max. Continuous
Dissipation
Max. Temperature
DC: 500 mW
AC: 1.4 VA
DC: 1.7 W at 20°C
AC: 2.7 VA at 20°C
155°C (311°F)
NOTES
1. All values at 20°C (68°F).
2. Relay may pull in with less than “Must Operate” value.
3. Specifications subject to change without notice.
7/23/09
AZ2270
RELAY ORDERING DATA
COIL SPECIFICATIONS – DC Coil
Nominal Coil
VDC
5
6
9
12
15
18
24
48
70
110
Must Operate
VDC
3.75
4.50
6.75
9.0
11.3
13.5
18.0
36.0
52.0
82.5
Max. Continuous
VDC
6.4
7.8
12.2
15.4
19.8
24.1
32.0
62.6
93.0
146.0
Nominal Current
mA ± 10%
185
150
93
77
59
47
36
19
27
20
Coil Resistance
± 10%
27
40
97
155
256
380
660
2,560
5,500
13,450
ORDER NUMBER*
AZ2270–1A–5DF
AZ2270–1A–6DF
AZ2270–1A–9DF
AZ2270–1A–12DF
AZ2270–1A–15DF
AZ2270–1A–18DF
AZ2270–1A–24DF
AZ2270–1A–48DF
AZ2270–1A–70DF
AZ2270–1A–110DF
COIL SPECIFICATIONS – AC Coil 50/60 Hz
Nominal Coil
VAC
12
24
120
208
220/240
277
Must Operate
VAC
10.2
20.4
102.0
166.0
187.0
220.0
Max. Continuous
VAC
13.8
27.6
138.0
239.0
276.0
318.0
Nominal Coil
Power VA
2.3
2.1
2.3
2.2
2.2/2.6
2.2
Coil Resistance
± 10%
25
100
2,500
11,000
13,490
15,000
ORDER NUMBER*
AZ2270–1A–12AF
AZ2270–1A–24AF
AZ2270–1A–120AF
AZ2270–1A–208AF
AZ2270-1A–240AF
AZ2270-1A–277AF
*Substitute “-1B” or “-1C” in place of “-1A” for 1 Form B or 1 Form C respectively. For silver tin oxide contacts substitute “-1AE” or “-1CE” in place of “-1A” or “
-1C.” Add “T” to “-1A”, “-1AE”, “-1B”, “-1C” or “-1CE” for extended life contacts. Substitute “DEF” or “AEF” in place of “DF” or “AF” for epoxy sealed version. For
4000 Vrms dielectric strength change “F” to “TF.”
MECHANICAL DATA
1.083
[27.50]
0.130
[3.30]
1.094
[27.80]
.240
[6.10]
0.398
[10.10]
1.276
[32.40]
0.906
[23.00]
0.299
[7.60]
.130
[3.30]
2x
.032 x .062
[0.81 x 1.57]
.045 SQ
[1.14 SQ]
0.339
[8.60]
2 x .025 SQ
[0.64 SQ]
PC BOARD LAYOUT
.150
[3.81]
.700
[17.78]
3 x ø.082
[ ø.2.10]
WIRING DIAGRAMS
1 FORM A
(SPST-NO)
1 FORM B
(SPST-NC)
3
3
1 FORM C
(SPDT)
.400
[10.16]
.900
[22.86]
.300
[7.62]
2
4
4
2
4
2 x ø.043
[ø1.10]
1
5
1
5
1
5
.400
[10.16]
VIEWED TOWARDS TERMINALS
VIEWED TOWARDS TERMINALS
Dimensions in inches with metric equivalents in parentheses. Tolerance: ± .010"
二零一二年一月十二日 -- 中国讯 - 欧司朗光电半导体的研发人员成功地制造出高性能蓝白光 LED 原型，当中的氮化镓发光层生长于直径为 150 毫米的硅晶圆上。这晶圆以硅代替了目前常用的蓝宝石(sapphire)，同样获得相等的优异质量。这款全新的 LED 芯片已经进入试点阶段，将在实际条件下接受测试，这表示欧司朗光电半导体的首批硅上 LED 芯片有望在两年内投放市场。 欧司朗光电半导体德国...[详细]
FPGA/CPLD
