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Am29F040B-70PIB

512K X 8 FLASH 5V PROM, 120 ns, PDSO32

器件类别:存储   

厂商名称:AMD(超微)

厂商官网:http://www.amd.com

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器件参数
参数名称
属性值
功能数量
1
端子数量
32
最小工作温度
0.0 Cel
最大工作温度
70 Cel
额定供电电压
5 V
最小供电/工作电压
4.5 V
最大供电/工作电压
5.5 V
加工封装描述
TSOP-32
状态
Transferred
ype
NOR TYPE
sub_category
Flash Memories
ccess_time_max
120 ns
command_user_interface
YES
data_polling
YES
endurance
100000 Write/Erase Cycles
jesd_30_code
R-PDSO-G32
存储密度
4.19E6 bi
内存IC类型
FLASH
内存宽度
8
umber_of_sectors_size
8
位数
524288 words
位数
512K
操作模式
ASYNCHRONOUS
组织
512KX8
输出特性
3-STATE
包装材料
PLASTIC/EPOXY
ckage_code
TSOP1
ckage_equivalence_code
TSSOP32,.8,20
包装形状
RECTANGULAR
包装尺寸
SMALL OUTLINE, THIN PROFILE
串行并行
PARALLEL
wer_supplies__v_
5
gramming_voltage__v_
5
qualification_status
COMMERCIAL
seated_height_max
1.2 mm
sector_size__words_
64K
standby_current_max
5.00E-6 Am
最大供电电压
0.0400 Am
表面贴装
YES
工艺
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子间距
0.5000 mm
端子位置
DUAL
ggle_bi
YES
length
18.4 mm
width
8 mm
dditional_feature
1000K PROGRAM/ERASE CYCLES; DATA RETENTION 20 YEARS
文档预览
PRELIMINARY
Am29F040B
4 Megabit (512 K x 8-Bit)
CMOS 5.0 Volt-only, Uniform Sector Flash Memory
Distinctive Characteristics
s
5.0 V
±
10% for read and write operations
— Minimizes system level power requirements
s
Manufactured on 0.35 µm process technology
— Compatible with 0.5 µm Am29F040 device
s
High performance
— Access times as fast as 55 ns
s
Low power consumption
— 20 mA typical active read current
— 30 mA typical program/erase current
— 1 µA typical standby current (standard access
time to active mode)
s
Flexible sector architecture
— 8 uniform sectors of 64 Kbytes each
— Any combination of sectors can be erased
— Supports full chip erase
— Sector protection:
A hardware method of locking sectors to prevent
any program or erase operations within that
sector
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies bytes at specified addresses
s
Minimum 1,000,000 program/erase cycles per
sector guaranteed
s
Package options
— 32-pin PLCC, TSOP, or PDIP
s
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply Flash standard
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends a sector erase operation to read data
from, or program data to, a non-erasing sector,
then resumes the erase operation
Publication#
21445
Rev:
B
Amendment/+2
Issue Date:
April 1998
P R E L I M I N A R Y
GENERAL DESCRIPTION
The Am29F040B is a 4 Mbit, 5.0 volt-only Flash mem-
ory organized as 524,288 Kbytes of 8 bits each. The
512 Kbytes of data are divided into eight sectors of 64
Kbytes each for flexible erase capability. The 8 bits of
data appear on DQ0–DQ7. The Am29F040B is offered
in 32-pin PLCC, TSOP, and PDIP packages. This de-
vice is designed to be programmed in-system with the
standard system 5.0 volt V
CC
supply. A 12.0 volt V
PP
is
not required for write or erase operations. The device
can also be programmed in standard EPROM pro-
grammers.
This device is manufactured using AMD’s 0.35 µm
process technology, and offers all the features and ben-
efits of the Am29F040, which was manufactured using
0 . 5 µ m p r o c e s s t e c h n o l o g y. I n a d d t i o n , t h e
Am29F040B has a second toggle bit, DQ2, and also
offers the ability to program in the Erase Suspend
mode.
The standard Am29F040B offers access times of 55,
70, 90, 120, and 150 ns, allowing high-speed micropro-
cessors to operate without wait states. To eliminate bus
contention the device has separate chip enable (CE#),
write enable (WE#) and output enable (OE#) controls.
The device requires only a
single 5.0 volt power sup-
ply
for both read and write functions. Internally gener-
ated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard.
Com-
mands are written to the command register using stan-
dard microprocessor write timings. Register contents
serve as input to an internal state-machine that con-
trols the erase and programming circuitry. Write cycles
also internally latch addresses and data needed for the
programming and erase operations. Reading data out
of the device is similar to reading from other Flash or
EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the
Embedded
Program
algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin.
Device erasure occurs by executing the erase com-
mand sequence. This initiates the
Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by reading the DQ7 (Data#
Polling) and DQ6 (toggle)
status bits.
After a program
or erase cycle has been completed, the device is ready
to read array data or accept another command.
The
sector erase architecture
allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection
measures include a low
V
CC
detector that automatically inhibits write opera-
tions during power transitions. The
hardware sector
protection
feature disables both program and erase
operations in any combination of the sectors of mem-
ory. This can be achieved via programming equipment.
The
Erase Suspend
feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The system can place the device into the
standby
mode.
Power consumption is greatly reduced in
this mode.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effective-
ness. The device electrically erases all bits within a
sector simultaneously via Fowler-Nordheim tunnel-
ing. The data is programmed using hot electron injec-
tion.
2
Am29F040B
P R E L I M I N A R Y
PRODUCT SELECTOR GUIDE
Family Part Number
Speed Option
V
CC
= 5.0 V
±
5%
V
CC
= 5.0 V
±
10%
55
55
25
-55
-70
70
70
30
-90
90
90
35
-120
120
120
50
-150
150
150
55
Am29F040B
Max access time, ns (t
ACC
)
Max CE# access time, ns (t
CE
)
Max OE# access time, ns (t
OE
)
Note:
See the “AC Characteristics” section for more information.
BLOCK DIAGRAM
DQ0–DQ7
V
CC
V
SS
Erase Voltage
Generator
Input/Output
Buffers
WE#
State
Control
Command
Register
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
STB
Data Latch
CE#
OE#
STB
V
CC
Detector
Timer
Address Latch
Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
A0–A18
21445B-1
Am29F040B
3
P R E L I M I N A R Y
CONNECTION DIAGRAMS
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PDIP
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
WE#
V
CC
A12
A15
A16
A18
A17
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
21445B-2
4
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
5
6
7
8
9
10
11
12
13
3
2
1 32 31 30
29
28
27
26
25
24
23
22
21
A14
A13
A8
A9
A11
OE#
A10
CE#
DQ7
PLCC
14 15 16 17 18 19 20
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
V
SS
A17
WE#
21445B-3
A11
A9
A8
A13
A14
A17
WE#
V
CC
A18
A16
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32-Pin Standard TSOP
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
V
SS
DQ2
DQ1
DQ0
A0
A1
A2
A3
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
V
SS
DQ2
DQ1
DQ0
A0
A1
A2
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32-Pin Reverse TSOP
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A11
A9
A8
A13
A14
A17
WE#
V
CC
A18
A16
A15
A12
A7
A6
A5
A4
21445B-4
4
Am29F040B
P R E L I M I N A R Y
PIN CONFIGURATION
A0–A18
=
Address Inputs
Data Input/Output
Chip Enable
Write Enable
Output Enable
Device Ground
DQ0–DQ7 =
CE#
WE#
OE#
V
SS
V
CC
=
=
=
=
LOGIC SYMBOL
19
A0–A18
DQ0–DQ7
CE#
OE#
WE#
8
= +5.0 V single power supply
(see Product Selector Guide for
device speed ratings and voltage
supply tolerances)
21445B-5
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed
by a combination of the following:
Am29F040B
-55
E
C
B
OPTIONAL PROCESSING
Blank = Standard Processing
B = Burn-in
(Contact an AMD representative for more information)
TEMPERATURE RANGE
C =
Commercial (0
°
C to +70
°
C)
I
=
Industrial (–40
°
C to +85
°
C)
E =
Extended (–55
°
C to +125
°
C)
PACKAGE TYPE
P = 32-Pin Plastic DIP (PD 032)
J = 32-Pin Rectangular Plastic Leaded Chip
Carrier (PL 032)
E = 32-Pin Thin Small Outline Package (TSOP)
Standard Pinout (TS 032)
F = 32-Pin Thin Small Outline Package (TSOP)
Reverse Pinout (TSR032)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am29F040B
4 Megabit (512 K x 8-Bit) CMOS 5.0 Volt-only Sector Erase Flash Memory
5.0 V Read, Program, and Erase
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
Valid Combinations
Am29F040B-55
JC, JI, JE, EC, EI, EE, FC, FI, FE
Am29F040B-70
Am29F040B-90
Am29F040B-120
Am29F040B-150
PC, PI, PE,
JC, JI, JE,
EC, EI, EE,
FC, FI, FE
Am29F040B
5
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