Wire Bondable
Chip Resistors
WBC Series
•
Discrete or tapped schematics
•
MIL inspection available
•
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
√
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
Wire Bondable
Chip Resistors
Power Derating Data
TCR/Inspection Code Table
Absolute TCR
±300ppm/°C
±100ppm/°C
±50ppm/°C
±25ppm/°C
Commercial
Code
00
01
02
03
MIL Inspection
Code*
04
05
06
07
*Notes: Product supplied to Class H of MIL-PRF 38534 includes 100% visual inspection
Manufacturing Capabilities Data
Resistance Range
Available Absolute
Tolerances
GJK
FGJK
CDFGJK
CDFGJK
BCDFGJK
BCDFGJK
BCDFGJK
Available Ratio
Tolerances (T0303 only)
FGJ
FGJ
CDFGJ
CDFGJ
BCDFGJ
BCDFGJ
ABCDFGJ
Best Absolute TCR
Tracking TCR
(T0303 only)
±50ppm/°C
±50ppm/°C
±25ppm/°C
±10ppm/°C
±5ppm/°C
±2ppm/°C
±2ppm/°C
10Ω - 20Ω
21Ω - 50Ω
51Ω - 100Ω
101Ω - 200Ω
201Ω - 500Ω
501Ω - 999Ω
1.0KΩ - 1.0MΩ
±100ppm/°C
±100ppm/°C
±100ppm/°C
±50ppm/°C
±50ppm/°C
±25ppm/°C
±25ppm/°C
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 2 of 3
Wire Bondable
Chip Resistors
Environmental Data
Test
Method
MIL-STD-202
Method 107
Test condition F
MIL-STD-883
Method 1008
150°C, 1000 hours
-55°C, 1000 hours
MIL-STD-202
Method 108
70°C, 1000 hours
MIL-STD-202
Method 108
125°C, 1000 hours
Max
∆R
Typical
∆R
Thermal Shock
±0.1%
±0.02%
High Temperature Exposure
±0.1%
±0.05%
Low Temperature Storage
±0.03%
±0.01%
Life
±0.5%
±0.01%
Life at Elevated Temperature
±0.5%
±0.05%
Ordering Data
Prefix
Style
R0202 = Discrete Element
B0202 = Discrete Element with Back Contact
T0303 = Tapped Network
WBC -
R0202
A
S
- 01 - 1002 -
F
B
Bonding pads
A = Aluminum; G = Gold
Backside
A = Aluminum; G = Gold; S = Silicon
TCR/Inspection Code
Reference TCR/Inspection Code Table
Total Resistance (R)
4-Digit Resistance Code Ex: 1002 = 10KΩ; 50R1 = 50.1Ω
Absolute Tolerance Code
K = ±10%; J = ±5%; G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ±0.1%
Ratio Tolerance Code (T0303 Only)
J = ±5%; G = ±2%; F = ±1%; D = 0.5%; C = ±0.25%; B = ±0.1%; A = ±0.05%
Packaging
Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your
specific requirements, please contact our Applications Team using the contact details below.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 3 of 3
Microchip MCU
