Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
Data Sheet
HQM / 0402 / 50V
B37923-K5***-***
Hi-Q Capacitors 0402
Description
The “High-Q-series” was designed for wireless communications and high frequency applications.
The “High-Q-Capacitors” have a class 1 dielectric ceramic and copper inner electrode. The class 1
dielectric ceramic used, HQM, is a very stable dielectric offering a temperature coefficient of
capacitance (TCC) of 0± 60ppm/°C. The higher conductivity of copper give a lower ESR. These
advantages mean a improved performance of matching circuits, lower power dissipation and less
energy absorption.
Features
Ultra low ESR and high Q-factor
Tight capacitance tolerances
Class 1 capacitor with Cu-inner-electrodes
High stability with respect of time, temperature, frequency and voltage
Excellent attenuation
High self resonance frequency
Lead free component
AgNiSn (Nickel
Barrier)
Termination
Applications
Cellular Communication
Bluetooth
DECT
Cable TV
Satellite TV (LNB)
GPS
Vehicle Location Systems
Paging
Test and Measurement
Filters
RF Amplifiers
VCO´s
HIPERLAN
EPCOS KB VS PE
Revision: c/2001
Page 1 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
Data Sheet
HQM / 0402 / 50V
B37923-K5***-***
Ordering Code
Chip
B37923
Type and Size:
HQM / 0402
-
K 5 100
-
J 5 60
Termination Type:
K = Cu/Ni/Sn
Rated Voltage:
5 = 50V
Rated Capacitance:
100 = 10 x 10
0
pF
Capacitance Tolerance:
C<10pF: B = ±0.1pF C = ±0.25pF
K = ±10%
C>10pF: J = ±5%
Decimal place:
for cap. values <10pF, otherwise not used
Packaging code:
60 = card board, 180mm reel
Sample Kit
B37923
-
K 5 999
-
J 99
Cap values:
0.4, 0.5, 1.2, 1.5, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6,
6.8, 8.2, 10, 12, 15, 18, 22
Capacitance Tolerance:
C<3.9pF: B = ±0.1pF
4.7pF<C10pF C = ±0.25pF
C>10pF: J = ±5%
EPCOS KB VS PE
Revision: c/2001
Page 2 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
Data Sheet
HQM / 0402 / 50V
B37923-K5***-***
Figure
l
Symbol
b
l
b
s
k
s
Min
0.95
0.45
0.45
0.10
Max
1.05
0.55
0.55
0.30
Unit
mm
mm
mm
mm
Dimensions and tolerances in accordance with
CECC 32101-801
k
Electrical Data
Capacitance Test Conditions
Test frequency:
Test voltage:
Reference Temperature
Dissipation factor tan
δ
(limit value):
Insulation Resistance:
Ageing:
Temperature coefficient (tolerance)
Operating Temperature Range:
Climatic category (IEC 68-1):
Capacitance Range:
1.0 MHz ± 0,2 MHz
1.0 V ± 0.2 V
25°C ± 1°C (EIA)
< 1.0 x 10
-3
> 10
5
MΩ
none
0 ± 60*10
-6
1/K
-55°C ... +125°C
55/125/56
0.3 ... 22pF (up from 1pF Series E12)
RF Measuring equipment
S-Parameter Measuring Configuration:
HP 8753D (30kHz – 6GHz)
HP 8722D (1MHz – 40GHz)
samples soldered on microstrip PCB’s
Measuring Direction: Shunt
Impedance Measuring Configuration:
Agilent E 4991A (1MHz – 3GHz)
Test fixture 16197A
parts not soldered
EPCOS KB VS PE
Revision: c/2001
Page 3 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
Data Sheet
HQM / 0402 / 50V
B37923-K5***-***
Typical RF Performance
Capacitance
[pF]
0.3
0.4
0.5
0.7
0.8
1.0
1.2
1.5
2.2
2.7
3
3.3
3.9
4.7
5.1
5.6
6.8
8.2
10
12
15
18
22
f
res
1
ESR@ 1GHz
[mΩ]
Ω]
535
495
425
365
320
300
275
255
215
195
185
180
170
155
145
135
125
112
106
96
90
80
78
2
Q@ 1GHz
940
865
750
640
555
520
475
405
315
280
255
240
225
200
175
155
135
112
100
80
66
52
46
2
ESR@ f
res
[mΩ]
Ω]
690
630
535
455
390
365
330
295
245
225
210
205
195
175
165
150
140
124
116
106
96
88
84
2
[MHz]
23400
20350
19700
15100
14450
12000
10600
8900
6400
6000
6200
5500
5350
4650
4400
3950
4100
3650
3350
3350
2600
2300
2200
1
2
Impedance Analyser E 4991A, parts not soldered
Network Analyser HP 8753D, parts soldered
EPCOS KB VS PE
Revision: c/2001
Page 4 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
Data Sheet
HQM / 0402 / 50V
B37923-K5***-***
Fig. 1: Typical ESR for different Frequencies vs.
3
Capacitance
1000
Fig. 2: Typical Q Factor for different Frequencies vs.
3
Capacitance
10000
100 MHz
3 GHz
1000
Ω
1 GHz
1 GHz
100
100 MHz
3 GHz
100
10
0,1
1
C [pF]
10
100
10
0,1
1
C [pF]
10
100
Fig. 3: Typical Self Resonant Frequencies vs.
3
Capacitance
100000
Fig. 4: Typical ESR at Resonant Frequencies for
4
soldered parts vs. Capacitance
1000
10000
Ω
100
1000
100
0,1
1
C [pF]
10
100
10
0.1
1
C [pF]
10
100
Fig. 5: Typical ESR for different Capacitances vs.
3
Frequency
10
Fig. 5: Typical Q Factor for different Capacitances vs.
3
Frequency
10000
1000
0.4pF
1
Zre [
Ω
]
3.3pF
0.4pF
100
Q
12pF
3.3pF
10
22pF
0.1
12pF
22pF
1
0.01
100
1000
Frequency [MHz]
10000
0.1
100
1000
Frequency [MHz]
10000
3
4
Impedance Analyser E 4991A, parts not soldered
Network Analyser HP 8753D, parts soldered
EPCOS KB VS PE
Revision: c/2001
Page 5 of 11
15.10.01
RF/无线
