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B37931K1152K060

CAPACITOR, CERAMIC, MULTILAYER, 100V, X7R, 0.0015uF, SURFACE MOUNT, 0603, CHIP, LEAD FREE

器件类别:无源元件    电容器   

厂商名称:EPCOS (TDK)

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
包装说明
, 0603
Reach Compliance Code
unknown
ECCN代码
EAR99
电容
0.0015 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
高度
0.8 mm
JESD-609代码
e3
长度
1.6 mm
制造商序列号
B37931
安装特点
SURFACE MOUNT
多层
Yes
负容差
10%
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
包装方法
TR, CARDBOARD, 7 INCH
正容差
10%
额定(直流)电压(URdc)
100 V
系列
B37931(100V)
尺寸代码
0603
表面贴装
YES
温度特性代码
X7R
温度系数
15% ppm/°C
端子面层
Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
宽度
0.8 mm
Base Number Matches
1
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Multilayer ceramic capacitors
Chip capacitors, X7R
Date:
October 2006
Data Sheet
ã
EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the
information contained therein without EPCOS’ prior express consent is prohibited.
Multilayer ceramic capacitors
X7R
Ordering code system
Chip
B37941
K
5
102
K
0
60
Packaging
60
62
70
72
01
^
^
^
^
^
cardboard tape, 180-mm reel
blister tape, 180-mm reel
cardboard tape, 330-mm reel
blister tape, 330-mm reel
bulk case
Internal coding
Capacitance tolerance
J
^
±
5%
K
^
±10%
(standard)
M
^
±20%
Capacitance,
coded
(example)
102
^
10 · 10
2
pF = 1 nF
104
^
10 · 10
4
pF = 100 nF
223
^
22 · 10
3
pF = 22 nF
16
9
25
0
50
5
100
1
200
2
500
3
Rated voltage
Rated voltage [VDC]
Code
Termination
Standard:
On request:
K
^
nickel barrier for all case sizes
J
^
silver-palladium for conductive adhesion: all case sizes
Type and size
Chip size
(inch / mm)
0603
/ 1608
0805
/ 2012
1206
/ 3216
1210
/ 3225
1812
/ 4532
2220
/ 5750
Temperature characteristic
X7R
B37931
B37941
B37872
B37950
B37953
B37956
Please read
Cautions and warnings
and
Important notes
at the end of this document.
2
10/06
Multilayer ceramic capacitors
X7R
Features
Chip
High volumetric efficiency
Non-linear capacitance change
High insulation resistance
High pulse strength
To AEC-Q200
Applications
Blocking and coupling
Decoupling
Interference suppression
Termination
For soldering: Nickel barrier termination (Ni)
For conductive adhesion: Silver-palladium termination (AgPd) on request
Options
Alternative capacitance tolerances available on request
Delivery mode
Cardboard and blister tape (blister tape for chip thickness
³
1.2
±
0.1 mm and case sizes
³
1210),
180-mm and 330-mm reel available
Bulk case for case sizes 0603 (16 V, 25 V, 50 V) and 0805 (50 V)
Electrical data
Temperature characteristic
Max. relative capacitance change
within –55
°
C to +125
°
C
Climatic category (IEC 60068-1)
Standard
Dielectric
Rated voltage
1)
Test voltage
Capacitance range
2)
/ E series
Dissipation factor (limit value)
Insulation resistance
3)
at + 25
°
C
Insulation resistance
3)
at +125
°
C
Time constant
3)
at + 25
°
C
Time constant
3)
at +125
°
C
Operating temperature range
Ageing
4)
1) Note: No operation on AC line.
2) See also chapter “HighCV”.
X7R
D
C/C
V
R
V
test
C
R
tan
d
R
ins
R
ins
t
t
T
op
±
15
55/125/56
EIA
Class 2
16, 25, 50, 100, 200, 500
2.5 · V
R
/5 s
100 pF … 1 µF (E3/E6)
< 25 · 10
–3
< 35 · 10
–3
for 16 V
>10
5
>10
4
>1000
>100
–55 … +125
yes
%
VDC
VDC
M
W
M
W
s
s
°
C
3) For C
R
>10 nF the time constant
t
= C · R
ins
is given.
4) Refer to chapter “General technical information”, “Ageing”.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
3
10/06
X7R
Multilayer ceramic capacitors
X7R
Capacitance tolerances
Code letter
Tolerance
J
K
M
(standard)
±
5%
±
10%
±
20%
Dimensional drawing
b
s
k
k
KKE0329-N
Dimensions (mm)
Case size
l
b
s
k
Case size
l
b
s
k
(inch)
(mm)
(inch)
(mm)
0603
1608
1.6
±
0.15
0.8
±
0.10
0.8
±
0.10
0.1 –0.40
1210
3225
3.20
±
0.30
2.50
±
0.30
1.70 max.
0.25 –0.75
0805
2012
2.00
±
0.20
1.25
±
0.15
1.35 max.
0.13 –0.75
1812
4532
4.50
±
0.30
3.20
±
0.30
1.30 max.
0.25 –1.0
1206
3216
3.20
±
0.20
1.60
±
0.15
1.30 max.
0.25 –0.75
2220
5750
5.7
±
0.40
5.0
±
0.40
1.30 max.
0.25 –1.0
Tolerances to CECC 32101-801
Please read
Cautions and warnings
and
Important notes
at the end of this document.
4
10/06
Multilayer ceramic capacitors
X7R
Recommended solder pad
D
X7R
C
A
KKE0308-1
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
0603/1608
0805/2012
1206/3216
1210/3225
1812/4532
2220/5750
Type
single chip
single chip
single chip
single chip
single chip
single chip
A
0.6 … 0.7
0.6 … 0.7
0.8 … 0.9
1.0 … 1.2
1.2 … 1.4
1.4 … 1.6
C
1.8 … 2.2
2.2 … 2.6
3.8 … 4.32
4.0 … 4.8
5.4 … 6.3
6.8 … 7.8
D
0.6 … 0.8
0.8 … 1.1
1.0 … 1.4
1.8 … 2.3
2.3 … 3.0
3.5 … 4.8
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
0603/1608
0805/2012
1206/3216
Termination
Termination
(nickel barrier)
Ceramic body
Type
single chip
single chip
single chip
A
0.8 … 0.9
0.9 … 1.0
1.0 … 1.1
C
2.2 … 2.8
2.8 … 3.2
4.2 … 4.8
D
0.6 … 0.8
0.8 … 1.1
1.0 … 1.4
Inner electrode
NME
AgPd
BME
Ni
Substrate electrode
Intermediate electrode
External electrode
NME
Ag
Ni
Sn
BME
Cu
Ni
Sn
NME: Noble Metal Electrode
BME: Base Metal Electrode
KKE0485-5-E
Please read
Cautions and warnings
and
Important notes
at the end of this document.
5
10/06
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