BALF-CC25-02D3
50 ohm, conjugate match to CC2541
transformer balun
Datasheet
−
production data
Description
STMicroelectronics BAL-CC25-02D3 is an ultra
miniature balun which integrates a matching
network in a monolithic glass substrate. This has
been customized for the CC2541 RF
transceivers.
It’s a design using STMicroelectronics IPD
(integrated passive device) technology on non-
conductive glass substrate to optimize RF
performance.
Figure 1. Pin configuration (top view)
Features
•
2.45 GHz balun with integrated matching
network
•
Matching optimized for following CC2541
•
Low insertion loss
•
Low amplitude imbalance
•
Low phase imbalance
•
Coated Flip-Chip on glass
•
Small footprint: < 0.88 mm²
Benefits
•
Very low profile
•
High RF performance
•
PCB space saving versus discrete solution
•
BOM count reduction
•
Efficient manufacturability
Figure 2. Application schematic (top view)
November 2015
This is information on a product in full production.
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11
Characteristics
BALF-CC25-02D3
1
Characteristics
Table 1.
A
bsolute maximum rating (limiting values)
Symbol
P
IN
Input power RF
IN
Parameter
Value
20
2000
500
500
-40 to + 105
Unit
dBm
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5
Ω,
air discharge)
V
ESD
ESD ratings machine model (MM: C = 200 pF, R = 25
Ω,
L = 500 nH)
ESD ratings charged device model (CDM, JESD22-C101D)
T
OP
Operating temperature
V
°C
Table 2. Electrical characteristics - RF performance (T
amb
= 25 °C)
Value
Symbol
Z
OUT
Z
IN
F
I
L
R
L_SE
R
L_DIFF
Φ
imb
A
imb
Parameter
Min.
Nominal differential output impedance
Nominal input impedance
Frequency range (bandwidth)
Insertion loss in bandwidth
Single ended return loss in bandwidth
Differential ended return loss in bandwidth
Phase imbalance
Amplitude imbalance
9
9
2379
1.6
10
17
7
0.6
Typ.
Max.
Ω
Conjugate match to CC2541
50
2507
1.8
dB
dB
dB
°
dB
Unit
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BALF-CC25-02D3
Figure 3. Balun transmission (T
amb
= 25 °C)
Characteristics
Figure 4. Insertion loss (T
amb
= 25 °C)
Figure 5. Return loss on SE port (T
amb
= 25 °C)
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Characteristics
Figure 6. Return loss on DIFF port (T
amb
= 25 °C)
BALF-CC25-02D3
Figure 7. Amplitude imbalance (T
amb
= 25 °C)
Figure 8. Phase imbalance (T
amb
= 25 °C)
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BALF-CC25-02D3
Package information
2
Package information
•
•
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
2.1
Flip-Chip package information
Figure 9. Flip-Chip package outline
Table 3. Flip-Chip package mechanical data
Parameter
A
A1
A2
b
D
D1
E
E1
SE
fD
fE
ccc
$
0.025
Distance from bump to edge of die on Y
axis
Distance from bump to edge of die on X
axis
Description
Bump height + substrate thickness
Bump height
Substrate thickness
Bump diameter
Y dimension of the die
Y pitch
X dimension of the die
X pitch
0.890
0.215
0.890
Min.
0.570
0.155
Typ.
0.630
0.205
0.400
0.255
0.940
0.500
0.940
0.500
0.250
0.220
0.220
0.05
0.990
0.295
0.990
Max.
0.690
0.255
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
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