Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
820
W
+10 V
2.0 k
100
mH
0.1
mF
DUT
50
W
Output
Pulse
Generator
50
W
INPUT
SAMPLING
OSCILLOSCOPE
V
R
INPUT SIGNAL
90%
I
R
i
R(REC)
= 1.0 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; MEASURED
at i
R(REC)
= 1.0 mA)
I
F
0.1
mF
t
r
10%
t
p
t
I
F
t
rr
t
1.
2.
3.
A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
www.onsemi.com
2
BAS116L
TYPICAL CHARACTERISTICS
100
I
R
, REVERSE CURRENT (nA)
1,000
I
F
, FORWARD CURRENT (mA)
100
10
T
A
= 150°C
150°C
10
25°C
−55°C
1.0
25°C
0.1
−55°C
1
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
V
F
, FORWARD VOLTAGE (V)
0.01
0
10
20
30
40
50
60
70
80
V
R
, REVERSE VOLTAGE (V)
Figure 2. Forward Voltage
1.2
C
T
, TOTAL CAPACITANCE (pF)
T
A
= 25°C
1.0
0.8
0.6
0.4
0.2
0
0
10
20
30
40
50
60
70
Figure 3. Leakage Current
80
V
R
, REVERSE VOLTAGE (V)
Figure 4. Capacitance
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3
BAS116L
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
D
0.25
3
E
1
2
HE
L
3X
b
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
DIM
A
A1
b
c
D
E
e
L
L1
H
E
T
MIN
0.89
0.01
0.37
0.08
2.80
1.20
1.78
0.30
0.35
2.10
0
°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.14
0.20
2.90
3.04
1.30
1.40
1.90
2.04
0.43
0.55
0.54
0.69
2.40
2.64
−−−
10
°
MIN
0.035
0.000
0.015
0.003
0.110
0.047
0.070
0.012
0.014
0.083
0
°
INCHES
NOM
0.039
0.002
0.017
0.006
0.114
0.051
0.075
0.017
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.008
0.120
0.055
0.080
0.022
0.027
0.104
10
°
e
TOP VIEW
L1
VIEW C
A
A1
SIDE VIEW
SEE VIEW C
c
END VIEW
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
RECOMMENDED
SOLDERING FOOTPRINT*
2.90
3X
0.90
3X
0.80
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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RTC（Real Time Clock）是实时时钟的意思，它其实和TIM有点类似，也是利用计数的原理，选择RTC时钟源，再进行分频，到达计数的目的。 该文主要讲述关于RTC的秒中断功能，这个功能类似SysTIck系统滴答的功能。RTC秒中断功能其实是每计数一次就中断一次。注意，这里所说的秒中断并非一定是一秒的时间，它是由RTC时钟源和分频值决定的“秒”的时间，当然也是可以做到1秒钟中断一次。...[详细]
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stm32/stm8
