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BCN104AB100J13S

Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.063W, 10ohm, 25V, 5% +/-Tol, -200,200ppm/Cel, 0804,

器件类别:无源元件    电阻器   

厂商名称:TT Electronics plc

厂商官网:http://www.ttelectronics.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
7263779186
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
ANTI-SULFUR
构造
Rectangular
元件功耗
0.063 W
第一元件电阻
10 Ω
JESD-609代码
e3
安装特点
SURFACE MOUNT
网络类型
ISOLATED
元件数量
1
功能数量
4
端子数量
8
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.45 mm
封装长度
1 mm
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
封装宽度
2 mm
包装方法
TR, PAPER, 13 INCH
额定功率耗散 (P)
0.25 W
额定温度
70 °C
参考标准
AEC-Q200
电阻
10 Ω
电阻器类型
ARRAY/NETWORK RESISTOR
第二/最后一个元素电阻
10 Ω
尺寸代码
0408
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
200 ppm/°C
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
容差
5%
工作电压
25 V
文档预览
Thick Film Chip Arrays
BCN Series
Features
Sulphur resistant version available (Tested to ASTM-B809)
AEC-Q200 (BCN10 and BCN164AB)
Convex terminations
Isolated and bussed versions
All parts are Pb-free and comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Summary of Types
Type
BCN10
BCN164
BCN168
Part Number
Start
BCN104AB
BCN164A
BCN164AB
BCN168SB
BCN168RB
1.6
0603 x 8
Bussed
Width (mm)
1.0
Resistor
Elements
0402 x 4
0603 x 4
Isolated
1206
Circuit
Package Size
0804
Scalloped
Convex
Square
Convex
Electrical Data
BCN10
Resistor power rating @70°C
Package power rating @70°C
Limiting element voltage
Maximum overload voltage
Resistance range
Resistance tolerance
TCR
Standard values
Ambient temperature range
°C
mW
mW
V
V
ohms
%
ppm/°C
1, 5
25
63
10R – 1M0
1, 2, 5
±200
E24 (for 2% or 5% tolerance), E96 (for 1% tolerance)
-55 to +155
63
250
50
125
25
63
100R – 1M0
5
BCN164
BCN168
32
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
01.22
Thick Film Chip Arrays
BCN Series
Circuits
Isolated
BCN10 & BCN16 4
R1
R2
R3
R4
R1 = R2 = R3 = R4
Standard Bussed
BCN168S
10
9
8
7
6
Reverse Bussed
BCN168R
10
9
8
7
6
1
2
3
4
5
1
2
3
4
5
Environmental Data
Test
Load life
Short term overload
High temperature operation
Temperature cycling
Moisture resistance
Resistance to solder heat
Sulphur resistance
1
Note 1 – Anti-sulphur construction only
Condition
1000 hrs cyclic load @ 70°C
2.5 x rated voltage for 5s
1000 hrs @ 155°C
5 cycles, -55 to +155°C
1000 hrs @ 40°C, 95% RH
260°C for 10s
1000 hrs @ 50°C, 92% RH, 3-5ppm H
2
S
ΔR% (+0.1Ω)
3
2
3
1
3
1
0.5
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
01.22
Thick Film Chip Arrays
BCN Series
Physical Data (Inch /mm)
BCN164A (scalloped convex)
L
BCN10, BCN164AB (square convex)
L
C
W
W
C
B
H
H
P
B
P
B1
L
BCN 10
BCN164A/AB
.079 ±.004
2.00 ±0.10
.126 ±.004
3.20 ±0.10
W
.039 ±.004
1.00 ±0.10
.063 ±.004
1.60 ±0.10
H
.018 ±.004
0.45 ±0.10
.020 ±.004
0.50 ±0.10
P
.020 ±.002
0.50 ±0.05
.031 ±.002
0.80 ±0.05
B
.012 ±.002
0.30 ±0.05
.020 ±.004
0.50 ±0.10
B1
.016±.002
0.40 ±0.05
C
.012±.006
0.3 ±0.15
.009 ±.005
0.229 ±0.125
-
BCN168 (square convex)
L
B1
T
A
W
C
P
B2
L
.126 ±.008
3.20 ±0.20
W
.063 ±.008
1.60 ±0.20
T
.020 ±.004
0.50 ±0.10
A
.012 ±.006
0.30 ±0.15
B1
.014 ±.006
0.36 ±0.15
B2
.020 ±.006
0.50 ±0.15
C
.008
0.20
P
.025
0.64
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
01.22
Thick Film Chip Arrays
BCN Series
Solder pad layout (Inch / mm)
BCN164
Y
A
B
Y
C
X
P
Wave Solder Process
BCN164A/AB
P
.032
0.80
A
.039
1.00
B
.118
3.00
C
.014
0.35
X
.018
0.45
Y
.039
1.00
A
.039
1.00
Re-flow Solder Process
B
.118
3.00
C
.014
0.35
X
.018
0.45
Y
.039
1.00
BCN168
BCN 16 8RB / 8SB
Y
A
P
B
Y
09.21
X
X1
Wave Solder Process
P
BCN 16 8RB / 8SB
.025
0.64
A
.048
1.20
B
.096
2.40
X
.012
0.30
X1
.018
0.45
Y
.024
0.60
A
.048
1.20
Re-flow Solder Process
B
.096
2.40
X
.012
0.30
X1
.018
0.45
Y
.024
0.60
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
01.22
Thick Film Chip Arrays
BCN Series
Solder pad layout (Inch / mm)
BCN 10
L
Y
A
P
P1
B
X
X1
P
BCN 10
.024
0.60
P1
.020
0.50
A
.020 ±.004
0.50 ±0.10
B
.060 ±.004
1.50 ±0.10
X
010 ±.004
0.25 ±0.15
X1
.018 ±.004
0.45 ±0.10
Y
.020 ±.004
0.50 ±0.10
L
.085 ±.004
2.15 ±0.10
Passivation:
Glass or Resin
Resistor: Ruthenium Oxide
Alumina Substrate
100% Tin
Conductor
Nickel Barrier
Marking
BCN parts may be unmarked or marked with ohmic values. If marked, 2% and 5% tolerance parts are marked with three characters
(e.g. 102). 1% tolerance parts may be marked with 3 or 4 characters (e.g. 102, 1001, 4991)
General Note
TT Electronics reserves the right to make changes in product
without
is subject to TT Electronics’ own data and is considered accurate at
All
or liability.
of going to print.
BI Technologies IRC Welwyn
© TT Electronics plc
01.22
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