1
2
3
4
5
6
7
8
Global Connector Technology Ltd. - BF030: 2.0mm PITCH PIN HEADER, DUAL ROW, SURFACE MOUNT
A
A
B
B
C
C
D
D
E
Ordering Grid
E
BF030
XX X
XX
XXXX
XXXX
XXXX
XX
Packing Options
No. of Contacts
SPECIFICATIONS
规格
B = Tape & Reel with Cap (Standard)
06 to 50
CURRENT RATING
电流额定值
: 2 AMP
D = Tube
INSULATOR RESISTANCE
绝缘电阻值
: 1000 MEGAOHMS MIN.
Contact Plating
E = Tube with Cap
Insulator Material
Locating Peg
CONTACT RESISTANCE
接触电阻值
: 20 mOHMS MAX.
A = Gold Flash All Over
F
DIELECTRIC WITHSTANDING
耐电压
: AC 500 V
N = Nylon 6T
0 = No Peg
B = Selective Gold Flash Contact Area/
L = LCP (Standard)
1 = With Peg
OPERATING TEMPERATURE
工½温度
: -40°C TO +105°C
Tin On Tail
CONTACT MATERIAL
端子物料
: COPPER ALLOY
Dimension W (1/100mm)
C = Tin All Over
INSULATOR MATERIAL
绝缘½物料
:
(Footprint Width)
G = 10µ" Gold Contact Area/Tin On Tail
Dimension E (1/100mm)
STANDARD
标准物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94-V0
'H' = 2.00mm: Standard - 6.00mm = 0600
I = 30µ" Gold Contact Area/Tin On Tail
(PCB to Top of Insulator)
OPTIONS
可选物料
: POLYESTER
聚酯
, LCP, UL 94-V0
'H' = 1.50mm: Standard - 5.50mm = 0550
Standard = Gold Flash All Over
'H' = 2.00mm: Standard - 2.77mm = 0277
SOLDERING PROCESS
可焊性
:
Dimension D (1/100mm)
Or specify Dimension W
'H' = 1.50mm: Standard - 2.20mm = 0220
NYLON 6T (STANDARD
标准物料
) -
(Post Height)
e.g. 5.50mm = 0550
Insulator
Or specify Dimension E
IR REFLOW
回流焊
: 260°C for 10 sec.
Standard - 2.00mm = 0200
TOL +/- 0.2mm
G
Height 'H'
e.g. 2.50mm = 0250
WAVE
波峰焊
:230°C for 5-10 sec.
Standard - 4.00mm = 0400
A = 1.50mm
TOL +/- 0.2mm
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
Standard - 6.00mm = 0600
B = 2.00mm
LCP (OPTION
可选物料
) -
Or specify Dimension D
Standard = 2.00mm
e.g. 2.50mm = 0250
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
:250°C for 5-10 sec.
TOL +/- 0.2mm
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
Tolerances
Part Number:-
Date:-
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
(Except as noted)
BF065
BF075
BF080
BF095
BF100
26 OCT 07
BF030
Dimensions in mm
BF105
BF115
BF120
F
G
H
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
26/10/07
CB
PACKING OPTIONS
CHANGED
DR
SA
B
27/04/09
AMENDMENT TO
CHANGE TO SOLDER
TEMP. INFORMATION
STANDARD DIMENSIONS
D
C
08/12/09
30/07/09
X.°±5°
Description:-
.X°±2°
2.0mm PITCH PIN HEADER, DUAL ROW,
.XX°±1°
SURFACE MOUNT
X.XXX ± 0.10 .XXX°±0.5°
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Third Angle Projection
X.X ± 0.20
X.XX ± 0.15
X. ± 0.30
www.globalconnectortechnology.com
Scale
NTS
GC
Material
See Note
H
C
Revision
D
Drawn by
LYH
E & OE
Sheet No.
1/1
1
2
3
4
5
6
7
8
Microchip MCU