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BG115-24-B-2-0250-L-D

Board Connector,

器件类别:连接器    连接器   

厂商名称:Global Connector Technology

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Objectid
1325839775
Reach Compliance Code
compliant
连接器类型
BOARD CONNECTOR
联系完成配合
GOLD FLASH OVER NICKEL
联系完成终止
Tin (Sn) - with Nickel (Ni) barrier
触点材料
COPPER ALLOY
JESD-609代码
e3
文档预览
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Global Connector Technology Ltd. - BG115: 2.54mm PITCH SOCKET, SINGLE ROW, THROUGH-HOLE, VERTICAL
A
Ø1.02 (Typ.)
5
6
7
8
DIMENSIONS
A
2.54
5.08
7.62
10.16
12.70
15.24
17.78
20.32
22.86
25.40
27.94
30.48
33.02
35.56
38.10
40.64
43.18
45.72
48.26
50.80
53.34
55.88
58.42
60.96
63.50
66.04
68.58
71.12
73.66
76.20
78.74
81.28
83.82
86.36
88.90
91.44
93.98
96.52
99.06
B
5.58
8.12
10.66
13.20
15.74
18.28
20.82
23.36
25.90
28.44
30.98
33.52
36.06
38.60
41.14
43.68
46.22
48.76
51.30
53.84
56.38
58.92
61.46
64.00
66.54
69.08
71.62
74.16
76.70
79.24
81.78
84.32
86.86
89.40
91.94
94.48
97.02
99.56
102.10
CONTACTS
2
3
4
5
6
7
8
9
10
A
2.54
B
2.50
2.54 (Typ.)
Typ. (Non-Accum)
B
RECOMMENDED PCB LAYOUT
M.I.D
B
C
H=8.50: Min. Insertion Depth = 2.00 REF.
H=5.65: Min. Insertion Depth = 1.75 REF.
2.50
11
12
13
14
15
C
H
16
17
18
19
20
21
22
23
24
25
26
27
28
D
PIN 0.60X0.40 (Typ.)
C±0.2
D
2.54 (Typ.)
A±0.25
E
B±0.38
E
Ordering Grid
SPECIFICATIONS
规格
CURRENT RATING
电流额定值:
3 AMP
INSULATOR RESISTANCE
绝缘电阻值:
1000 MΩ MIN.
DIELECTRIC WITHSTANDING
耐电压:
AC 600 V
CONTACT RESISTANCE
接触电阻值:
20mΩ Max.
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
CONTACT MATERIAL
端子物料:
COPPER ALLOY
CONTACT PLATING: GOLD/TIN OVER NICKEL
INSULATOR MATERIAL
绝缘½物料:
STANDARD
标准物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94V-0
OPTIONS
可选物料
: POLYESTER
聚酯
, LCP, UL 94V-0
SOLDERING PROCESS
可焊性
:
NYLON 6T (STANDARD
标准物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
LCP (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 250°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BG020
BG030
BG035
BG055
BG060
BG075
BG080
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
30/10/06
PN
DIMENSION
AMENDMENT
B
09/03/09
CB
PACKING OPTIONS
CHANGED
BG115
XX
X
X
XXXX
X
X
Packing Options
H = Tray (Standard)
E
D = Tube
G = Plastic Box
C
(BG115 2 position only
available in plastic box)
29
30
31
32
33
34
35
36
37
38
39
40
F
F
No. of Contacts
02 to 40
Contact Plating
A = Gold Flash All Over (Standard)
B = Selective Gold Flash Contact
Area/Tin On Tail
C = Tin All Over
G = 10µ" Gold Contact Area/Tin On Tail
I = 30µ" Gold Contact Area/Tin On Tail
Insulator Material
N = Nylon 6T (Standard)
L = LCP
G
Insulator
Height "H"
1 = 8.50mm
2 = 5.65mm (Standard)
Dimension C (1/100mm)
(Tail Length)
H = 8.50mm: 3.20mm = 0320 (Standard)
H = 5.65mm: 3.00mm = 0300 (Standard)
Or specify Dimension C
e.g. 2.50mm = 0250
F
G
Tolerances
(Except as noted)
Part Number:-
Date:-
Dimensions in mm
X. ± 0.30
BG115
30 OCT 06
ROW,
Scale
NTS
H
DR
AJO
AJO
PACKING OPTION
AMENDMENT
F
29/05/13
1
C
27/04/09
CHANGE TO SOLDER PACKING OPTIONS
TEMP. INFORMATION
UPDATED
D
E
05/08/09
18/09/12
X.°±5°
Description:-
X.X°±2°
X.X ± 0.20
2.54mm PITCH SOCKET,SINGLE
X.XX ± 0.15
X.XX°±1°
THROUGH-HOLE, VERTICAL
X.XXX ± 0.10 X.XXX°±0.5°
Third Angle Projection
GC
Revision
F
H
Sheet No.
E & OE
1/1
www.gct.co
Drawn by
LYH
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Material
See Note
2
3
4
5
6
7
8
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