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BGM13P22F512GE-V2

BLUETOOTH 5.0 MODULE

器件类别:热门应用    无线/射频/通信   

厂商名称:Silicon Laboratories Inc

器件标准:

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器件参数
参数名称
属性值
射频系列/标准
蓝牙
协议
蓝牙 v5.0
调制
GFSK
频率
2.4GHz
功率 - 输出
8dBm
串行接口
I²C,I²S,SPI,UART
天线类型
集成式,芯片
使用的 IC/零件
EFR32BG
存储容量
512kB 闪存,64kB RAM
电流 - 接收
9.8mA
电流 - 传输
9.5mA
安装类型
表面贴装
封装/外壳
模块
文档预览
BGM13P Blue Gecko
Bluetooth
®
Module
Data Sheet
The BGM13P is Silicon Labs' first PCB module solution for Bluetooth 5.0 LE connectivity.
It supports long range, high throughput, and regular LE Bluetooth PHYs. Also, with 512
kB of flash and 64 kB of RAM, the BGM13P is suited to meet Bluetooth Mesh networking
memory requirements effectively.
Based on the Silicon Labs EFR32BG13 Blue Gecko SoC, the BGM13P delivers robust
RF performance, low energy consumption, a wide selection of MCU peripherals, regula-
tory test certificates for various regions and countries, and a simplified development ex-
perience, all in a small form factor. Together with the certified software stacks and pow-
erful tools also offered by Silicon Labs, the BGM13P can minimize the engineering ef-
forts and development costs associated with adding Bluetooth 5.0 or Bluetooth Mesh
connectivity to any product, accelerating its time-to-market.
BGM13P modules can be used in a wide variety of applications:
IoT end devices and gateways
Health, sports and wellness
Industrial, home and building automation
Beacons
Smart phone, tablet, and PC accessories
KEY FEATURES
• Bluetooth 5.0 LE compliant
• Fit for Bluetooth Mesh
• Antenna or U.FL connector variants
• Up to +19 dBm TX power
• -94.8 dBm RX sensitivity at 1 Mbps
• 32-bit ARM® Cortex®-M4 core at 38.4
MHz
• 512/64 kB of flash/RAM memory
• Autonomous Hardware Crypto
Accelerators
• True Random Number Generator
• 25 GPIO pins
• 12.9 mm × 15.0 mm × 2.2 mm
Core / Memory
Crystals
38.4 MHz
Clock Management
H-F Crystal
Oscillator
Auxiliary H-F RC
Oscillator
H-F
RC Oscillator
L-F
RC Oscillator
Ultra L-F RC
Oscillator
Energy Management
Voltage
Regulator
DC-DC
Converter
Brown-Out
Detector
Voltage Monitor
Other
CRYPTO
CRC
ARM Cortex
TM
M4 processor
with DSP extensions, FPU and MPU
Flash Program
Memory
Power-On Reset
True Random
Number Generator
SMU
ETM
Debug Interface
RAM Memory
LDMA
Controller
32.768 kHz
L-F Crystal
Oscillator
32-bit bus
Peripheral Reflex System
Antenna
Chip Antenna
or
U.FL Connector
Radio Transceiver
BUFC
DEMOD
FRC
Serial
Interfaces
USART
I/O Ports
External
Interrupts
General
Purpose I/O
Timers and Triggers
Timer/Counter
Protocol Timer
Analog I/F
ADC
Analog
Comparator
IDAC
Capacitive
Touch
VDAC
BALUN
LNA
I
PGA
IFADC
Matching
RF Frontend
PA
Low Energy
UART
TM
Low Energy
Timer
Low Energy
Sensor Interface
CRC
MOD
Pin Wakeup
RAC
Q
AGC
Frequency
Synthesizer
I
2
C
Pin Reset
Pulse Counter
Real Time
Counter and
Calendar
Watchdog Timer
Cryotimer
Op-Amp
Lowest power mode with peripheral operational:
EM0—Active
EM1—Sleep
EM2—Deep Sleep
EM3—Stop
EM4—Hibernate
EM4—Shutoff
silabs.com
| Building a more connected world.
Rev. 1.1
BGM13P Blue Gecko
Bluetooth
®
Module Data Sheet
Feature List
1. Feature List
Supported Protocols
• Bluetooth 5.0 LE
• Bluetooth Mesh
Wireless System-on-Chip.
• 2.4 GHz radio
• TX power up to +19 dBm
• High Performance 32-bit 38.4 MHz ARM Cortex
®
-M4 with
DSP instruction and floating-point unit for efficient signal
processing
• 512 kB flash program memory
• 64 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
• Integrated DC-DC
High Receiver Performance
• -103.2 dBm sensitivity at 125 kbit/s GFSK
• -98.8 dBm sensitivity at 500 kbit/s GFSK
• -94.8 dBm sensitivity at 1 Mbit/s GFSK
• -91.2 dBm sensitivity at 2 Mbit/s GFSK
Low Energy Consumption
• 9.9 mA RX current
• 8.5 mA TX current at 0 dBm output power
• 87 μA/MHz in Active Mode (EM0)
• 1.4 μA EM2 DeepSleep current (full RAM retention and
RTCC running from LFXO)
• 1.14 μA EM3 Stop current (State/RAM retention)
• Wake on Radio with signal strength detection, preamble
pattern detection, frame detection and timeout
Regulatory Certifications
• FCC
• CE
• IC / ISEDC
• MIC / Telec
Wide Operating Range
• 1.8 V to 3.8 V single power supply
• -40 °C to +85 °C
Dimensions
• 12.9 × 15.0 × 2.2 mm (W × L × H)
Support for Internet Security
• General Purpose CRC
• True Random Number Generator (TRNG)
• 2 × Hardware Cryptographic Accelerators (CRYPTO) for
AES 128/256, SHA-1, SHA-2 (SHA-224 and SHA-256) and
ECC
Wide Selection of MCU Peripherals
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
• 2 × Digital to Analog Converter (VDAC)
• 3 × Operational Amplifier (Opamp)
• Digital to Analog Current Converter (IDAC)
• Low-Energy Sensor Interface (LESENSE)
• Multi-channel Capacitive Sense Interface (CSEN)
• 25 pins connected to analog channels (APORT) shared be-
tween analog peripherals
• 25 General Purpose I/O pins with output state retention and
asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 2 × 16-bit Timer/Counter
• 3 or 4 Compare/Capture/PWM channels
• 1 × 32-bit Timer/Counter
• 3 Compare/Capture/PWM channels
• 32-bit Real Time Counter and Calendar
• 16-bit Low Energy Timer for waveform generation
• 32-bit Ultra Low Energy Timer/Counter for periodic wake-up
from any Energy Mode
• 16-bit Pulse Counter with asynchronous operation
• 2 × Watchdog Timer
• 3 × Universal Synchronous/Asynchronous Receiver/Trans-
mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I
2
S)
• Low Energy UART (LEUART
)
• 2 × I
2
C interface with SMBus support and address recogni-
tion in EM3 Stop
silabs.com
| Building a more connected world.
Rev. 1.1 | 2
BGM13P Blue Gecko
Bluetooth
®
Module Data Sheet
Ordering Information
2. Ordering Information
Table 2.1. Ordering Information
Flash
(kB)
512
512
512
512
512
512
512
512
RAM
(kB)
64
64
64
64
64
64
64
64
Ordering Code
BGM13P32F512GA-V2
BGM13P32F512GA-V2R
BGM13P32F512GE-V2
BGM13P32F512GE-V2R
BGM13P22F512GA-V2
BGM13P22F512GA-V2R
BGM13P22F512GE-V2
BGM13P22F512GE-V2R
Protocol Stack
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Bluetooth LE
Max TX Power
19 dBm
19 dBm
19 dBm
19 dBm
8 dBm
8 dBm
8 dBm
8 dBm
Antenna
Built-in
Built-in
U.FL
U.FL
Built-in
Built-in
U.FL
U.FL
GPIO
25
25
25
25
25
25
25
25
Packaging
Cut Tape
Reel
Cut Tape
Reel
Cut Tape
Reel
Cut Tape
Reel
The maximum FCC-approved TX power for the BGM13P is 19 dBm, and the Bluetooth LE 125k limit is 14 dBm. For CE, Japan, and
Korea the maximum TX power approved is 8 dBm. End-product manufacturers must verify that the module is configured to meet regu-
latory limits for each region in accordance with the formal certification test reports.
Devices ship with the Gecko UART DFU bootloader 1.4.1 + NCP application from Bluetooth SDK 2.7.0.0. The firmware settings con-
form to the diagram shown in
5.1 Network Co-Processor (NCP) Application with UART Host.
silabs.com
| Building a more connected world.
Rev. 1.1 | 3
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Introduction .
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. 7
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7
7
8
8
8
3.2 Radio . . . . . . . . .
3.2.1 Antenna Interface . . .
3.2.2 RFSENSE . . . . . .
3.2.3 Packet and State Trace .
3.2.4 Random Number Generator
3.3 Power . . . . . . . . . . .
3.3.1 Energy Management Unit (EMU)
3.3.2 DC-DC Converter . . . . .
3.3.3 Power Domains . . . . . .
3.5 Clocking . . . . . . . . . .
3.5.1 Clock Management Unit (CMU) .
3.5.2 Internal Oscillators and Crystals .
. 9
. 9
.10
.10
.10
.10
.10
.11
.11
.11
.11
.11
.11
.11
.12
.12
.12
.12
.12
.12
.12
.12
.12
.12
.13
.13
.13
.13
.13
.13
.13
.13
.14
3.4 General Purpose Input/Output (GPIO) .
3.6 Counters/Timers and PWM . . . . . . . . .
3.6.1 Timer/Counter (TIMER) . . . . . . . .
3.6.2 Wide Timer/Counter (WTIMER) . . . . . .
3.6.3 Real Time Counter and Calendar (RTCC) . .
3.6.4 Low Energy Timer (LETIMER) . . . . . .
3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER)
3.6.6 Pulse Counter (PCNT) . . . . . . . . .
3.6.7 Watchdog Timer (WDOG) . . . . . . . .
3.7 Communications and Other Digital Peripherals . . . . . . . . . .
3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) .
3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) .
3.7.3 Inter-Integrated Circuit Interface (I
2
C) . . . . . . . . . . . .
3.7.4 Peripheral Reflex System (PRS) . . . . . . . . . . . . .
3.7.5 Low Energy Sensor Interface (LESENSE) . . . . . . . . . .
3.8 Security Features . . . . . . . . . . . . . .
3.8.1 GPCRC (General Purpose Cyclic Redundancy Check)
3.8.2 Crypto Accelerator (CRYPTO) . . . . . . . .
3.8.3 True Random Number Generator (TRNG) . . . .
3.8.4 Security Management Unit (SMU) . . . . . . .
3.9 Analog. . . . . . . . . . . . . .
3.9.1 Analog Port (APORT) . . . . . . .
3.9.2 Analog Comparator (ACMP) . . . . .
3.9.3 Analog to Digital Converter (ADC) . . .
3.9.4 Capacitive Sense (CSEN) . . . . . .
3.9.5 Digital to Analog Current Converter (IDAC)
silabs.com
| Building a more connected world.
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Rev. 1.1 | 4
3.9.6 Digital to Analog Converter (VDAC)
3.9.7 Operational Amplifiers . . . . .
3.10 Reset Management Unit (RMU) .
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.14
.14
.14
.14
.14
.14
.14
.15
.16
3.11 Core and Memory . . . . . . . . . . . .
3.11.1 Processor Core . . . . . . . . . . . .
3.11.2 Memory System Controller (MSC) . . . . .
3.11.3 Linked Direct Memory Access Controller (LDMA)
3.12 Memory Map .
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3.13 Configuration Summary
4. Electrical Specifications
. . . . . . . . . . . . . . . . . . . . . . . . . . 17
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.17
.18
.19
.20
.21
.24
.24
.25
.26
.29
.31
.32
.33
.34
.36
.39
.42
.44
.46
.49
.49
.50
.53
4.1 Electrical Characteristics . . . . . . . .
4.1.1 Absolute Maximum Ratings . . . . . .
4.1.2 Operating Conditions . . . . . . . .
4.1.3 DC-DC Converter . . . . . . . . .
4.1.4 Current Consumption . . . . . . . .
4.1.5 Wake Up Times . . . . . . . . . .
4.1.6 Brown Out Detector (BOD) . . . . . .
4.1.7 Frequency Synthesizer . . . . . . . .
4.1.8 2.4 GHz RF Transceiver Characteristics . .
4.1.9 Oscillators . . . . . . . . . . . .
4.1.10 Flash Memory Characteristics . . . . .
4.1.11 General-Purpose I/O (GPIO) . . . . .
4.1.12 Voltage Monitor (VMON) . . . . . . .
4.1.13 Analog to Digital Converter (ADC) . . .
4.1.14 Analog Comparator (ACMP) . . . . .
4.1.15 Digital to Analog Converter (VDAC) . . .
4.1.16 Current Digital to Analog Converter (IDAC)
4.1.17 Capacitive Sense (CSEN) . . . . . .
4.1.18 Operational Amplifier (OPAMP) . . . .
4.1.19 Pulse Counter (PCNT) . . . . . . .
4.1.20 Analog Port (APORT) . . . . . . . .
4.1.21 I2C . . . . . . . . . . . . . .
4.1.22 USART SPI . . . . . . . . . . .
5. Typical Connection Diagrams
5.2 SoC Application
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5.1 Network Co-Processor (NCP) Application with UART Host .
6. Layout Guidelines
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6.1 Module Placement and Application PCB Layout Guidelines .
6.2 Effect of Plastic and Metal Materials .
6.4 2D Radiation Pattern Plots .
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6.3 Locating the Module Close to Human Body .
7. Hardware Design Guidelines
7.1 Power Supply Requirements .
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Rev. 1.1 | 5
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参数对比
与BGM13P22F512GE-V2相近的元器件有:BGM13P22F512GE-V2R、BGM13P22F512GA-V2R。描述及对比如下:
型号 BGM13P22F512GE-V2 BGM13P22F512GE-V2R BGM13P22F512GA-V2R
描述 BLUETOOTH 5.0 MODULE BLUETOOTH 5.0 MODULE BLUETOOTH 5.0 MODULE
安装类型 表面贴装 表面贴装 表面贴装
封装/外壳 模块 模块 模块
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调制 GFSK - GFSK
频率 2.4GHz - 2.4GHz
功率 - 输出 8dBm - 8dBm
串行接口 I²C,I²S,SPI,UART - I²C,I²S,SPI,UART
天线类型 集成式,芯片 - 集成式,芯片
使用的 IC/零件 EFR32BG - EFR32BG
存储容量 512kB 闪存,64kB RAM - 512kB 闪存,64kB RAM
电流 - 接收 9.8mA - 9.8mA
电流 - 传输 9.5mA - 9.5mA
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