BGM210P Blue Gecko Bluetooth Module
Data Sheet
The BGM210P is a module designed and built to meet the per-
formance, security, and reliability requirements of line-powered
IoT products for Bluetooth networks.
Based on the EFR32BG21 SoC, it enables Bluetooth
®
Low Energy and Bluetooth Mesh
connectivity while delivering best-in-class RF range and performance, future-proof capa-
bility for feature and OTA firmware updates, enhanced security, low active current con-
sumption, and a temperature rating suited for operating in demanding environmental
conditions.
The BGM210P is a complete solution that comes with robust and fully-upgradeable soft-
ware stacks, world-wide regulatory certifications, advanced development and debugging
tools, and support that will simplify and minimize the development cycle and deployment
of your end-product helping to accelerate its time-to-market.
The BGM210P is targeted for a broad range of applications, including:
• Smart home
• Connected lighting
• Building automation and security
• Factory automation
Core / Memory
ARM Cortex
TM
M33 processor
with DSP extensions,
FPU and TrustZone
KEY FEATURES
• Bluetooth 5.1 and Bluetooth Mesh
connectivity
• Chip antenna and RF pin
• +10 and +20 dBm TX power variants
• -97.0 dBm Bluetooth RX sensitivity at 1
Mbps
• 32-bit ARM Cortex-M33 core at 38.4 MHz
• 1024/96 kB of Flash/RAM memory
• Enhanced security features
• Optimal set of MCU peripherals
• 20 GPIO pins
• -40 to +125
o
C
• 12.9 mm x 15.0 mm x 2.2 mm
Crystal
38.4
MHz
Clock Management
HF Crystal
Oscillator
EM23 HF RC
Oscillator
HF
RC Oscillator
Fast Startup
RC Oscillator
Energy
Management
Voltage
Regulator
Security
Crypto
Acceleration
Secure Debug
True Random
Number Generator
Security Core
Flash Program
Memory
Brown-Out
Detector
Ultra LF RC
Oscillator
LF
RC Oscillator
Power-On
Reset
ETM
Debug Interface
RAM Memory
LDMA
Controller
LF Crystal
Oscillator
32-bit bus
Peripheral Reflex System
Antenna
Chip
Antenna
Matching
Radio Transceiver
RF Frontend
LNA
Serial
Interfaces
BUFC
DEMOD
FRC
USART
I/O Ports
External
Interrupts
General
Purpose I/O
Pin Reset
Timers and Triggers
Timer/Counter
Low Energy
Timer
Protocol Timer
Analog I/F
ADC
Analog
Comparator
I
Q
PGA
IFADC
AGC
CRC
I
2
C
Watchdog Timer
Real Time
Capture Counter
Back-Up Real
Time Counter
RF Pin
PA
PA
Frequency
Synth
MOD
RAC
Pin Wakeup
Lowest power mode with peripheral operational:
EM0—Active
EM1—Sleep
EM2—Deep Sleep
EM3—Stop
EM4—Shutoff
silabs.com
| Building a more connected world.
Rev. 0.5
BGM210P Blue Gecko Bluetooth Module Data Sheet
Features
1. Features
•
Supported Protocols
• Bluetooth 5.1
• Bluetooth Low Energy
• Bluetooth Mesh
• AoA/AoD
•
Wireless System-on-Chip
• 2.4 GHz radio
• TX power up to +20 dBm
• High-performance 32-bit ARM Cortex-M33
®
with DSP in-
struction and floating-point unit for efficient signal process-
ing
• 1024 kB flash program memory
• 96 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
•
Receiver Performance
• -104.5 dBm sensitivity (0.1% BER) at 125 kbps GFSK
• -100.1 dBm sensitivity (0.1% BER) at 500 kbps GFSK
• -97.0 dBm sensitivity (0.1% BER) at 1 Mbps GFSK
• -94.1 dBm sensitivity (0.1% BER) at 2 Mbps GFSK
•
Current Consumption
• 9.3 mA RX current at 1 Mbps GFSK
• 16.1 mA TX current at 0 dBm (BGM210Px22)
• 34.1 mA TX current at 10 dBm (BGM210Px22)
• 173 mA TX current at 20 dBm (BGM210Px32)
• 50.9µA/MHz in Active Mode (EM0)
• 5.1μA EM2 DeepSleep current (RTCC running from LFXO,
Bluetooth Stack not running)
• 8.5μA EM2 DeepSleep current (RTCC running from LFXO,
Bluetooth Stack running)
•
Regulatory Certifications
• CE
• ISED
• FCC
•
Operating Range
• 1.8 to 3.8 V
• -40 to +125 °C
•
Dimensions
• 12.9 mm x 15.0 mm x 2.2 mm
•
Security
• Secure Boot with Root of Trust and Secure Loader (RTSL)
1
• Hardware Cryptographic Acceleration with DPA counter-
measures
1
for AES128/256, SHA-1, SHA-2 (up to 256-bit),
ECC (up to 256-bit), ECDSA, and ECDH
• True Random Number Generator (TRNG) compliant with
NIST SP800-90 and AIS-31
• ARM
®
TrustZone
®
• Secure Debug Interface lock/unlock
•
MCU Peripherals
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
• 20 General Purpose I/O pins with output state retention and
asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 2 × 16-bit Timer/Counter
(3 Compare/Capture/PWM channels)
• 1 × 32-bit Timer/Counter
(3 Compare/Capture/PWM channels)
• 32-bit Real Time Counter
• 24-bit Low Energy Timer for waveform generation
• 2 × Watchdog Timer
• 3 × Universal Synchronous/Asynchronous Receiver/Trans-
mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I
2
S)
• 2 × I
2
C interface with SMBus support
1. With Secure Element (SE) firmware v1.1.2 or newer
silabs.com
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Rev. 0.5 | 2
BGM210P Blue Gecko Bluetooth Module Data Sheet
Ordering Information
2. Ordering Information
Table 2.1. Ordering Information
Flash
(kB)
1024
1024
1024
1024
1024
1024
1024
1024
RAM
(kB)
96
96
96
96
96
96
96
96
Ordering Code
BGM210P022JIA2
1
BGM210P022JIA2R
1
BGM210P032JIA2
1
BGM210P032JIA2R
1
BGM210PA22JIA2
2
BGM210PA22JIA2R
2
BGM210PA32JIA2
2
BGM210PA32JIA2R
2
Protocol Stack
• Bluetooth 5.1
• Bluetooth 5.1
• Bluetooth 5.1
• Bluetooth 5.1
• Bluetooth 5.1
• Bluetooth 5.1
• Bluetooth 5.1
• Bluetooth 5.1
TX Power Freq Band
10 dBm
10 dBm
20 dBm
20 dBm
10 dBm
10 dBm
20 dBm
20 dBm
2.4 GHz
2.4 GHz
2.4 GHz
2.4 GHz
2.4 GHz
2.4 GHz
2.4 GHz
2.4 GHz
Antenna
Chip and
RF pin
Chip and
RF pin
Chip and
RF pin
Chip and
RF pin
Chip and
RF pin
Chip and
RF pin
Chip and
RF pin
Chip and
RF pin
GPIO Temp Range Packaging
20
20
20
20
20
20
20
20
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
-40 to 125 °C
Cut Tape
Reel
Cut Tape
Reel
Cut Tape
Reel
Cut Tape
Reel
1. Engineering sample device
2. Production device
See
4.5 RF Transmitter General Characteristics
for maximum TX power figures.
End-product manufacturers must verify that the module is configured to comply with the regulatory limits for each region, in accordance
with the formal certification test reports for the device.
BGM210P modules are pre-programmed with BGAPI UART DFU bootloader.
Throughout this document, the devices above may be referred to by their product family name (BGM210P), model name
(BGM210P22A / BGM210P32A) or full ordering code.
The
SLWSTK6102A Wireless Gecko Module Starter Kit
is available for BGM210P evaluation and development, as well as
SLWRB4308A
(+20 dBm TX) and
SLWRB4308B
(+10 dBm TX) radio boards.
silabs.com
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Rev. 0.5 | 3
Table of Contents
1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 Block Diagram .
3.3 Antenna .
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. 6
. 6
. 6
. 6
. 7
. 8
. 9
.10
.11
.12
.13
.14
.15
.16
.17
.18
.19
.19
.20
3.2 EFR32BG21 SoC .
3.4 Power Supply .
4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Absolute Maximum Ratings.
4.2 General Operating Conditions .
4.3 MCU Current Consumption at 3.0V .
4.4 Radio Current Consumption at 3.0V .
4.6 RF Receiver General Characteristics
4.5 RF Transmitter General Characteristics
4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps .
4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps .
4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps .
4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps .
4.11 High-Frequency Crystal
4.12 GPIO Pins .
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4.13 Microcontroller Peripherals
4.14 Typical Performance Curves . . . .
4.14.1 Antenna Radiation and Efficiency .
5. Reference Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Network Co-Processor (NCP) Application with UART Host .
5.2 SoC Application
6.1 Module Pinout .
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21
.21
.22
.23
.24
.24
.25
.28
.29
.29
6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.2 Alternate Pin Functions .
6.3 Analog Peripheral Connectivity
6.4 Digital Peripheral Connectivity .
7. Design Guidelines
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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7.1 Layout and Placement .
7.2 Proximity to Other Materials
7.3 Proximity to Human Body .
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Rev. 0.5 | 4
8. Package Specifications
8.1 Dimensions .
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8.2 PCB Land Pattern .
8.3 Package Marking .
. . . . . . . . . . . . . . . . . . . . . . . . . . 30
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.30
.31
.32
9. Soldering Recommendations
10. Tape and Reel
. . . . . . . . . . . . . . . . . . . . . . . . 33
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
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.35
.35
.35
.38
.40
11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
11.1 Qualified Antennas .
11.2 CE
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11.3 FCC .
11.4 ISED Canada .
11.5 Proximity to Human Body .
12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
41
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