BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XKD361
●
Features:
1. Emitted Color: Super Yellow.
2. Lend Appearance: Water Clear.
3. Wide range of collector current.
4. Low cost plastic package
5. This product doesn’t contain restriction
Substance, comply ROHS standard.
●
Package Dimensions:
●
Applications:
1. Smoke Detector
2. Automatic Control System
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3. Specifications are subject to change without notice.
●
Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Collector-Emitter Voltage(Max.)
Emitter-Collector Voltage(Min.)
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Rating
100
30
Unit
mW
V
V
-
-
-
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100
-25℃~80℃
-30℃~85℃
See Page 4
Ver.2.0 Page 1 of 5
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XKD361
●
Electrical and optical characteristics(Ta=25℃)
Parameter
Forward Voltage
Luminous Intensity
Reverse Current
Peak Wave Length
Dominant Wave Length
Spectral Line Half-width
Veiwing Angle
Symbol
Vf
Iv
I
R
λp
λd
Δλ
2θ
1/2
Condition
I
F
=20mA
I
F
=20mA
V
R
=5V
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
Min.
-
94
-
-
582
-
-
Typ.
2.1
200
-
595
15
35
Max.
2.6
-
100
-
592
-
-
Unit
V
mcd
µA
nm
nm
nm
deg
●
Typical Electro-Optical Characteristics Curves
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Ver.2.0 Page 2 of 5
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XKD361
●
Reliability Test
Test Item
Reference Standard
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS C 7021 :B-1
High
Temperature MIL-STD-202:103B
High Humidity JIS C 7021
:B-11
Endurance
Storage
Test
High
MIL-STD-883:1008
Temperature
JIS C 7021 :B-10
Storage
Low
Temperature JIS-C-7021 :B-12
Storage
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS C 7021 :A-4
Thermal Shock MIL-STD-202:107D
Environmental
MIL-STD-750:1051
Test
MIL-STD-883:1011
Solder
MIL-STD-202:201A
Resistance
MIL-STD-750:2031
JIS C 7021 :A-1
Classification
Test Conditions
Connect with a power V
CE
=5V
Ta=Under room temperature
Test time=1,000hrs
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs
High Ta=+85℃±5℃
Test time=1,000hrs
Low Ta=-35℃±5℃
Test time=1,000hrs
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min
60min
20min
Test Time=5cycle
-35℃±5℃ ~ +85℃±5℃
20min
20min
Test Time=10cycle
Preheating：
140℃-160℃,within 2 minutes.
Operation heating：
260℃(Max.), within 10seconds. (Max.)
Result
0/20
0/20
0/20
0/20
0/20
0/20
0/20
●
Judgment criteria of failure for the reliability
Measuring items
Symbol
Measuring conditions
Judgment criteria for failure
Collector Dark Current
I
CEO
V
CE
=20V
Over Ux2
Collector Light Current I
C(ON)
V
CE
= 5V, H=1.0 mW/cm
2,
λp=940nm
Below SX0.5
Note:
1.U means the upper limit of specified characteristics.
2. Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
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S means initial value.
Ver.2.0 Page 3 of 5
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XKD361
●
Soldering :
1. Manual of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
3.
DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
●
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Temperature
140~160℃
260℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
Soldering heat Max. 260
℃
120~150℃
245
±5℃
within 5 sec.
Temperature
Preheat
120~180 sec.
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Time
Ver.2.0 Page 4 of 5
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-XKD361
●
Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
●
Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
●
Package and Label of Products:
(1) Package: Products are packed in one bag of 2000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
BL-Hxxxxx-TRB
Part No.
Quantity
BIN.
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Sealing Date
x
xx
xx
Year Month
Manufacture Location
xx
Day
Ver.2.0 Page 5 of 5
